BEIJING, June 22, 2026 /PRNewswire/ — J-Elephant, a pioneer in vertical pallet robot (VPR) technology, announced that it has received a strategic investment from Geek+, a global leader in warehouse robotics, and entered into a strategic partnership to accelerate the adoption of pallet warehouse automation worldwide. 

The partnership brings together two complementary players in the global smart logistics sector. J-Elephant will tap into Geek+’s established worldwide sales, deployment, and service network to accelerate product deployment and overseas growth. In turn, Geek+ will fold J-Elephant’s VPR technology into its offerings, addressing growing demand for low-infrastructure pallet warehouse automation while strengthening its competitiveness across a broader range of warehouse applications.

I. Growing Demand for low-infrastructure Pallet Warehouse Automation

Pallets are the foundational unit of factory production lines and warehouse logistics. As such, high-density pallet storage automation has become one of the fastest-growing segments in the global smart logistics market. Yet conventional automated high-bay warehouse systems carry prohibitive costs: substantial capital outlays, extended installation periods, and incompatibility with legacy facilities. These hurdles have long kept automation out of reach for the majority of warehouses worldwide. What the market urgently needs is a solution that is infrastructure-light, quick to deploy, and delivers fast ROI—without requiring extensive facility upgrades.

J-Elephant’s proprietary VPR directly addresses these challenges. With reliable storage and retrieval at heights of 4 to 11 meters, ultra-narrow-aisle capability, zone-by-zone deployment without production downtime, and low upfront investment, the company has carved a new path in flexible pallet automation. For Geek+, a veteran with deep global autonomous mobile robot (AMR) market experience, the long-term growth potential of flexible pallet automation has been unmistakable. This partnership reflects the growing demand for flexible, cost-effective pallet warehouse automation solutions worldwide.

II. Ecosystem Synergy: Strengthening the Global Product Foundation

The partnership goes beyond technology sharing—it is a concerted effort to make high-density pallet storage automation more accessible and cost-effective, bridging the gap between large-scale enterprises and small-to-medium manufacturers. At the same time, the collaboration enables J-Elephant to expand its technical capabilities and solution portfolio in three key areas:

1. Open-Architecture Integration
   By optimizing standard communication protocols on an open architecture, the VPR system can now seamlessly integrate with Geek+ and third-party warehouse orchestration platforms. This enables end-to-end coordination across pallet storage, movement, and picking—all within a single unified workflow.
2. Expanded Product Portfolio
   The company continues to push the boundaries of pallet storage height and storage density, while introducing new high-lift, narrow-aisle models designed specifically for international markets. The result is a full product matrix that meets diverse operational requirements across all major global regions.
3. Enhanced Solution Versatility
   J-Elephant has developed standardized, deployable solution packages tailored for greenfield warehouses, brownfield retrofits, and multi-story facilities. These turnkey systems are purpose-built for high-value industries including manufacturing, pharmaceuticals, food and beverage, and renewable energy.

III. Global Expansion: Strengthening Competitiveness in Intelligent Robotics

Through this partnership, J-Elephant gains immediate access to Geek+’s established sales, delivery, and service and support network across more than 40 countries. This accelerates the global deployment of VPR systems with three clear advantages: lower implementation costs, shorter lead times, and greater operational flexibility—directly addressing the digital transformation needs of manufacturing and logistics companies worldwide.

More importantly, this collaboration marks a strategic shift for China’s warehouse automation industry from simply exporting products to exporting an entire ecosystem—strengthening the global position of Chinese intelligent robotics within the broader logistics supply chain.

About Geek+ (Geekplus Technology Co., Ltd.)

Geek+ is a global leader in warehouse robotics, offering a comprehensive portfolio of autonomous mobile robot (AMR) solutions that power intelligent logistics upgrades across industries. With a sales, operations, and service network spanning more than 40 countries, the company serves over 950 blue-chip clients—including Walmart, Toyota, Siemens, and BMW—across retail, e-commerce, apparel, pharmaceuticals, third-party logistics, renewable energy, and automotive. Backed by the industry’s largest commercial deployment footprint, Geek+ is the trusted partner for companies seeking to transform their warehouse operations at scale.

About J-Elephant (J-Elephant Technology Co., Ltd.)

J-Elephant is a pioneer in vertical pallet robot (VPR) technology and a leading provider of flexible pallet warehouse automation solutions. The company is purpose-built around a single mission: making pallet warehouse automation simpler, faster, and more accessible—fundamentally rethinking the traditional automated warehouse model. Its flexible VPR-based solutions eliminate the complexity and capital intensity of legacy systems, enabling customers to deploy high-density pallet storage systems with unprecedented speed and ease.

Already serving multiple Fortune Global 500 companies and industry leaders, J-Elephant has built a strong project delivery track record across pharmaceuticals, food and beverage, clean energy, and semiconductors. With a nationwide deployment network and an expanding international presence, the company is rapidly scaling to meet global demand. 

TAOYUAN, June 22, 2026 /PRNewswire/ — Driven by the rapid expansion of AI infrastructure, demand for Fiber Array Units (FAUs) and other passive optical components is increasing across silicon photonics and co-packaged optics (CPO) applications. As production volumes grow, manufacturers face increasing demands for inspection accuracy and efficiency across components including Fiber Array (FA), V-Grooves (VG), MT ferrules, and MMC ferrules.

To address these challenges, Gen Precision announced the GTK-OSI1 Automated Passive Optical Component Inspection Machine, which integrates AOI, AI-powered image analysis, and high-precision measurement technologies. Featuring Smart-Point Setup and a proprietary Geo-Trajectory Algorithm, the system supports automated, high-efficiency inspection of FAUs and other passive optical components.

Dual-CCD Vision System Enables Micron-Level Measurement Accuracy

Silicon photonics applications require increasingly tighter dimensional tolerances, making inspection accuracy critical to manufacturing yield. The GTK-OSI1 features an 18-megapixel dual-CCD vision system that separates feature recognition and precision measurement into dedicated inspection processes.

The GTK-OSI1 achieves measurement repeatability of up to 3σ ±0.05 μm for Fiber Arrays (FA) and V-Grooves (VG), and 3σ ±0.1 μm for MT and MMC ferrules. Beyond meeting current inspection standards, this product is designed with tomorrow in mind. It scales to support the ultra-high-density measurement needs of next-generation optical communications, such as 6.4T and 12.8T modules, ensuring an equipment investment that delivers immediate value and long-term scalability.

Smart-Point Configuration and Semiconductor-Grade Positioning for High-Volume Inspection

The GTK-OSI1 incorporates semiconductor-grade, three-axis positioning technology and Smart-Point Configuration to automatically locates and measures critical features. Combined with dedicated fixtures, it supports a wide range of passive optical components while minimizing setup requirements across different product types.

Leveraging the proprietary Geo-Trajectory Algorithm, for the GTK-OSI1 can inspect up to 20 MT or MMC ferrules in a single cycle, completing individual hole or groove measurements in less than one second. By integrating automated positioning with this batch inspection, the system enables manufacturers to increase throughput without compromising measurement repeatability.

Developed from practical experience in precision machining, automation equipment development, and passive optical component manufacturing, the GTK-OSI1 integrates measurement accuracy, automated processing, and batch inspection into a standardized machine designed for volume production.

About Gen Precision

Established in 1992 and headquartered in Taoyuan, Taiwan. Gen Precision offers fully integrated in-house capabilities in mold manufacturing, automation system development, and injection molding.

Backed by an ISO 9001–certified quality management system, we deliver key components and integrated automation solutions for semiconductor, optical communications, healthcare, and electronics industries. With long-term global partnerships and customized support, we help customers optimize operations, improve yield, and create lasting value at scale.

Learn more at gentk.com or follow us on LinkedIn.

Lintes Technology’s next-gen AI server near-packaged interconnect solution integrates a co-shared NPC/NPO Socket platform to optimize bandwidth, flexibility, and routing. 

TAIPEI, June 22, 2026 /PRNewswire/ — Lintes Technology (TWSE: 6715), a global leader in high-bandwidth connectivity solutions, today announced the launch of its comprehensive, modular optoelectronic interconnect solution for next-generation AI servers. Addressing the critical bottleneck of high-density data centers, the platform encompasses both Near-Packaged Copper (NPC) and Near-Packaged Optics (NPO) technologies, featuring a shared patented socket architecture.

Unlike conventional hardware designs with fixed interface configurations, this innovative architecture empowers data center operators with infrastructure flexibility. The platform enables direct selection between optical and electronic interfaces within a single system, allowing operators to configure the channel count and bandwidth allocation routed through either NPC or NPO via individual sockets based on actual data throughput requirements. This breakthrough significantly optimizes system routing agility and cost-efficiency for next-generation AI infrastructure.

Bridging the CPO Market Gap

As AI workloads continue to drive demand for higher computing performance, conventional transmission architectures are approaching practical limits in bandwidth, power, and system design. While Co-Packaged Optics (CPO) remains a key area of industry focus, challenges related to optical engine yield, ASIC integration, and cost efficiency are expected to delay large-scale deployment.

In contrast, Lintes’s near-packaged interconnect solutions have already completed design validation and are sampling with customers. This makes the platform a concrete, immediately deployable solution for high-density AI servers, effectively bridging the technological gap as the industry transitions to advanced architectures.

Modular Near-Packaged Interconnect for AI Scalable Bandwidth

To meet the 100T aggregate bandwidth demands of AI chips, Lintes’s near-packaged interconnect solutions utilize a patented socket design that simultaneously supports both NPO and NPC. A single socket delivers a transmission bandwidth of up to 6.4T. Depending on specific server and data center infrastructures, this bandwidth can be flexibly configured as four 1.6T or eight 800G transmission paths, helping customers adapt to high-bandwidth, modular, and scalable AI system requirements.

This flexible architecture supports both transmission modes based on distance, cost, and layout requirements:

• Intra-Server and Intra-Rack Transmission (Scale-up): Operators can deploy NPC to connect with other AI chips or PCIe signal connectors. This can be paired with rack cabling options such as DAC, AEC, AOC, and ACC, leveraging copper’s cost efficiency and deployment maturity to satisfy high-speed interconnect needs within servers and racks.
• Cross-Rack Long-Distance Networking (Scale-out): The system can adopt NPO and be paired with high-density multi-fiber connectors like MPO, MTP, and MMC to meet the demands of cross-rack extensions, data center horizontal scaling, and high-bandwidth optical interconnects.

Through this modular and platform-based design, Lintes enables AI server and data center customers to flexibly implement near-packaged interconnect solutions for varied computing demands, transmission distances, and deployment costs, while minimizing major changes to existing system architectures and cable configurations.

US$84 Million Capital Expenditure Approved to Target 2027 Volume Production

To support this growth, Lintes’s Board of Directors approved an annual capital expenditure budget of up to approximately US$84 million (NT$2.65 billion) on June 11, 2026. This capital will be allocated toward cleanroom renovations for a new manufacturing facility and the procurement of multi-channel, multi-mode, and single-mode optical module production equipment, expanding advanced hardware manufacturing capacities.

With these near-packaged interconnect solutions already sampling with customers, the company aims to align with customer deployment schedules and achieve volume production by 2027, transforming these technological breakthroughs into long-term operational momentum.

About Lintes Technology

Lintes Technology is a leading provider of high-speed interconnect solutions, delivering advanced cables, connectors, and optical modules for data-intensive applications. With deep expertise in signal integrity and system integration, Lintes enables scalable AI connectivity from edge devices to hyperscale data centers supporting reliable, high-bandwidth communication across next-generation infrastructure.

Learn more at lintestech.com or follow us on LinkedIn.

Media Contact
marketing@lintestech.com

New Playbook empowers businesses to take an active role in structuring deals within the $24B blended finance market.

LONDON, June 22, 2026 /PRNewswire/ — The UN Global Compact CFO Coalition for the SDGs today launched Business-Led Blended Finance: A Practical Playbook, the first guidance document written specifically to help real economy companies move from passive recipients of blended finance to active architects of deals that strengthen economic resilience and align with country-led development priorities.

Blended finance, the strategic use of public or philanthropic capital to improve the risk-return profile of investments and unlock private capital in underserved markets, has grown significantly over the past five years, with total annual flows rising from US$14 billion in 2020 to US$24 billion in 2024. Yet nearly all existing blended finance guidance is written for capital providers: governments, development finance institutions (DFIs) and multilateral development banks (MDBs).

Released during London Climate Action Week 2026, Europe’s largest city-wide climate festival, the Playbook addresses a fundamental imbalance in the global blended finance market. Business leaders are key project developers and capital deployers for blended finance but have been left without a roadmap.

The Playbook changes that. Grounded in empirical data from Convergence and in-depth interviews with companies that have successfully structured and executed blended finance transactions, from multinationals to SMEs in emerging markets, it provides real economy players with the practical tools they need to engage with confidence.

Sanda Ojiambo, CEO and Executive Director of the UN Global Compact, commenting at the Playbook’s launch said: “The private sector has a unique and largely untapped role to play in blended finance, but as an architect of deals that drive systemic impact across industries and markets. This Playbook is the operational tool that enables finance leaders to step into that role. At a time when public balance sheets are under pressure and the SDG financing gap stands at $4 trillion annually, we cannot afford to leave corporate leadership on the sidelines. Nor can we afford financing models that are disconnected from country priorities. This Playbook helps align private capital with nationally driven pathways to resilience and growth.”

Mahar Al-Haffar, CFO of Cemex and co-Chair of the Advisory Board for the UN Global Compact CFO Coalition for the SDGs said: “Blended finance can play a critical role in accelerating investment into sustainable infrastructure and industrial decarbonization, particularly in markets where risks and financing costs can otherwise slow progress. But while the opportunity is significant, the structuring process can often be complex and resource-intensive. Clearer, more standardized tools are essential to help companies engage more confidently and efficiently. This Playbook is an important step forward because it helps translate blended finance from a niche financing concept into a practical mechanism that businesses can use to support long-term growth, resilience and sustainability.”

Koushik Chatterjee, Executive Director and CFO of Tata Steel and co-Chair of the Advisory Board for the UN Global Compact CFO Coalition for the SDGs said: “Blended finance has the potential to become one of the most powerful tools in sustainable finance, particularly in supporting capital-intensive decarbonization and transition initiatives. Our experience demonstrates that large-scale industrial transformation is only possible when governments, business and financial institutions work in close partnership to align long-term economic resilience with sustainability objectives. This Playbook is important because it gives companies practical guidance on how to engage earlier, structure transactions more effectively and help shape projects that deliver both commercial viability and measurable impact.”

The Playbook identifies energy and infrastructure as the twin drivers of corporate engagement in blended finance, together accounting for nearly three-quarters of corporate investment activity. It finds that these sectors, under geopolitical pressure on energy security and supply chain resilience, are natural entry points for business-led approaches, as their tangible, long-term assets align with both corporate sustainability commitments and investor mandates.

Case studies range from FCC Construcción, which coordinated 13 organizations across five countries to fast-track digital infrastructure permitting through the EU’s Horizon Europe programme, to Safaricom’s collaboration with other telecoms companies, backed by the International Finance Corporation and Multilateral Investment Guarantee Agency, to expand access in Ethiopia and the partnership between Tata Steel and the UK Government to decarbonize steel manufacturing at Port Talbot.

Beyond case studies, the Playbook includes a Toolkit for Blended Finance Risk Management and Capital Structuring and a Checklist for Navigating Due Diligence & Project Preparation, practical resources that can be utilized by corporate finance and sustainability teams when considering and designing blended finance transactions.

Notes to Editors

About the UN Global Compact

As a special initiative of the United Nations Secretary-General, the UN Global Compact is a call to companies worldwide to align their operations and strategies with Ten Principles in the areas of human rights, labour, environment and anti-corruption. Our vision is clear: to mobilize business to transform sustainability ambition into action at the scale the world demands. With more than 25,000 participants and a presence in over 100 countries through 5 Regional Hubs and more than 70 Country Networks and expansion territories, the UN Global Compact is the world’s largest corporate sustainability initiative.

For more information, follow @globalcompact on social media and visit our website at unglobalcompact.org