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Drata Expands Global Footprint, Bringing AI-Powered Trust Management to the Asia-Pacific Region

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Company appoints new Regional Vice President in Sydney to fuel regional growth

SYDNEY, Oct. 15, 2025 /PRNewswire/ — Drata, the leader in AI-Native Trust Management, today reinforced its commitment to Asia-Pacific (APAC) as a fast-growing hub for governance, risk, compliance, and assurance. Drata has significantly expanded its presence in the region, adding Australia and Asia-based companies as customers, opening a new office in Sydney, Australia, and appointing Daniel Ettenhofer as Regional Vice President of Sales to lead strategic growth initiatives.

Organizations across APAC are navigating some of the most complex regulatory environments in the world. As cybersecurity, privacy, and data sovereignty requirements evolve, trust has become a critical business currency. With more than 8,000 customers across 60+ countries, including one-third of the Forbes Cloud 100, Drata has become the most trusted platform for GRC. The company has also received back-to-back Leadership status in the G2 Asia Pacific Regional Grid Report for Security Compliance.

“With growing regulatory pressures and the need to operate with greater transparency, this is a pivotal moment for GRC in this region,” said Daniel Ettenhofer, Regional Vice President of Sales, APAC, at Drata. “Drata is uniquely positioned to empower organizations with AI-driven GRC programs that ease and accelerate the overall journey. I look forward to working closely with our customers to help them navigate these challenges with confidence.”

With significant expansion of its local team and regional infrastructure, including a new APAC data center launched in Sydney earlier this year, Drata ensures customers meet data sovereignty requirements while strengthening their overall trust posture. This expansion builds on strong customer demand and partnerships in APAC, enabling enterprises and high-growth companies to streamline compliance with more than 25 frameworks—including support for the Essential 8 framework coming soon—automate risk management, and scale trust with customers, partners, and regulators.

“Our expansion into APAC is yet another testament to Drata’s vision of serving as the trust layer between great companies. GRC is a top priority across the globe, and the stakes for continuous assurance will only grow from here,” Adam Markowitz, CEO and Co-Founder of Drata. “As organizations in APAC accelerate digital transformation and AI adoption, Drata is excited to help them meet growing security, compliance, and regulatory expectations with speed, scale, and confidence.”

For more on Drata, sign up for a demo here: drata.com/demo. 

About Drata
Drata is the trust layer between great companies and those they do business with. Thousands of organizations around the globe use Drata to automate governance, risk, and compliance, resulting in a strong security posture, streamlined security reviews, lower costs, and less time spent preparing for annual audits. The company is backed by ICONIQ Growth, Notable Capital, Alkeon Capital, Salesforce Ventures, Cowboy Ventures, S Ventures, Leaders Fund, Okta Ventures, SVCI, SV Angel, Intuit Ventures, and many key industry leaders. For more information, visit drata.com.

Media Contact
Sophia Hatef
press@drata.com 

Alcor Micro to Showcase Latest Arm-based CPU Platform “Mobius100 (CSS V3)” at OCP Global Summit 2025

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SAN JOSE, Calif., Oct. 15, 2025 /PRNewswire/ — Alcor Micro (8054.TWO), a subsidiary of Egis Technology Inc. (6462.TWO), will participate in the Open Compute Project (OCP) Global Summit 2025 held in San Jose, California, to showcase its latest Arm-based CPU platform — Mobius100 (CSS V3). The 8-core emulation platform is purpose-built for Artificial Intelligence (AI) and High-Performance Computing (HPC) servers, demonstrating Alcor Micro’s leadership in open computing innovation and advanced chip architecture.

Collaborative Innovation in the Arm Ecosystem

The on-site demonstration will highlight the collaboration and innovation within the Arm ecosystem. In partnership with Cadence and Jmem Tek, Alcor Micro jointly unveils a revolutionary Digital Twin Design Platform — the Arm CSS V3 8-Core Emulation Platform. This platform redefines the architecture, design flow, and standards of next-generation chip development, accelerating heterogeneous chip integration and system-level innovation. Through deepened collaboration across the Arm ecosystem, the partners are paving the way for a new era of open computing.

Pioneering the Future of CPU Design: Heterogeneous Computing and Chiplet Architecture

Alcor Micro adopts the latest Arm CSS V3 EAC2 architecture, which supports CPU die-to-CPU die interconnect as a computation control hub and enables flexible connectivity with GPUs, NPUs, and various AI accelerator dies for true heterogeneous computing integration. This design enhances overall system performance and scalability, establishing a robust foundation for future AI and HPC applications. Leveraging the power-efficient architecture of Arm CPUs, Alcor Micro achieves outstanding performance-per-watt efficiency, delivering exceptional computational capability within limited power budgets. This optimization meets the growing demands of AI and data center workloads while supporting global goals for energy efficiency and sustainability.

PUF-based PQC Solution for Quantum-Safe and Trusted On-Chip Computing

To further strengthen chip-level security and enable trusted computing, Alcor Micro has collaborated with Jmem Tek to develop a PUF-based PQC (Post-Quantum Cryptography) solution.

The solution has obtained multiple international certifications, including NIST FIPS 140-3 CAVP, FIPS 203 (ML-KEM), and FIPS 204 (ML-DSA), and fully supports the latest ASCON algorithm, compliant with the SP 800-232 standard. With native hardware acceleration and a low-latency architecture, this technology provides high-speed and energy-efficient quantum-safe protection directly at the chip level, effectively defending against emerging quantum decryption threats and enabling secure and trustworthy on-chip computing.

Empowering the Arm Ecosystem through Total Design Collaboration

As a key member of the Arm Total Design Partner network in the Design Service category, Alcor Micro possesses extensive experience in Arm-based CSS CPU platform design and integration.

The newly developed Mobius100 CPU will play a pivotal role within the Arm CSA ecosystem, providing flexible and cost-effective Arm-based CSS CPU chiplet solutions for the AI and HPC server markets.

“AI workloads are pushing the boundaries of what traditional SoC design can deliver, and the industry is under pressure to scale more efficiently,” said Eddie Ramirez, vice president of go-to-market, Infrastructure Business, Arm. “Alcor Micro’s Mobius100 CPU, built on Neoverse CSS and developed through the Arm Total Design ecosystem, shows how a chiplet-based approach can accelerate innovation and time to market.”

By combining Alcor Micro’s advanced packaging design expertise with chiplet-based modular architecture, the Arm-based CSS CPU chiplet achieves high integration flexibility and reusability at the package level, accelerating system-level innovation based on chiplet architecture and fueling the future of open computing.

Event Information

Event: OCP Global Summit 2025
Date: October 13–16, 2025
Location: San Jose Convention Center, California, USA
Exhibit Zone: Innovation Village Zone

Open Compute Project Expands Open Chiplet Economy Ecosystem

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New contributions to OCP include Foundation Chiplet System Architecture (FCSA) and BoW 2.0 for memory-intensive AI and HPC workloads

SAN JOSE, Calif., Oct. 15, 2025 /PRNewswire/ — Open Compute Project Foundation (OCP), the nonprofit international organization bringing at-scale innovations and hyperscale best practices to all, today announced major contributions that expand the OCP Open Chiplet Economy and strengthen industry collaboration around chiplet-based design.

  • An Arm led workstream contributing the Foundation Chiplet System Architecture (FCSA), a vendor-neutral specification derived from Arm Chiplet System Architecture (CSA). FCA establishes a common baseline for partitioning monolithic systems into interoperable Chiplets, enabling use across any processor architecture, including memory, I/O, and accelerators.
  • An Eliyan-led memory interconnect contribution enhancing the OCP Chiplet Interconnect Specification BoW 2.0. to support advanced memory bandwidth requirements for AI, HPC, gaming, and automotive workloads.

“These contributions reflect the momentum of the Open Chiplet Economy, as it is based on a strong foundation of collaboration on open standardizations, tools and best practices,” said Cliff Grossner, Ph.D., Chief Innovation Officer at OCP. “The Foundation Chiplet System Architecture provides a neutral baseline for collaboration, reducing fragmentation and giving the industry confidence in true interoperability. Meanwhile, BoW 2.0 enhancements extend Chiplet adoption into memory-intensive applications. Together they mark an important step toward open, interoperable silicon systems for designing, building and deploying economically viable and dynamic AI Clusters capable of achieving world-leading performance in HPC and AI workloads.”

Foundation Chiplet System Architecture (FCSA)

The Foundation Chiplet System Architecture (FCSA) responds to the industry’s need for open, interoperable foundations to make chiplet design practical at scale. By contributing FCA to OCP and its members, Arm is enabling progress toward a chiplet marketplace that is vendor-neutral. FCA is a baseline for how System-in-Package (SiP) designers can decompose monolithic SoCs into Chiplets, specifying common partitioning approaches that can span processor architectures. This will help the industry maximize the re-use of Chiplets, lead to wider choice of compatible IP blocks, enable common design and validation tooling, and maximize flexibility and choice by avoiding lock-in to proprietary Chiplet standards.

“As AI drives a fundamental shift in how data centers are built, Chiplets are becoming critical to building scalable, efficient infrastructure,” said Mohamed Awad, senior vice president and general manager, Infrastructure Business, Arm. “By contributing the Foundation Chiplet System Architecture to OCP, we’re helping lay the groundwork for an open Chiplet ecosystem that unlocks innovation across the industry and accelerates the path to AI-optimized silicon.”

BoW 2.0 Memory Interconnect Enhancements

With modern GPU architectures including directly attached memory implemented using Chiplets, the need for an open Chiplet Interconnect specification has become an imperative. Eliyan’s contribution extends the OCP Chiplet Interconnect Specification (BoW 2.0) with features designed for high-bandwidth memory applications, including support for dynamic (half-duplex) bidirectional data, allow provisioning of lanes as fixed unidirectional to support command and address information, increase BoW slice width to 18-bits to accommodate two data line error correction bits, and allow for additional options for clock & data alignment needed for memory applications. A target use case is to support the bandwidth of HBM4 (2TB/s read or write) along with overhead bandwidth for ECC and control signals, and fit it in a beachfront of <10mm.

“Eliyan is proud to continue to be a key contributor to the Bunch of Wires (BoW) chiplet interconnect specification, and specifically to lead this important BoW Memory Addendum. With an eye toward chiplet and HBM connectivity across a wide range of applications and use cases, this specification enables the BoW D2D interface to be more efficiently used to directly connect memory devices to ASICs in either standard or advanced packaging. These extensions will further help address the Memory Wall challenge that is restricting performance of all types of AI systems – HPC server, automotive, gaming – and dramatically improve memory bandwidth for XPUs” said Kevin Donnelly, Vice President of Strategic Marketing at Eliyan.

Expanding the Open Chiplet Economy

“We have been experiencing significant growth in participation within the Open Chiplet Economy project, with several workstreams launching this year. This is no surprise as Chiplets are poised to move from an in-house or mostly closed large vendor-led ecosystems to open and standardized ecosystems with advancements driven by collaborations between large and small companies, which is exactly what the OCP is designed to encourage,” said Anu Ramamurthy and Jawad Nasrullah, OCP Open Chiplet Economy Project leads.

The Open Chiplet Economy continues to grow following the launch of the OCP Chiplet Marketplace in 2024, providing a catalogue of Chiplets, design tools, and services. With FCSA and BoW 2.0 enhancements, OCP further enables open, interoperable approaches to chiplet-based design, creating opportunities for companies of all sizes to innovate and collaborate.

“As AI workloads reshape system design, silicon must be flexible and interoperable to scale economically. By contributing this specification to OCP, we are laying the foundation for an open, architecture-neutral chiplet marketplace where vendors can combine solutions with confidence. This accelerates growth, reduces fragmentation, and delivers interoperability at scale.” Daniel Nishball, Director of Research, SemiAnalysis

About the Open Compute Project Foundation

The Open Compute Project (OCP) brings at-scale innovations and hyperscaler best practices to all, spanning technology domains from the data center to the edge, and the technology stack from silicon, to systems, to site facilities and services. The international OCP Community is made up of organizations and people from hyperscale cloud data center operators, communications providers, colocation providers, diverse enterprises, and technology vendors. With the tenets of openness, impact, efficiency, scale and sustainability, the OCP engages and educates thousands of engineers every year. Across many projects and initiatives the OCP Foundation and Community are meeting the market today and shaping the future.

Learn more at: www.opencompute.org.

Media Contact
Dirk Van Slyke
Open Compute Project Foundation
Chief Marketing Officer
dirkv@opencompute.org
Mobile: +1 303-999-7398
(Central Time Zone/CST/Houston, TX)

 

Mabwell Announces Latest Clinical Results of Novel B7-H3-Targeting ADC 7MW3711 to Be Presented at 2025 ESMO Congress

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SHANGHAI, Oct. 15, 2025 /PRNewswire/ — Mabwell (688062.SH), an innovative biopharmaceutical company with entire industry chain, announced that clinical research results of its novel B7-H3-targeting ADC (R&D code: 7MW3711) for multiple advanced solid tumors, will be presented as a poster at the European Society for Medical Oncology (ESMO) Congress 2025.

As of Sep. 15, 2025, 74 patients with advanced solid tumor were enrolled and treated with 7MW3711 in the phase I/II study. Among 54 patients treated at 4.0 mg/kg or above and reaching tumor assessment, 19 partial responses (PRs) or complete responses (CRs) were observed. 7 patients with esophageal cancer (EC) were enrolled at 4.0 mg/kg or above and achieved an objective response rate (ORR) of 42.9% and a disease control rate (DCR) of 100%. Among lung cancer patients treated at the 4.0 mg/kg Q2W and reaching tumor assessment, the ORR for small cell lung cancer (SCLC) and squamous non-small cell lung cancer (Sq-NSCLC) were 50.0% and 38.5% respectively, with DCR of 90.0% and 92.3% respectively.

No dose-limiting toxicities (DLTs) were observed in the dose escalation phase, and the maximum tolerated dose (MTD) has not yet been reached. The most common Grade ≥3 TEAEs were white blood cell (WBC) count decreased, neutrophil count decreased, anemia, lymphocyte count decreased, platelet count decreased.

The study results suggest encouraging efficacy of 7MW3711 in advanced solid tumors, especially in esophageal and lung cancer.

About 7MW3711

7MW3711 is a novel B7-H3-targeting ADC independently developed by Mabwell. Given the expression profile and distribution of B7-H3, ADCs targeting B7-H3 hold promising therapeutic potential for cancers with significant unmet medical needs, including lung cancer, sarcoma, prostate cancer, head and neck cancer, and esophageal carcinoma, indicating broad market prospects.

7MW3711 is pharmaceutical characterized as stable structure, homogeneous composition, high purity, and it is suitable for industrial scale-up. Compared with ADCs in the same class worldwide, 7MW3711 has shown better tumor killing effects in multiple animal tumor models. 7MW3711 utilizes a novel camptothecin payload, which demonstrates stronger antitumor activity than DXd payloads in preclinical studies. Developed with site-specific conjugation technology, 7MW3711 is a homogeneous ADC with a drug-antibody ratio of 4, ensuring optimal stability and batch-to-batch consistency. Its payload is released through tumor tissue protease hydrolysis, further enhancing systemic stability in humans. In the safety evaluation model of animals including cynomolgus monkeys, 7MW3711 demonstrated good safety profile and pharmacokinetic properties.

About Mabwell

Mabwell (688062.SH) is an innovation-driven biopharmaceutical company with capabilities spanning the entire pharmaceutical value chain. The company is committed to providing more effective and accessible therapies to meet global medical needs, with a focus on oncology and aging-related diseases. Mabwell’s mission is “Explore Life, Benefit Health” and its vision is “Innovation, from Ideas to Reality.” For more information, please visit www.mabwell.com/en.

Forward-Looking Statements

This press release contains forward-looking statements including, but not limited to, the potential safety, efficacy, regulatory review or approval and commercial success of our product candidates and those relating to the Company’s product development, clinical studies, clinical and regulatory milestones and timelines, market opportunity, competitive position, possible or assumed future results of operations, business strategies, potential growth opportunities and other statements that are predictive in nature. “Forward-looking statements” are statements that are not historical facts and involve a number of risks and uncertainties, which may cause actual results to be materially different from any future results expressed or implied in the forward-looking statements. These statements may be identified by the use of forward-looking expressions, including, but not limited to, “expect,” “anticipate,” “intend,” “plan,” “believe,” “estimate,” “potential,” “predict,” “project,” “should,” “would,” and similar expressions and the negatives of those terms.

Forward-looking statements are based on the Company’s current expectations and assumptions. Forward-looking statements are subject to a number of risks, uncertainties, and other factors, many of which are beyond the Company’s control, including, but not limited to: environment; politic; economy; society; legislation; our dependence on our product candidates, most of which are still in preclinical or various stages of clinical development; our reliance on third-party vendors, such as contract research organizations and contract manufacturing organizations; the uncertainties inherent in clinical testing; our ability to complete required clinical trials for our product candidates and obtain approval from regulatory authorities for our product candidates; our ability to protect our intellectual property; the loss of any executive officers or key personnel. In case one or more of these risks or uncertainties deteriorate, or any assumptions are incorrect, the actual results may be seriously inconsistent with the stated results.

The Company cautions all the persons not to place undue reliance on any such forward-looking statements, which speaks only as of the date of this press release. The Company disclaims any obligation, except as specifically required by law and the rules of the applicable Stock authority to publicly update or revise any such statements to reflect any change in expectations or in events, conditions, or circumstances on which any such statements may be based, or that may affect the likelihood that actual results will differ from those set forth in the forward-looking statements. All forward-looking descriptions, figures and assumptions in this press release are applicable to this statement.

Scaling Cloud and AI: MSI Highlights ORv3, DC-MHS, and MGX Solutions at 2025 OCP Global Summit

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SAN JOSE, Calif., Oct. 15, 2025 /PRNewswire/ — At 2025 OCP Global Summit (Booth #A55), MSI, a leading global provider of high-performance server solutions, highlights the ORv3 21″ 44OU rack, OCP DC-MHS platforms, and GPU servers built on NVIDIA MGX module architecture, accelerated by the latest NVIDIA Hopper GPUs and NVIDIA RTX PRO 6000 Blackwell Server Edition GPUs. These solutions target hyperscale, colocation, and AI deployments, delivering the scalability and efficiency required for next-gen data centers. On Oct 16, MSI Product Marketing Manager Chris Andrada will also present an Expo Hall session titled “Pioneering the Modern Datacenter with DC-MHS Architecture.”

MSI Scales up Data Centers for Cloud and AI with ORv3, DC-MHS and MGX Solutions
MSI Scales up Data Centers for Cloud and AI with ORv3, DC-MHS and MGX Solutions

“Our focus is on helping datacenter operators bridge the gap between rapidly advancing compute technologies and real-world deployment at scale. By integrating rack-level design with open standards and GPU acceleration, we aim to simplify adoption, reduce complexity, and give the industry a stronger foundation to support the next wave of AI and data-driven applications,” said Danny Hsu, General Manager of MSI’s Enterprise Platform Solutions.

ORv3 Rack-Scale Integration

MSI’s ORv3 21″ 44OU Rack comes fully validated with integrated power, thermal, and networking, reducing engineering effort and deployment time for hyperscale environments. With 16 dual-node servers, centralized 48V power shelves, and all front-facing I/O, operators gain more space for CPUs, memory, and storage while keeping airflow clear for efficient cooling.

The CD281-S4051-X2 2OU 2-node DC-MHS server supports a single AMD EPYC™ 9005 CPU up to 500W TDP per node, each node with 12 DDR5 DIMM slots, 12 front E3.S PCIe 5.0 NVMe drives, and 2 PCIe 5.0 x16 slots for balanced compute, storage, and expansion. This combination provides dense performance for cloud and analytics, delivered in a rack system that can be deployed faster and serviced entirely from the cold aisle.

Standardization with OCP DC-MHS Server & Motherboards

MSI’s DC-MHS portfolio offers standardized server and HPM designs across Intel® Xeon® 6 and AMD EPYC 9005 processors for CSPs and hyperscale data centers. With standardized DC-SCM modules, these platforms reduce firmware effort and enable cross-vendor interoperability. Available in M-FLW, DNO-2, and DNO-4 form factors, they provide a consistent path to deploy next-gen CPUs without redesigning entire systems.

With support for DDR5 high-bandwidth memory, PCIe 5.0 for accelerators and I/O, and front-service NVMe bays, DC-MHS systems include options such as the CX270-S5062 2U Intel Xeon 6 platform or modular HPMs, which let customers align CPU power, memory density, and drive configurations to workload needs, from cloud clusters to hyperscale data centers. Intel HPMs include the D3071 (DNO-2 single-socket, 12 DIMM slots), D3061 (DNO-2 single-socket, 16 DIMM slots), and D3066 (DNO-4 single-socket, 16 DIMM slots). AMD HPMs include the D4051 (DNO-2 single-socket, 12 DIMM slots) and the D4056 (DNO-4 single-socket, 24 DIMM slots for higher capacity).

GPU Density with NVIDIA MGX

Built on the NVIDIA MGX modular architecture, MSI’s GPU servers accelerate AI workloads across training, inference, and simulation with support for the latest NVIDIA Hopper GPUs and NVIDIA RTX PRO 6000 Blackwell Server Edition GPUs.

  • The CG481-S6053 (4U) integrates dual AMD EPYC 9005 CPUs, 8 FHFL PCIe 6.0 GPU slots, 24 DDR5 DIMM slots, and 8×400G Ethernet networking via NVIDIA ConnectX-8 SuperNICs, ideal for large-scale AI training clusters requiring maximum GPU density and bandwidth.
  • The CG290-S3063 (2U) features a single Intel Xeon 6 CPU, 4 FHFL PCIe 5.0 GPU slots, and 16 DDR5 DIMM slots, providing a compact, efficient system optimized for AI inference and fine-tuning in space-sensitive environments.

Supporting Resources:

 

CLO Summit NY 2025 Brings Together 300+ Fashion Industry Trailblazers

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NEW YORK, Oct. 14, 2025 /PRNewswire/ — CLO Virtual Fashion, a global leader in 3D garment visualization, hosted its largest U.S. event to date with CLO Summit New York 2025. The event welcomed over 300 professionals from more than 100 major apparel brands, including Gap Inc., L.L. Bean, New Balance, and Joe Fresh. Attendees also included leading vendors such as AGI Denim, Artistic Milliners, and Aquarelle India, alongside educators from top fashion schools like Parsons School of Design and the Savannah College of Art and Design (SCAD), as well as independent creators and freelancers. 

Panel by CLO, Spirit Halloween, and New Balance at the CLO Summit NY 2025
Panel by CLO, Spirit Halloween, and New Balance at the CLO Summit NY 2025

Centered around the theme “Blueprint for Success,” the summit featured presentations, panels, and workshops focused on practical strategies for 3D adoption. Gap shared its onboarding framework for scaling digital workflows, while a panel of experts from Athleta and L.L. Bean discussed opportunities and challenges in DPC. Design leads from Joe Fresh, Spirit Halloween, and New Balance shared their 3D implementation journey, while vendors joined CLO staff on panels on strengthening supply chain partnerships.

“It’s just really nice to hear what other companies are using CLO for, where their wins are and where they’ve pivoted,” said Paige Regan, 3D CLO Design Manager at Spirit Halloween (Spencer’s Gifts). “I’ve been at my company for about a year and we just started implementing processes, so to hear from people who have been in it for five to seven years, who have actually gone through this, it’s really helpful for our decision-making. I believe in CLO—it’s definitely the future.”

The summit also spotlighted freelancers and academics, reflecting the diversity of CLO’s user base. Educators discussed how they prepare students for careers in the industry, while independent designers shared how CLO has expanded their creative and professional opportunities. In addition, CLO led live demonstrations of new tools including the new zFab Kit and upgraded 3D Pen Tool. Hands-on workshops helped users integrate new features into everyday workflows.

“CLO really cares about its users’ opinions and is open to our feedback, and that’s what makes this relationship and software so successful,” said Katie Beaton, Senior Manager for Technical Design at Joe Fresh. “The amount of updates that come through from feedback is amazing.”

The event concluded with an Expo and Happy Hour, where attendees connected directly with CLO experts, suppliers, and peers while exploring the latest tools in action. Guests also enjoyed interactive activities, including the fan-favorite “CLOw Machine”, the “CLOlympics” competition, and a photo booth that let them step into the role of a CLO avatar.

“We created CLO Summit to be a platform, not for us to talk about us, but for our users to connect, exchange ideas, challenge perspectives, and inspire one another. Together, they’re shaping the future of the apparel industry the right way. By the end of the Summit, it becomes clear: if you’re invested in the future of fashion, this is where you need to be.” said Simon Kim, CEO of CLO Virtual Fashion.

About CLO Virtual Fashion:

CLO Virtual Fashion is the creator of CLO, the leading 3D fashion design software used and trusted by designers, small businesses and titans of the fashion industry to achieve a seamless digital workflow. With over two decades of research and development in accurate garment simulation, CLO Virtual Fashion’s mission is to empower users at every step of the garment journey, from concept to design, manufacturing to marketing, and fitting to styling. In addition to 3D garment design software, CLO Virtual Fashion’s products include CLO-SET (a digital asset management and collaboration platform), CONNECT (a digital fashion hub and marketplace), and consumer-facing solutions such as e-commerce virtual fittings. CLO’s interconnected and ever-growing product ecosystem is built to power the future of everything related to garments.

Empowering Youth Skills Development: Neutech Group and WorldSkills International Cultivate Talent for a Digital Future

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HONG KONG, Oct. 14, 2025 /PRNewswire/ — On October 13, the 2025 WorldSkills General Assembly was held in Croatia. Dr. LIU Jiren, Founder and Chair of Neutech Group, was invited to attend and sign the agreement as a WorldSkills Global Premium Partner, marking that Neutech Group has officially become the first Chinese enterprise to achieve the highest partnership level with WorldSkills.

According to the agreement, the two parties will join hands to promote the innovation of global vocational skill standards, the deepening of talent cultivation, and the enhancement of competition levels. Capitalizing on its core driving force in China’s leading software innovation, artificial intelligence, and big data technologies, and leveraging the opportunity of the WorldSkills Competition 2026 Shanghai, Neutech will provide software and hardware-related technical support for four skills: Software Application Development (formerly IT Software Solutions for Business), Software Testing, Digital Interactive Media Design, and Retail Sales.

Furthermore, Dr. Liu was invited to meet with Mr. Frances Hourant, President of the WorldSkills, and Mr. David Hoey, CEO of WorldSkills. During the talks, the two sides planned to jointly establish a Global Industrial Collaborative Innovation Center. Initiatives will include resource co-development and skills training in cutting-edge industrial technologies in regions such as Africa and Southeast Asia, aiming to bridge skill gaps across different countries and regions and empower the cultivation of top-tier skilled talent that meets the demands of the digital era’s industries.

“Neutech is honored to become a Global Premium Partner of WorldSkills. We will fully leverage the responsibility of a Chinese enterprise to deeply implement the ‘Skills China Action’ plan and advance the strategy of ‘Building a High-Quality Skilled Talent Workforce in the New Era’. Guided by the integrated Education-Healthcare-Eldercare strategy, Neutech will deeply empower education technology. We will work hand-in-hand with global partners to help bridge skill gaps across different countries and regions, provide more youth with opportunities for skills enhancement, and jointly cultivate versatile, highly-skilled talent capable of adapting to and leading the digital future.” said Chair Dr. Liu at the signing ceremony.

He mentioned that Neusoft’s industrial layout has always resonated with societal needs, actively and deeply participating in the construction of China’s digital society. Remarkable achievements have been made in fields such as healthcare, smart automotive connectivity, corporate digital transformation, smart cities, international software services, and artificial intelligence, establishing Neusoft as a leader in digital solutions spanning over 110 countries and regions worldwide. Leveraging Neusoft’s industrial background, Neutech shoulders the social responsibility of cultivating highly skilled talents in the digital era. It has invested in and established three universities, becoming a leader in digital talent education services. In response to the opportunities presented by the silver economy, Neutech proposed an innovative integrated development model of “education, healthcare, and elderly care.” Starting from the concept of “preventing aging through education” and driven by technology, the group promotes the synergistic development of education, healthcare, and wellness industries through initiatives such as urban cloud hospitals and smart elderly care platforms, creating a smart service system for urban wellness and laying a solid industrial foundation for cultivating composite skilled talents.

At the plenary session of the WorldSkills Croatian held on the 14th, Dr. Liu shared his insights on the “Role of Vocational Education and Training in Geostrategic Labor Transformation.”

In the face of educational transformations brought about by artificial intelligence, he believes that educational goals should shift toward cultivating students’ higher-order abilities—such as critical thinking, creativity, and emotional empathy. The role of teachers should transition from lecturers to collaborative guides, and AI literacy education should be integrated into the curriculum. Meanwhile, policymakers should act as “balancers of the educational ecosystem,” promoting sustainable and inclusive development of global vocational education by establishing standards, optimizing resource allocation, and deepening industry-education collaboration.

He emphasized that vocational education must closely align with industrial needs, and the integration of industry and education is the core link connecting talent and industry. As a practical example of enterprises deeply participating in talent cultivation, Neutech not only integrates real corporate demands and cutting-edge technologies into the curricula, practical training, and faculty systems of its three application-oriented universities but also digitizes and productizes its successful experiences, empowering nearly a thousand institutions. Through the co-construction of the “Belt and Road” Digital Industry College and online education platforms, it supports employees in continuously enhancing their skills. He pointed out that enterprises are not only users of talent but should also become participants in talent cultivation and co-builders of the ecosystem. Only through close collaboration between schools and enterprises and the joint development of teaching resources can the gap between industry and education be effectively bridged, unlocking the immense potential of vocational education in the era of technological transformation.

Neutech has repeatedly supported the successful organization of major international and domestic events: in 2024, it successfully supported the IT Software Solutions for Business skill at WorldSkills Lyon; in 2025, as a senior partner of the Third China Skills Competition, it provided technical support for four skills, including IT Software Solutions for Business, Smart Automotive Software Development, Software Testing, and Digital Interactive Media Design, achieving zero-fault operation. In the upcoming WorldSkills Shanghai 2026, Neutech will continue to provide technical support for four competitions: Software Application Development (formerly Business Software Solutions), Software Testing, Digital Interactive Media Design, and Retail Sales. This will fully demonstrate Neutech’s comprehensive capabilities in hosting international skills competitions and providing technical services, contributing to the integrated competition positioning goals of “hosting competitions, participating in competitions, promoting industry, and nurturing talent.”

The conference attracted approximately 400 policymakers, experts, scholars, and industry leaders from around the world to discuss how technology, vocational education, and training can drive the cultivation of skilled talents in an era of rapid change and transformation. WorldSkills International, formerly known as the “International Vocational Skills Training Organization” initiated by Spain and Portugal in 1950, is headquartered in Amsterdam, Netherlands. As of March 2025, it has 89 member countries and regions. As a non-governmental international organization, its core mission is to enhance the vocational skill levels of youth and trainers through collaboration among members. By organizing the “WorldSkills Olympics”—the WorldSkills Competition held every two years—it communicates the value of skills for economic and social development globally and encourages youth to pursue skills-based careers.

Media Enquiries: 

Lin Wei
weilin@neuedu.com 

SEMI Foundation, in Partnership with NSF, Opens National RFP for Regional Nodes to Advance Microelectronics Workforce Development

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Informational Webinar Scheduled for October 16 at 3 p.m. ET to Support Interested Applicants

MILPITAS, Calif., Oct. 14, 2025 /PRNewswire/ — The SEMI Foundation today announced the official opening of the Regional Node Request for Proposals (RFP) for the National Network for Microelectronics Education (NNME), a national initiative funded by the U.S. National Science Foundation (NSF) to accelerate, expand, and improve microelectronics talent development across the United States.

The RFP represents the second step in the NNME’s national rollout, following a successful Letter of Interest (LOI) period that drew nearly 300 letters from organizations across the country: a response that reflects nationwide momentum and shared commitment to building a strong and highly skilled U.S. semiconductor workforce.

Building on that momentum, the RFP marks the next phase in identifying and supporting regional ecosystems that are ready to lead and scale workforce development efforts aligned with the growing talent needs of the industry. The SEMI Foundation serves as the NNME’s Hub Operator, and expects to support up to eight Regional Nodes, each with potential funding of up to $20 million over five years, to establish and share the gold standard for microelectronics education and workforce training across America. The RFP is now available at www.NNME.org. Proposals are due by December 22, 2025, and awards will be announced in early 2026.

“The NNME is a once-in-a-generation opportunity to align education, workforce, and industry in service of one of our nation’s most critical technology sectors,” said Michelle Williams, Executive Director at the SEMI Foundation. “With the RFP now open, we’re building on the incredible response to the LOI process and moving one step closer to creating the regional and national infrastructure that will power America’s semiconductor workforce for decades to come.”

In alignment with the RFP, selected Regional Nodes will:

  1. Design and deliver industry-aligned training programs that integrate cutting-edge technologies and track learner outcomes.
  2. Develop strong regional partnerships among education, workforce, and industry to expand access and opportunity.
  3. Build local workforce pipelines that connect education to high-demand semiconductor careers.
  4. Facilitate work-based learning opportunities such as internships, apprenticeships, and applied learning experiences.
  5. Contribute to shared infrastructure that provides hands-on access to industry-standard tools and facilities.
  6. Lead public outreach and awareness efforts to inspire future talent and strengthen community engagement.
  7. Coordinate and leverage existing initiatives across federal, state, local, and industry partners to ensure national alignment and impact.

 

Each selected Node will serve as a regional innovation hub, leading workforce efforts that align education and industry to create long-term, scalable impact.

“At the heart of the NNME is a simple but transformative idea: that our nation’s competitiveness depends on collaboration,” said Shari Liss, Vice President of Workforce Development and Initiatives at SEMI and the SEMI Foundation. “We’re excited to see how local ecosystems across the country will come together through this process to innovate, share, and drive measurable impact for communities and the industry.”

To support interested applicants, the SEMI Foundation will host an informational webinar on October 16, 2025, at 3 p.m. ET, providing an overview of the RFP, eligibility requirements, and submission guidance.

About the SEMI Foundation 
The SEMI Foundation’s mission is to support economic opportunity for workers and the sustained growth of the microelectronics industry through creating pathways and opportunities for job seekers and tools and systems for semiconductor companies to attract, develop, retain, and advance a diverse and skilled workforce. Visit the SEMI Foundation online to learn more, and follow the SEMI Foundation on LinkedIn.

About SEMI 
SEMI® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.

About the U.S. National Science Foundation (NSF)
The U.S. National Science Foundation (NSF) is an independent federal agency that supports science and engineering across all 50 states and U.S. territories. Established by Congress in 1950, the Foundation’s mission is to promote the progress of science, advance the nation’s health, prosperity, and welfare, and secure the national defense. NSF fulfills this mission primarily by awarding competitive grants to fund research, education, and innovation. Its investments account for roughly 25% of all federal support to U.S. colleges and universities for basic research—work driven by curiosity and discovery—and increasingly, for solutions-oriented research that advances progress and opportunity for the American people.

Association Contacts

Steven Gause/SEMI Foundation
Phone: 929-343-9555
Email: sgause@semi.org

Sherrie Gutierrez/SEMI Corporate
Phone: 1-831-889-3800
Email: sgutierrez@semi.org

Stephanie Quinn/Kiterocket (Media Inquiries)
Phone: 1-480-316-8370
Email: squinn@kiterocket.com

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