• Just Released Systems Incorporate NVIDIA RTX Pro™ and NVIDIA HGX™ B300 GPUs, and NVIDIA GB300 NVL72 complete rack-scale solutions
• Entire AI Portfolio Shipping Worldwide from Manufacturing facilities in the US, the Netherlands, Taiwan, and Malaysia
• New Edge-Optimized Systems Featuring Intel^® Xeon^® 6 SoC processors, NVIDIA Jetson Orin™ NX, and NVIDIA Grace C1

SAN JOSE, Calif. and MADRID, Sept. 22, 2025 /PRNewswire/ — Super Micro Computer, Inc. (SMCI), a Total IT Solution Provider for AI/ML, HPC, Cloud, Storage, and 5G/Edge, announced today several new servers and is showcasing its latest AI-optimized systems at the Supermicro INNOVATE! event in Madrid, Spain. As part of the ongoing expansion of Supermicro’s EMEA engineering, manufacturing, and sales efforts, the INNOVATE! event will allow customers and channel partners to learn about the full range of Supermicro products with ample opportunity to dig deep with product experts. In addition, attendees will have the chance to explore Supermicro’s Data Center Building Block Solutions^®, which will deliver the complete IT infrastructure for the next generation of data centers.

Explore New Supermicro AI Solutions Optimized with the Latest GPUs

“Supermicro INNOVATE! 2025 is where we bring together our European, Middle eastern, and African customers, partners, and the broader technology community to explore state-of-the-art infrastructure technologies and solutions equipped for the future of AI,” said Vik Malyala, Managing Director and President, EMEA, at Supermicro. “This event highlights our commitment to delivering the most advanced, energy-efficient solutions to organizations worldwide to achieve better outcomes.”

Supermicro’s solutions are developed and built in close partnership with AMD, Intel, and NVIDIA. Using Supermicro’s modular approach, many configurations can be quickly assembled to optimize support for a wide variety of workloads, from the edge to the data center. Whether it’s data center AI training or edge inference, Supermicro designs, produces, and delivers solutions that enable rapid AI training and complex inference near data sources. This reduces network congestion, leading to faster decision-making.

The latest Supermicro AI-optimized systems are now available with the newest generation of GPUs from NVIDIA, the NVIDIA HGX™B300 and NVIDIA GB300 NVL72 rack-scale solutions. Many systems are available with liquid cooling, which can reduce data center power consumption by up to 40%.

At the Supermicro INNOVATE! EMEA event in Madrid, Supermicro will show its new AI training servers and the expansion of its edge portfolio with systems optimized for distributed AI workloads, featuring Intel Xeon 6 SoC processors and NVIDIA Jetson Orin NX. These systems are designed to deliver high-performance and power-efficient solutions in environments where energy, cost, and space are key factors. Supermicro is introducing a short-depth 1U system featuring NVIDIA Grace C1, designed to integrate AI into the Radio Access Network (RAN).

For more information, please visit https://www.supermicro.com/en/solutions/dcbbs

Supermicro’s New Edge Systems  

• ARS-111L-FR: A short-depth system powered by NVIDIA Grace C1 CPU with Front I/O, designed for telco cabinets where space and power are at a premium. With up to 2 low-profile GPUs, such as the NVIDIA L4 Tensor Core GPU, and support for NVIDIA ConnectX^®-7, the ARS-111L-FR provides operators with a future-ready, performance-efficient platform capable of delivering both AI and networking services at the edge.
• ARS-E103-JONX: Designed for Edge AI workloads in retail, manufacturing, and other enterprise environments, this compact fanless system, featuring the NVIDIA Jetson Orin NX, is a highly advanced AI computer for edge applications. It provides power-efficient, high-performance data inferencing, capable of delivering up to 157 TOPS for multiple concurrent AI pipelines, combined with high-speed I/O interface options, including 10 Gb Ethernet, 5G, and Wi-Fi integration.
• SYS-212D-64C-FN8P: This 2U, short-depth system features an Intel Xeon 6 SoC processor with 64 cores and integrated Intel vRAN Boost, delivering improved performance-per-watt for high-traffic networking locations in the telecom network. Additionally, the system comes with built-in time sync and GNSS features, as well as 8 built-in 25 GbE ports, and the option to add more through add-on cards.

Product families at Supermicro INNOVATE!

• SuperBlade^® – Flagship green computing solution with maximum performance, higher availability, and lower TCO for stock and option exchanges, AI Inference, Visual Computing, EDA, Data Analytics, HPC, Cloud, and Enterprise workloads. It supports the dual-slot, full-height, full-length GPUs, including NVIDIA RTX Pro 6000 Server Edition. SuperBlade systems are available in either air-cooled or liquid-cooled configurations.
• MicroBlade^® – Highest density and most cost-effective single-socket server solutions for AI Inference, EDA, Hosting, VDI, and Cloud workloads. It also supports the dual-slot, full-height, full-length GPUs, including NVIDIA RTX Pro 6000 Server Edition.
• Edge – High-density processing power in compact form factors optimized for network edge installation. Two new edge systems on display are SYS-112D-42C-FN8P and ARS-E103-JONX, which feature NVIDIA Jetson Orin NX, the most versatile AI computer for edge applications.
• Workstation – Workstation performance and flexibility in a rackmount form factor, offering increased density and security for organizations looking to utilize centralized resources.
• Petascale and Top-loading Storage – Density-maximized storage systems optimized for software-defined data centers, with easy-to-deploy 60 or 90 drive bays.
• 1U and 2U Rackmount Platforms – Flagship-performance Hyper and cloud data center optimized CloudDC supporting up to 4 double-width or 8 single-width GPUs.
• 5U PCIe GPU – Highly flexible, thermally optimized architectures designed to support up to 10 GPUs in a single chassis with air cooling. Key workloads include AI inference and fine-tuning, 3D rendering, simulation, and cloud gaming.

The new systems will be showcased at Supermicro INNOVATE! 2025 and will be available to customers worldwide.

About Super Micro Computer, Inc. 

Supermicro (NASDAQ: SMCI) is a global leader in Application-Optimized Total IT Solutions. Founded and operating in San Jose, California, Supermicro is committed to delivering first-to-market innovation for Enterprise, Cloud, AI, and 5G Telco/Edge IT Infrastructure. We are a Total IT Solutions provider with server, AI, storage, IoT, switch systems, software, and support services. Supermicro’s motherboard, power, and chassis design expertise further enables our development and production, enabling next-generation innovation from cloud to edge for our global customers. Our products are designed and manufactured in-house (in the US, Taiwan region, and the Netherlands), leveraging global operations for scale and efficiency and optimized to improve TCO and reduce environmental impact (Green Computing). The award-winning portfolio of Server Building Block Solutions® allows customers to optimize for their exact workload and application by selecting from a broad family of systems built from our flexible and reusable building blocks that support a comprehensive set of form factors, processors, memory, GPUs, storage, networking, power, and cooling solutions (air-conditioned, free air cooling, or liquid cooling).

Supermicro, Server Building Block Solutions, and We Keep IT Green are trademarks and/or registered trademarks of Super Micro Computer, Inc.

All other brands, names, and trademarks are the property of their respective owners.

New flagship chipset further strengthens industry leadership in gaming, compute, imaging, and AI

HSINCHU, Sept. 22, 2025 /PRNewswire/ — MediaTek, the world’s leading innovator of smartphone SoCs, today announced the launch of its most advanced mobile platform yet: The MediaTek Dimensity 9500. Setting new standards in on-device AI, console-class gaming, and power efficiency, the MediaTek Dimensity 9500 is engineered to super-charge the next wave of flagship 5G smartphones.

The MediaTek Dimensity 9500 adopts a third-generation All Big Core CPU design, combining a 4.21GHz ultra core, three premium cores, and four performance cores, with four-lane UFS 4.1 storage. This design delivers up to 32% higher single-core and 17% higher multi-core performance compared to the previous generation, while the ultra core achieves up to 55% lower power consumption at peak performance, giving users longer battery life and greater productivity. The 9500 is also up to 30% more power efficient while multitasking in games and social audio call apps.

“As AI becomes part of everyday life, consumers want devices that feel smarter, faster, and more personal without sacrificing battery life,” said JC Hsu, corporate senior vice president at MediaTek and general manager of the Wireless Communications Business Unit. “The MediaTek Dimensity 9500 delivers exactly that: Breakthrough on-device AI, top-tier performance and efficiency, and a full suite of premium experiences that our partners can bring to users around the world.”

The platform’s new cache and memory architecture, including the industry’s first support for 4-channel UFS4.1, doubles read/write speeds and accelerates large AI model loading by 40%. The second-generation Dimensity Scheduling Engine translates this raw power into smoother responsiveness and sustained efficiency, even under heavy workloads.

Integrating the Arm G1-Ultra GPU, the MediaTek Dimensity 9500 provides up to 33% higher peak performance and 42% improved power efficiency, and introduces higher frame rate interpolation up to 120FPS raytracing, so gamers can enjoy console-level quality gaming. MediaTek’s collaboration with leading studios, along with support for MegaLights in Unreal Engine 5.6 and Nanite in Unreal Engine 5.5, enable AAA-level real-time rendering and immersive lighting effects.

The MediaTek Dimensity 9500 platform turns the vision of intelligent agent-based user experiences into reality, with proactive, personalized, collaborative, evolving, and secure features. Integrating the ninth-generation MediaTek NPU 990 with Generative AI Engine 2.0 doubles compute power and introduces BitNet 1.58-bit large model processing, reducing power consumption by up to 33%. Doubling its integer and floating-point computing capabilities, users benefit from 100% faster 3 billion parameter LLM output, 128K token long text processing, and the industry’s first 4k ultra-high-definition image generation; all while slashing power consumption at peak performance by 56%.

The Dimensity 9500 is the first to support an integrated compute-in-memory architecture for its newly-added Super Efficient NPU, significantly reducing power consumption and enabling AI models to run continuously. This advancement further enhances end-user experiences with more sophisticated proactive AI.

With MediaTek Imagiq 1190, the MediaTek Dimensity 9500 supports RAW-domain pre-processing, up to 200MP capture, 30fps continuous focus tracking, and new portrait engine, while enabling cinematic 4K 60FPS portrait video. It offers offers the latest MiraVision Adaptive Display technology, which dynamically adjusts contrast and color saturation based on ambient lighting, panel characteristics, and real-time content analysis. This ensures a clear viewing experience both outdoors in high-brightness scenarios — without overheating during prolonged use — and indoors in extremely dark environments, providing eye protection while maintaining clarity.

The platform’s connectivity suite includes Bluetooth call enhancement, Wi-Fi fast transfer, and multi-network intelligence for seamless calls and data. AI-powered communication technologies deliver up to 10% lower power in 5G and 20% lower power in Wi-Fi scenarios, while 5CC carrier aggregation boosts bandwidth by 15%. AI positioning and network selection technologies offer 20% higher accuracy, as well as 50% lower network latency thanks to AI congestion prediction.

As the world’s largest supplier of smartphone SoCs, MediaTek continues to drive industry transformation through innovation and collaboration. The MediaTek Dimensity 9500 is the result of years of investment in advanced technologies, product development, and ecosystem partnerships. MediaTek works closely with leading game studios, device manufacturers, and software partners to deliver the ultimate mobile experiences to consumers worldwide.

Flagship smartphones powered by the MediaTek Dimensity 9500 are expected to arrive in the fourth quarter of 2025. To learn more about the MediaTek Dimensity portfolio, please visit: https://i.mediatek.com/mediatek-5g.

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About MediaTek Inc.

MediaTek (TWSE: 2454) is a global leader in fabless semiconductor design, providing solutions from the edge to the cloud. Powering over 2 billion connected devices every year, MediaTek’s leading-edge technology keeps the world connected and enhances everyday life.  At the forefront of innovation, MediaTek drives advancements in transformative technologies such as AI, 5G/6G, and Wi-Fi 7/Wi-Fi 8. Our high-performance, power-efficient products form the foundation for a smarter, more connected world, enabling devices from smartphones, smart homes and AI PCs to high-performance computing, automotive, and AI data centers. As a trusted partner to the world’s leading brands, MediaTek leads the industry in creating solutions that meet the evolving needs of the global community, ensuring access to world-class technology for everyone. Our commitment to accelerating AI underscores our dedication to enriching the future of humanity. Visit http://www.mediatek.com for more information.

PR Contact: Kevin Keating, pr@mediatek.com

TORTOLA, British Virgin Islands, Sept. 22, 2025 /PRNewswire/ — Worldwide Stablecoin Payment Network (WSPN), a leading stablecoin infrastructure provider with its flagship product stablecoin WUSD, is pleased to announce that WUSD cross-chain bridging is now officially live on Stargate Finance, marking a significant milestone in expanding the accessibility and utility of the WUSD across multiple blockchain networks.

Users can now seamlessly bridge WUSD across supported blockchain networks through Stargate Finance’s proven infrastructure at https://stargate.finance/bridge. This integration leverages LayerZero’s omnichain protocol to enable secure and efficient cross-chain transfers, providing users with enhanced flexibility in managing their WUSD holdings across different ecosystems. The bridging service supports Viction, Ethereum, Polygon and more networks to come, enabling users to access diverse DeFi ecosystems and optimize their transaction costs by choosing the most efficient network for their specific needs.

This milestone reinforces WSPN’s commitment to building comprehensive stablecoin infrastructure that serves the evolving needs of the digital economy. The multi-chain accessibility of WUSD through Stargate Finance opens new possibilities for users, developers, and partners across different blockchain ecosystems, providing stable, reliable, and accessible financial infrastructure that bridges traditional and decentralized finance.

Visit https://stargate.finance/bridge to start bridging your WUSD across supported networks and unlocking new opportunities in the multi-chain ecosystem.

About WSPN

WSPN is a leading provider of next-generation stablecoin infrastructure, dedicated to building a more secure, efficient, and transparent global payment ecosystem. Our flagship stablecoin, WUSD, is fully backed and pegged 1:1 to the U.S. Dollar, serving as the foundation for a suite of integrated financial solutions. These solutions support a range of financial applications from institutional treasury management to programmable payments and decentralized finance. With a strong focus on transparency, regulatory compliance, and user accessibility, WSPN bridges the gap between Web3 innovation and traditional financial systems, driving the global adoption of stablecoins at scale.

Learn more: www.wspn.io | X | LinkedIn