27.3 C
Vientiane
Saturday, June 28, 2025
spot_img
Home Blog Page 237

ERS electronic Opens Demonstration Center in Zhubei to Meet Growing Demand for Panel-Level Packaging in Taiwan

ZHUBEI, May 8, 2025 /PRNewswire/ — ERS electronic, the industry leader of thermal management solutions for semiconductor manufacturing, is excited to announce the opening of its latest demonstration center in Zhubei, Taiwan. This new facility will offer chipmakers and OSATs in Taiwan direct access to ERS’s PhotoThermal debonding machine for wafers and panels, LUM600S1, a strategic move to meet the growing demand for panel-level packaging (PLP) technologies in the region.

Source: Panel Level Packaging 2025 report, Yole Group
Source: Panel Level Packaging 2025 report, Yole Group

Panel-level packaging is rapidly gaining traction in the semiconductor industry due to its cost advantages and process scalability. Dr. Yik Yee Tan, Technology & Market Principal Analyst at Yole Group, predicts that the market will grow from $160 million in 2024 to over $600 million by 2030, driven by cost-efficient solutions in advanced packaging. By 2030, high-density fan-out technology, propelled by Generative AI, is expected to dominate the market, capturing more than 50% of the market share(1). In Chiplet and Heterogeneous Integration demand for larger form factor is driving the growth of PLP in the coming years to meet higher density requirement. For large package size of ~5.5x reticle size limit, PLP can boost carrier area efficiency by more than 80%, compared to just 45% with Wafer Level Packaging (WLP).

In addition to wafer solutions, ERS was among the first to bring PLP equipment to the market, introducing a panel-level debonder in 2018. Today, ERS offers a wide portfolio of semi- and fully-automatic systems, including PhotoThermal debonding machines enabling temporary bonding and debonding (TBDB) processes essential for handling ultra-thin substrates, which is critical for HPC and AI applications, like CoWoS and HBM.

 “With LUM600S1, we are providing a high-yield solution tailored for high-volume manufacturing of complex AI chips. Our Taiwanese customers can now experience firsthand how PhotoThermal Debonding enhances efficiency, scalability, and cost-effectiveness,” says Sébastien Perino, Managing Director of ERS Taiwan.

For more information about the Zhubei demonstration center and LUM600S1’s availability for testing and demonstration, please visit ERS’s website to get in contact with regional sales representatives.

About ERS:

ERS electronic GmbH, based in the Munich suburb of Germering, has been providing innovative thermal management solutions to the semiconductor industry for more than 50 years. The company has gained an outstanding reputation, notably with its fast and accurate air cooling-based thermal chuck systems for wafer probing. In 2008, ERS extended its expertise to the Advanced Packaging market. Today, their fully automatic and manual debonding and warpage adjust systems can be found on the production floors of most semiconductor manufacturers and OSATs worldwide.

(1) Sources: Panel Level Packaging 2025 reportAdvanced Packaging Market Monitor, Yole Group

 

 

 

ERS electronic Opens Demonstration Center in Zhubei to Meet Growing Demand for Panel-Level Packaging in Taiwan

ZHUBEI, Taiwan, May 8, 2025 /PRNewswire/ — ERS electronic, the industry leader of thermal management solutions for semiconductor manufacturing, is excited to announce the opening of its latest demonstration center in Zhubei, Taiwan. This new facility will offer chipmakers and OSATs in Taiwan direct access to ERS’s PhotoThermal debonding machine for wafers and panels, LUM600S1, a strategic move to meet the growing demand for panel-level packaging (PLP) technologies in the region.

Source: Panel Level Packaging 2025 report, Yole Group
Source: Panel Level Packaging 2025 report, Yole Group

Panel-level packaging is rapidly gaining traction in the semiconductor industry due to its cost advantages and process scalability. Dr. Yik Yee Tan, Technology & Market Principal Analyst at Yole Group, predicts that the market will grow from $160 million in 2024 to over $600 million by 2030, driven by cost-efficient solutions in advanced packaging. By 2030, high-density fan-out technology, propelled by Generative AI, is expected to dominate the market, capturing more than 50% of the market share(1). In Chiplet and Heterogeneous Integration demand for larger form factor is driving the growth of PLP in the coming years to meet higher density requirement. For large package size of ~5.5x reticle size limit, PLP can boost carrier area efficiency by more than 80%, compared to just 45% with Wafer Level Packaging (WLP).

In addition to wafer solutions, ERS was among the first to bring PLP equipment to the market, introducing a panel-level debonder in 2018. Today, ERS offers a wide portfolio of semi- and fully-automatic systems, including PhotoThermal debonding machines enabling temporary bonding and debonding (TBDB) processes essential for handling ultra-thin substrates, which is critical for HPC and AI applications, like CoWoS and HBM.

 “With LUM600S1, we are providing a high-yield solution tailored for high-volume manufacturing of complex AI chips. Our Taiwanese customers can now experience firsthand how PhotoThermal Debonding enhances efficiency, scalability, and cost-effectiveness,” says Sébastien Perino, Managing Director of ERS Taiwan.

For more information about the Zhubei demonstration center and LUM600S1’s availability for testing and demonstration, please visit ERS’s website to get in contact with regional sales representatives.

About ERS:

ERS electronic GmbH, based in the Munich suburb of Germering, has been providing innovative thermal management solutions to the semiconductor industry for more than 50 years. The company has gained an outstanding reputation, notably with its fast and accurate air cooling-based thermal chuck systems for wafer probing. In 2008, ERS extended its expertise to the Advanced Packaging market. Today, their fully automatic and manual debonding and warpage adjust systems can be found on the production floors of most semiconductor manufacturers and OSATs worldwide.

(1) Sources: Panel Level Packaging 2025 reportAdvanced Packaging Market Monitor, Yole Group

Photo – https://laotiantimes.com/wp-content/uploads/2025/05/panel_level_packaging-2.jpg
Logo – https://laotiantimes.com/wp-content/uploads/2025/05/ers_logo-2.jpg

 

 

THE ADECCO GROUP Q1 2025 RESULTS

Strong execution driving market share gains with solid margins

ZURICH, May 8, 2025 /PRNewswire/ — HIGHLIGHTS

  • Revenues -2% yoy, +3% qoq; Outperforming markets, Adecco’s relative revenue growth strong, +130 bps
  • By GBU, Adecco, -1% yoy, led by APAC +11% and Americas +4%; Akkodis -8%, with Consulting -5%; LHH -5%
  • Healthy 19.4% gross margin, -40 bps yoy, reflecting current business mix, firm pricing
  • 2.4% EBITA margin excl. one-offs, -40 bps yoy, reflecting agile capacity management, good cost discipline and favourable timing of FESCO JV income
  • Operating income €111 million, -11% yoy, constant currency; Net income €60 million, -19% yoy
  • Basic EPS €0.36; Adjusted EPS €0.48
  • Strong LTM cash conversion 105%. Operating cash flow -€144 million, mainly reflecting working capital absorption for growth, and in line with normal seasonality

Denis Machuel, Adecco Group CEO, commented:

“The consistent, rigorous execution of our strategy continues to pay off. In the first quarter, we gained market share with solid margin performance. We will meet our commitments, navigating increased macroeconomic uncertainty from shifting trade policy with strong cost discipline, securing G&A savings and through the agile management of sales and delivery capacity. We are firmly addressing areas of underperformance and have good traction in the turnaround of Adecco US. We are well positioned to gain further market share through AI-driven innovation and customer proximity in the quarters to come.”

Full Press Release

Webcast Details | Investors & Analysts

Media contact: media@adeccogroup.com 

 

Haier Launches New 4K Mini-LED TV M80 Series Globally, Featuring KEF Co-engineered Audio

QINGDAO, China, May 8, 2025 /PRNewswire/ — Haier, a world’s leading household appliances brand, is thrilled to introduce its latest television series: the M80 series of 4K Mini-LED TVs. Co-engineered with KEF, the world-renowned audio technology brand, the M80 series is designed to deliver next-level home entertainment experience to consumers worldwide.

Haier TV M80 series, 4K Mini LED, Audio Co-engineered with KEF
Haier TV M80 series, 4K Mini LED, Audio Co-engineered with KEF

The Haier M80 series TV is poised to elevate home entertainment with its state-of-the-art 4K Mini-LED display. This innovative technology offers brighter images and deeper contrast compared to traditional LCD TVs, while offering a more affordable option for large screens when compared to OLED TVs. Additionally, the M80 series supports HDR10 and Dolby Vision for superior visual quality and holds TÜV certification for Low Blue Light emissions, protecting viewers’ eye health during extended viewing hours.

Haier TV M80 series, 4K Mini LED, Audio Co-engineered with KEF
Haier TV M80 series, 4K Mini LED, Audio Co-engineered with KEF

In collaboration with KEF, a globally renowned HiFi audio brand with over 60 years of expertise in acoustic technology, the Haier M80 series delivers unparalleled audio experience. Thanks to KEF’s meticulous tuning, the TV ensures clear highs, rich mids, and deep, elastic bass, delivered through its 2.1 channel speaker system comprising two main speakers and a dedicated subwoofer. Enhanced with audio technologies such as Dolby Atmos and dbx-tv, the M80 series serves as a home music hub, offering users a harmonious and magical audio experience.

Designed with gaming enthusiasts in mind, the Haier M80 series offers a host of features to enhance gameplay. With a dedicated Game Mode, gamers can select from five picture modes tailored to different game genres: Standard, FPS, RTS, RPG, and RAC. Features such as Shadow Enhancement, which increases brightness in darker areas, and a Cross Hair function for first-person shooters, elevate the gaming experience. The TV also offers various game settings, including Game Mode (LLM), ALLM, refresh rate adjustments, and speaker delay, together ensuring ultra-smooth gameplay. The M80 series supports HDMI 2.1, enabling Dynamic HDR, VRR, ALLM, eARC, and 4K@60Hz, providing a truly immersive gaming journey for users.

Empowered by Google TV and HAICAST, the M80 series offers a seamless smart TV experience at home. HAICAST allows high-quality streaming from mobile devices, supporting HD and 4K Ultra HD movies, versatile media sharing like photos, and enhanced gaming experience. Available in four sizes—55, 65, 75, and 85 inches—the M80 series caters to diverse consumer preferences and room sizes, from dynamic living spaces to cozy bedrooms.

The Haier M80 series 4K Mini-LED TV is a powerful and versatile smart TV designed to meet the diverse needs of modern users. Boasting its leading-edge Mini-LED display technology, KEF audio enhancements, and dedicated gaming optimizations, the Haier M80 TV stands out as an ideal choice for consumers seeking a reliable, feature-rich, and top-quality smart TV that elevates their home entertainment and brings a touch of magic to their everyday life.

Jia He Presents an Exquisite Selection of Zongzi Rice Dumplings for the Dragon Boat Festival

Jia He https://jiahe.com.sg 

SINGAPORE, May 8, 2025 /PRNewswire/ — In commemoration of the Dragon Boat Festival, Jia He Chinese Restaurant and Jia He Grand are pleased to announce a refined collection of handcrafted zongzi, available for purchase from 1 May 2025 to 31 May 2025. These meticulously prepared rice dumplings represent a cherished culinary tradition and serve as discerning gifts for the festive occasion.

The curated menu offers a diverse array of options to cater to varied palates. Notable selections include the Signature X.O. Roasted Meat Dumpling, a substantial offering encompassing premium ingredients such as Chinese sausage, preserved meats, baby abalone, roasted pork, roasted duck, salted egg yolk, chestnut, lotus seeds, dried shrimp, and green bean, priced at SGD 35.75 nett. The classic Traditional Roast Meat Dumpling, featuring roasted pork, roasted duck, salted egg yolk, chestnut, lotus seeds, dried shrimp, and green bean, is available at SGD 24.85 nett.

For those preferring lighter alternatives, the Alkaline Rice Dumpling with Red Bean Paste is offered at SGD 6.32 nett. The aesthetically distinctive Butterfly Blue Pea Flower Nonya Minced Meat Dumpling and the Hokkien Salted Egg Yolk Dumpling are priced at SGD 9.70 nett and SGD 10.68 nett respectively. Vegetarian diners may appreciate the Vegetarian Butterfly Blue Pea Flower Nonya Dumpling available at SGD 9.70 nett.

To facilitate the sampling of multiple varieties, Jia He presents exclusive combination sets. Combo Set A (8 pieces) is offered at a special price of SGD 75.21 nett (Usual Price: SGD 87.96 nett) and comprises one Traditional Roast Meat Dumpling, two Alkaline Rice Dumplings with Red Bean Paste, two Butterfly Blue Pea Flower Nonya Minced Meat Dumplings, two Hokkien Salted Egg Yolk Dumplings, and one Vegetarian Butterfly Blue Pea Flower Nonya Dumpling. Combo Set B (8 pieces), priced at SGD 95.92 nett (Usual Price: SGD 112.05 nett), includes one Signature X.O Roasted Meat Dumpling, one Traditional Roast Meat Dumpling, two Alkaline Rice Dumplings with Red Bean Paste, two Butterfly Blue Pea Flower Nonya Minced Meat Dumplings, and two Vegetarian Butterfly Blue Pea Flower Nonya Dumplings.

Diners who place a minimum order of four rice dumplings zongzi will be entitled to a 10% early bird discount (with terms and conditions) from 1 May to 23 May 2025. This promotion is applicable to individual rice dumplings zongzi and will be automatically applied upon the addition of four or more items to the order.

Orders can be conveniently placed via the online platform at https://shop.jiahe.com.sg or at Jia He. Standard terms and conditions apply.

Jia He C h i n e s e Restaurant @ Connexion
For reservations, please contact 6694 8988 / 6694 9466
Email: enquiries@jiahe.com.sg
1 Farrer Park Station Road, #01-14/15/16 Connexion, Singapore 217562

J i a He Grand @ One Farrer Hotel
For Reservations, please contact 6538 9688 / 6538 2788
Email: jiahegrand@jiahe.com.sg
One Farrer Hotel, Level 1 #01-01
1 Farrer Park Station Rd, Singapore 217562

For enquiries:

#JiaHeChineseRestaurant #JiaHeRestaurant #JiaHeGrand #JiaHeRiceDumplingFestival
#JiaHeRestaurantRiceDumplingFestival

==

For media enquiries, please contact:
Ms Sharon Vu
Vu Marcoms, engagevu Mobile (65) 8138 6913
https://www.vumarcoms.com , https://www.engagevu.com
Email: sharonvu@engagevusg.com

Kubix and D3 Labs Announce Strategic Collaboration to Explore Global Access for Thai Investment Tokens

BANGKOK, May 8, 2025 /PRNewswire/ — Kubix Digital Asset, Thailand’s leading ICO portal under the Orbix Holdings, has entered into a strategic collaboration with D3 Labs, a leading Web3 infrastructure provider in Asia. The collaboration was officially announced at Money 20/20 Asia in Bangkok. This partnership aims to create a bridge between Thai digital token projects and global investors, focusing on cross-border accessibility, regulatory readiness, and technological scalability.

Partomchai Tangnoi, Managing Director of Kubix (left), and Lai Chung Ying, Co-Founder & Co-CEO of D3 Labs (right), during the official signing ceremony held in Bangkok, Thailand.
Partomchai Tangnoi, Managing Director of Kubix (left), and Lai Chung Ying, Co-Founder & Co-CEO of D3 Labs (right), during the official signing ceremony held in Bangkok, Thailand.

As Thailand’s digital token ecosystem continues to evolve with growing regulatory clarity and market maturity, Kubix and D3 Labs share a common vision: to unlock the full potential of tokenized fundraising, expand access to a wider variety of real-world asset investments for Web3 investors, and elevate Thai digital token products to the global stage.

Kubix: Bridging Thai Digital Tokens to the World

Kubix has played a pioneering role in Thailand’s digital asset ecosystem. With strong regulatory foundations now in place, Kubix is entering a new chapter: enabling Thai issuers to expand globally.

  • Cross-Border Pathways: The partnership with D3 Labs enables Thai issuers to access a broader investor base through compliant, borderless infrastructure.
  • Diverse Deal Expansion: Future-ready projects—such as alternative investments, innovation-based ventures, and commodity-linked tokens—are central to Kubix’s roadmap.
  • Regulatory Tailwinds: The recent revision by the SEC to Thailand’s digital asset criteria—allowing USDC and USDT to be used in ICO transactions and trading—highlights the country’s regulatory openness and strengthens the global viability of Thai-issued digital assets.

“We’re seeing growing demand from Thai issuers to scale beyond the local market,” said Partomchai Tangnoi, Managing Director of Kubix. “This partnership with D3 Labs is a key step toward building global bridges for our ecosystem and creating real impact for issuers and investors.”

D3 Labs: Unlocking Scalable Infrastructure for Cross-Border Tokenization

D3 Labs is building the foundational Web3 infrastructure that enables asset tokenization at scale, with compliance and interoperability at its core. As the Southeast Asian region advances its regulatory frameworks, D3 Labs is committed to empowering forward-thinking platforms like Kubix through enterprise-grade, cross-border, blockchain-agnostic, and regulator-aligned solutions.

The collaboration with Kubix reflects D3 Labs’ vision of unlocking the full potential of tokenized capital markets across Asia, starting with Thailand’s rapidly maturing ecosystem and expanding to new global investor bases.

Lai Chung Ying, Co-Founder and Co-CEO of D3 Labs, added, “This partnership with Kubix is not just a technical integration—it’s a strategic alignment of values. Together, we’re laying the infrastructure for compliant, borderless fundraising and helping to redefine how investment products can be accessed and distributed in the Web3 economy.”

Driving the Future of Global Tokenization

The collaboration marks a significant step toward making Thai digital tokens accessible beyond domestic borders. Combining Kubix’s leadership in approved and regulated ICO portals with D3 Labs’ global Web3 infrastructure, both parties share a common goal: to open new doors for cross-border fundraising, unlock fresh opportunities for investors, and drive the growth of the asset tokenization market in Southeast Asia and beyond.

About Kubix:

Kubix Digital Asset Co., Ltd., a subsidiary of Orbix Holdings under KASIKORNBANK Financial Conglomerate KASIKORNBANK operates as a licensed ICO portal in Thailand, facilitating capital raising through digital tokens and providing access to innovative investment opportunities. Learn more at: https://www.kubix.co

About D3 Labs:

D3 Labs, founded in September 2022, is a leading Asia-based Web3 infrastructure provider that delivers enterprise-grade Distributed Ledger Technology (DLT) solutions. Focused on empowering financial institutions and digital asset ecosystems, D3 Labs enhances operational efficiency, strengthens security, and increases the transparency and liquidity of tokenized assets. Learn more at: https://www.d3labs.io

ONERugged Debuts the Industry’s First Rugged AI-enabled PCs

SHENZHEN, China, May 8, 2025 /PRNewswire/ — Is your current device truly ready for the AI-driven future? ONERugged has introduced a new generation of industrial AI PCs — Rugged AI Notebooks EM-X14M, EM-X15M, and Rugged AI Tablet EM-I14M. Designed for industries such as utilities, public safety, manufacturing, and automotive, these devices combine powerful on-device edge AI performance with industrial-grade durability. They help organizations accelerate digital transformation while enhancing security, efficiency, and operational resilience at the edge.


Driving Industrial Progress with Next-Gen Rugged AI PCs

As a pioneer in rugged computing, ONERugged is among the first[1] to integrate Intel® Core™ Ultra processors into rugged PCs, combining the latest advancements in CPU, GPU, and NPU technologies. With up to 32 TOPS of hybrid AI computing power, ONERugged industrial AI PCs enable users to deploy large language models and corporate knowledge bases directly on the device. This local AI processing capability enhances responsiveness, strengthens data security, and reduces reliance on constant cloud connectivity.

Rugged AI Notebooks and Tablets with Next-Level Graphics for Industrial AI Workloads

Built to meet the demands of AI-driven workloads, ONERugged AI PCs are equipped with Intel® Arc™ graphics. Powered by the Xe LPG architecture and up to 8 Xe cores, they support DX12 Ultimate, ray tracing, XeSS supersampling, and AV1 codec technologies. This discrete-level graphics performance allows for smooth 3D rendering, real-time AI image processing, and stable high-definition video playback, even in challenging outdoor environments.

Ruggedized Tablets and Laptops Designed for the Harshest Environments, Engineered for Total Security

Uncompromising Ruggedness: The rugged AI notebooks and AI tablets redefine durability across industries. Each device is tested and certified to MIL-STD-810H and IP65 standards, ensuring resistance to dust, water, shocks, and vibration. Constructed from robust ABS+PC materials, they deliver 3.94 ft (1.2 m) drop resistance and maintain stable operation across wide temperature ranges from -20°C to 60°C — making them the ideal choice for extreme field environments.

Professional Expandability: ONERugged devices are equipped with Thunderbolt 4 Type-C ports, delivering data transfer speeds of up to 40Gbps for ultra-fast connections to external storage, displays, and peripherals. In addition, a comprehensive selection of ports — including HDMI 2.0, three USB-A, two RJ45 Gigabit Ethernet, RS232, a 3.5mm audio jack, and a DC power port — ensures flexible expansion and seamless device integration, empowering users to stay connected and productive anywhere.

Built-In Privacy and Enterprise-Grade Security: With powerful on-device AI capabilities, ONERugged AI PCs minimize the need for cloud data uploads, protecting sensitive information by keeping operations local. To further enhance security, the devices feature enterprise-grade safeguards such as fingerprint authentication, a RF switch, and physical privacy shutters for camera, and encrypted card expansion options. These measures ensure that critical data and user privacy are protected against emerging threats.

Empowering Industries with Rugged Edge AI Performance and Industrial-Grade Reliability

ONERugged AI notebooks and tablets are designed to drive innovation across a wide range of industries.

In smart manufacturing, ruggedized notebooks and tablets enable AI-powered quality inspection, machine control, and predictive maintenance, eliminating the need for high-performance desktops and large-scale distributed systems.

In the automotive sector, rugged notebooks and tablets support diagnostic software and sensor data analysis, helping to identify issues remotely and reduce maintenance costs.

For outdoor surveying, ONERugged AI terminals facilitate mobile data collection and real-time AI map analysis, streamlining city planning and road optimization tasks.

In public safety and sensitive industries, on-device AI processing ensures data remains local, greatly enhancing security without relying on cloud connectivity.

With superior durability and powerful AI capabilities, ONERugged devices deliver reliable performance wherever it’s needed most.

Real-World Application: Rugged AI Notebooks Boost Smart Manufacturing Efficiency

A leading electronics company encountered significant challenges during the factory’s digital transformation. Traditional manual inspections were slow and prone to errors, especially when assembling and verifying tiny, high-precision components. As production volumes increased, conventional methods struggled to meet the company’s stringent quality and efficiency standards.

To address this, the company adopted AI-powered Automated Optical Inspection (AOI) systems, deploying the ONERugged EM-X14M rugged AI laptop to run AI-driven inspection models directly on the production line. Leveraging the notebook’s powerful on-device AI computing capabilities and rugged durability, the system automates appearance and functionality checks with high precision. The results were transformative: inspection speed increased severalfold, detection time was reduced to just a few seconds per unit, and human error rates dropped significantly, ensuring consistent, high-quality production output.

The rugged AI PCs are available now. For more information, visit www.onerugged.com

About ONERugged:

ONERugged, a brand of Emdoor Information Co., Ltd. (SZSE: 001314), is a leading provider of rugged computing solutions for enterprise users worldwide. Focused on durability, performance, and versatility, ONERugged designs products that can withstand the harshest environments and deliver reliable performance across a wide range of industries. Today, ONERugged serves clients in over 80 countries and regions, supporting sectors such as public safety, manufacturing, agriculture, automotive, and warehousing logistics.

For more information, visit www.onerugged.com. Follow us on LinkedIn, YouTube, and Facebook.

Contact:
ONERugged
inquiry@onerugged.com
+86 400-830-4882

[1] As of April 29, 2025, and to the best of our knowledge, the EM-X14M, EM-X15M, and EM-I14M are the first rugged AI PCs equipped with the latest Intel Core Ultra processor.

 

Osstem, the World’s No. 1 in Implant Sales Volume, Pioneers India’s future of implantology with High-quality products and Clinical trainings

SEOUL, South Korea, May 8, 2025 /PRNewswire/ — Osstem Implant, a global leader in dental implant solutions, has been officially recognized as the world’s No.1 dental implant brand in terms of sales volume (According to the innovation research and support centre for dental science at Seoul National University Dental Hospital), driven by its unwavering commitment to research & development and comprehensive clinical training for dental professionals.

Founded by former dentist Choi Kyu-ok, Osstem Implant has rapidly expanded its influence across the globe through its investment in large-scale R&D initiatives. Today, more than 800 researchers at 20 research institutes specialize in developing advanced dental materials and equipment, including implants, contributing to Osstem’s position as the industry’s front-runner.

Since 2000, Osstem has also pioneered clinical implant training for dentists, establishing one of the world’s most robust education systems in the field. Over 120,000 dentists worldwide have completed Osstem’s programs, which have played a key role in the popularization and standardization of implant procedures, especially in South Korea.

With over 3,000 products across five implant designs and four surface technologies, Osstem’s product portfolio supports precise, personalized treatments for a wide range of clinical scenarios. Released in 2012, CA implant, which has been loved worldwide, significantly shortens recovery times using proprietary surface technology. So, even elderly patients or those with low bone density can quickly recover their daily lives after surgery.

In 2024, Osstem recorded global sales of USD 880 million, reflecting a robust 11.8% annual growth rate over the past three years. The company operates in 32 international markets through local subsidiaries, with plans to continue expanding its direct sales system and strengthen its global footprint.

Strong Growth in India

Osstem Implant entered the Indian market in 2006 and has since become the country’s top-selling implant brand, achieving about 225 Crores in sales of FY 2024-25. The company attributes its success to a dual focus on product quality and trusted clinical education for Indian dentists.

“While supplying high-quality implants to the Indian market, we are focusing on building trust from dentists through clinical education,” said an Osstem spokesperson. “We will become a brand loved by both patients and dentists in India.”

Looking ahead, Osstem aims to become the world’s No.1 dental company across all segments by 2036, with a sales target of USD 6.74 billion.

(The photos at the left) Indian dentists are participating in theoretical education and practice courses in Master Course of Osstem Implant. (The photos at the right) Consultations are taking place at the Osstem booth at a Dental Exhibition in India.
(The photos at the left) Indian dentists are participating in theoretical education and practice courses in Master Course of Osstem Implant. (The photos at the right) Consultations are taking place at the Osstem booth at a Dental Exhibition in India.

Photo – https://laotiantimes.com/wp-content/uploads/2025/05/the_photos_left__indian_dentists_participating_theoretical_education_practice_courses.jpg