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Hong Kong FinTech Week x StartmeupHK Festival 2025: United for decade of innovation and scaling


HONG KONG SAR – Media OutReach Newswire – 18 November 2025 – The ​Hong Kong FinTech Week x StartmeupHK Festival (HKFW x SMUF) 2025 concluded November 7, following a dynamic week of activities that began with a two-day main conference held November 3 and 4. The event brought together government officials, regulators, innovators, and industry leaders from around the world for a series of panels, keynote speeches, and strategic discussions. The joint celebration of two flagship events reaffirms Hong Kong’s commitment to advancing the digital economy.

The entire week attracted a record high of over 45 000 visitors from over 120 economies and featured over 1 000 distinguished speakers, over 800 exhibitors and more than 30 Chinese Mainland and international delegations. The event was organised by the Financial Services and the Treasury Bureau, the Commerce and Economic Development Bureau and Invest Hong Kong (InvestHK), in collaboration with the Hong Kong Monetary Authority (HKMA), the Securities and Futures Commission (SFC), and the Insurance Authority (IA), and the appointed event organiser, Finoverse.

Celebrating a decade of excellence

As the inaugural convergence of the two flagship events, the Chief Executive, Mr John Lee, officiated at the opening of the main conference. The main conference showcased 11 themed forums. These included the Policy Forum, Visionary Forum, InsurTech Forum, HealthTech Forum, Wealth & Investment Management Forum, Digital Finance Forum, Digital Assets Forum, Blockchain & Web3 Forum, AI & Advanced Tech Forum, China-Global Innovation Forum, and TechX Forum.

Deputy Governor of the People’s Bank of China, Mr Lu Lei, attended the main conference and highlighted the fintech collaboration between the Chinese Mainland and Hong Kong, which has driven advancements such as interoperable cross-boundary payments and e-CNY use cases, unlocking new efficiencies. He emphasised the importance of payment innovation promoting connectivity and fostering integrated economic development between the Chinese Mainland and Hong Kong. This comes as China charts its 15th Five-Year Plan and reaffirms Hong Kong’s role as an international financial centre.

Mr Lu noted the continuous expansion of the RMB Cross-border Interbank Payment System (CIPS) in Hong Kong, including the launch of Hong Kong dollar clearing services as well as southbound and northbound fund settlement functions under Bond Connect.

The Financial Secretary, Mr Paul Chan, delivered a keynote address and participated in a panel discussion moderated by the Director-General of Investment Promotion of InvestHK, Ms Alpha Lau. Joining Mr Chan on the panel were the Group Chief Executive of HSBC, Mr Georges Elhedery, and the Group Chief Executive of Standard Chartered, Mr Bill Winters. With around 1 200 fintech companies in Hong Kong, Mr Chan shared three key observations from the journey in building a vibrant fintech ecosystem – financial inclusion as an objective, regulators as enablers of innovation, and responsible and sustainable innovation.

At the panel discussion “Curating the New FinTech Era”, the Secretary for Financial Services and the Treasury, Mr Christopher Hui, highlighted blockchain and AI as the transformative technologies for Hong Kong’s financial services. Mr Hui also noted the important role that regulatory sandboxes and subsidy programmes play in the city’s fintech ecosystem. They are not only the crucial driver in cultivating innovation but also conducive to obtaining valuable views and feedback from the market for better review and enhancement to existing policy and regulatory frameworks.

The President and Chair of the Board of Directors of the Asian Infrastructure Investment Bank (AIIB), Mr Jin Liqun, attended the Main Conference and shared insights on how financial innovation can help maintain and support nature and ecological conservation. He remarked, “Once we can verify nature as an asset, we can make it investable. We can digitise and scale it to make it sustainable in the long run.” He also announced the AIIB’s plan to set up an office in Hong Kong to address its growing business needs.

Charging ahead with heart: policy and ecosystem perspectives

The Under Secretary for Financial Services and the Treasury, Mr Joseph Chan, engaged in an in-depth dialogue with ex-Chairman of Meitu and Angel Investor Mr Cai Wensheng at the Main Conference. Mr Chan detailed Hong Kong’s latest growth in the digital asset space. Mr Chan stated that “The Government is promoting the development of digital asset in a sustainable and responsible manner. As Asia’s leading international financial centre, in June 2025, we issued the Policy Statement 2.0 on the Development of Digital Assets in Hong Kong, reinforcing its commitment to establishing Hong Kong as a global hub for innovation in the digital asset field.”

The Under Secretary for Innovation, Technology and Industry, Ms Lillian Cheong, in a video speech, outlined the Government’s strategic investments in I&T (innovation and technology) infrastructure, talent and industry development, with a view to fostering a vibrant I&T ecosystem in the city and build Hong Kong into a new real economy. She pointed out that the Government strives to consolidate Hong Kong’s strengths in I&T through a series of support measures by better co-ordinating the upstream, midstream and downstream development. She extended a sincere invitation to fintech companies and start-ups to leverage Hong Kong’s unique advantages that underpins its status as a global innovation hub and set up or expand businesses in the city.

The Under Secretary for Environment and Ecology, Miss Diane Wong, delivered a keynote speech on Hong Kong’s environmental and sustainability achievements to date, highlighting the pivotal role played by technological innovation under decarbonisation strategies. “To combat climate change effectively, we need to adopt appropriate measures on climate adaptation and resilience, to protect life and property of our people from the extreme weather events. AI and robots are playing an increasingly important role in these areas,” she said.

Miss Wong added that the Government attaches importance to adopting innovation technologies in its work. She quoted the example of the Hong Kong Observatory, which has been running several AI models to support operational forecasting such as tropical cyclone track forecasting since mid-2023. The AI models have successfully forecast several tropical cyclones this year, to an accuracy better than traditional weather prediction models.

Shaping the future of finance through digital transformation and trust

The Chief Executive of the HKMA, Mr Eddie Yue, outlined the four strategic pillars of the HKMA’s “Fintech 2030” vision: Data and Payment Infrastructure, AI, Resilience, and Tokenisation, collectively known as “DART”. He stated that this strategy aims to establish Hong Kong as a robust, resilient, and future-ready fintech hub, detailing how each pillar will drive the next chapter of fintech in the city. Reflecting on the evolution of Hong Kong’s fintech landscape over the past decade, he introduced the strategy for the upcoming Fintech 3.0 era, characterised by technology embedded in daily life, underpinned by trust, transparency, and intelligence to create a real-world impact and lasting resilience.

Mr Yue also noted AI’s transition from an experimental phase to a significant innovation driver, with over three-quarters of the city’s banks implementing or piloting AI solutions. He emphasised the importance of deeper collaboration across the industry to develop a shared and scalable AI infrastructure that would benefit the banking industry. He reaffirmed that tokenisation remains a key priority and highlighted the role of the HKMA as an enabler and facilitator in building an interoperable and trusted network, which will lay the foundation for a vibrant tokenised asset market. Lastly, Mr Yue stressed that resilience involves not just withstanding shocks, but being secure, adaptive, and future-ready in the face of new innovations.

The Chief Executive Officer of the SFC, Ms Julia Leung, opened the fireside chatby highlighting two new circulars to be issued that day (November 3). These allow Virtual Asset Trading Platforms (VATPs) to share a global order book with their overseas affiliates, connecting the Hong Kong market with global liquidity. The circulars also expand VATPs’ service and product offerings in all types of digital assets.

Ms Leung also discussed the recent joint consultations by the SFC and Financial Services and the Treasury Bureau on the regulatory framework for virtual asset dealers and custodians, noting positive feedback received. She revealed plans to extend the licensing regime to include virtual asset advisory and management, with discussions underway with the Government. The new custody regime will focus on managing risks linked to private keys. The SFC expects to license only the most robust and reliable players to ensure a secure environment.

The Chief Executive Officer of the IA, Mr Clement Cheung, emphasised that the key takeaway from the technological advances in the past few years is that “development is paramount but has to be balanced with regulation”. He acknowledged the rapid progress in technology development within the insurance industry, generative AI and blockchain for example, as “breathtaking”. Taking a dual approach in balancing regulation and development to foster sustainability, he highlighted a series of milestone initiatives of the IA that promote the adoption of advanced technologies and strengthen operational resilience of the industry, including the Open API Framework, the Cyber Resilience Assessment Framework, and the AI Cohort Programme. He also announced the publication of the Whitepaper on Federated Learning.

Mr Cheung stressed that as the insurance sector evolves, regulators must navigate in a balanced and enlightened manner to promote inclusive and responsible innovation.

Collaboration is key: redefining the innovation frontier

Frontier technology, from biotech and fintech to AI and Web3, was the centre of celebration as companies and start-ups took to various stages and panels to discuss what they have been able to achieve in the space.

Nobel Laureate in Physics, Professor Emeritus of the University of Toronto, Mr Geoffrey Hinton, shared at the event the future of AI. Professor Hinton introduced his groundbreaking “Mother AI” theory, emphasising the importance of ensuring AI genuinely cares for humanity rather than replacing it. He outlined strategies to mitigate AI-related risks and highlighted opportunities to foster innovation aligned with human values amid rapid technological advancement, while underscoring Asia’s key role in driving AI innovation.

Co-founder and Managing Partner of DST Global Mr John Lindfors and the Founding Managing Partner of Qiming Venture Partners, Mr Duane Kuang, joined the forum session to exchange insights on how disruptive technologies are reshaping global growth opportunities. They shared perspectives on the rapid maturation of innovation – from AI and biotech to digital assets – into scalable, investable markets, and highlighted how new investment vehicles are opening greater access for investors worldwide.

The President and Chief Executive Officer of Franklin Templeton, Ms Jenny Johnson, predicted that the next wave of major companies will emerge from the AI and crypto innovation. She emphasised that while AI and blockchain are transformative, the biggest challenge is organisational change management, where start-ups adapt faster than incumbents. Ms Johnson noted that current AI investment gains are concentrated among infrastructure providers such as chipmakers and cloud services, but future growth will come as firms learn to expand margins using AI. She also highlighted real-world crypto and NFT (non-fungible token) applications, such as luxury goods authentication and bandwidth sharing, and praised Hong Kong’s progressive blockchain regulation as a model for innovation.

The President of the Solana Foundation, Ms Lily Liu, discussed how digital asset treasury (DATs) and ETFs (exchange-traded funds) are complementary tools for traditional investors, but stressed the need to filter them for long-term quality amid speculative cycles. She highlighted how the evolution of technologies such as stablecoins reflects a broader transformation in financial infrastructure, where decentralised platforms increasingly play a central role in profit generation and capital flow. On another panel, Co-Executive Director of the Ethereum Foundation Mr Tomasz Stańczak, emphasised stablecoins’ role in improving cross-border payments and driving institutional interest in tokenised assets.

During the main conference, a series of curated media tours highlighted Hong Kong’s role as a global financial and innovation hub. Key moments included exclusive sessions with Chinese Mainland tech giants. Tencent introduced its vision for cross-boundary payment services; WeBank focused on HQ-driven innovation; and Ant Digital Technologies underscored Hong Kong’s strategic advantages for global expansion and cutting-edge fintech solutions. Other tours showcased Hong Kong as a “super connector” for emerging markets with delegations led by the Dubai International Financial Centre and the National Innovation Agency of Thailand. Another tour positioned Hong Kong as a launch pad for Chinese Mainland firms to go global, featuring the Shenzhen Financial Techology Association and the Zhongguancun Financial Technology Industry Development Alliance.

Marking the conclusion of the HKFW x SMUF 2025, Ms Lau, said, “The unprecedented success of the HKFW x SMUF 2025 speaks volumes about the vibrancy, depth and resilience of our financial innovation and start-up ecosystem. We are grateful to all our partners, speakers and participants from around the world who came together to make this our largest and most impactful edition yet. As we look to the next decade, InvestHK remains steadfast in our commitment to connect global companies with Hong Kong’s dynamic ecosystem, empowering them to scale across Asia and beyond, driving innovation, commercialisation, and creating more cross-border collaboration opportunities.”

For more details and highlights from HKFW x SMUF 2025, please visit www.fintechweek.hk, or follow via the official social media accounts:
LinkedIn: Hong Kong FinTech Week; and
YouTube: www.youtube.com/c/HongKongFinTechWeek.Hashtag: #HKFW #SMUF

The issuer is solely responsible for the content of this announcement.

AMI Announces AMILiA, A New AI-Powered Assistant to Transform Firmware Support and Productivity

ATLANTA, Nov. 18, 2025 /PRNewswire/ — AMI®, a global leader in dynamic firmware, is proud to announce the launch of AMILiA™, an advanced, AI-powered firmware development support platform designed to revolutionize how firmware engineers and developers interact with firmware knowledge and support.

AMILiA is a generative AI “linguistic assistant” support solution that ingests proprietary data including source code, design documents and program artifacts, and delivers intelligent, real-time answers and actions based on user prompts. Built to work seamlessly across multiple large language model (LLM) technologies, AMILiA provides a conversational interface to AMI’s extensive firmware knowledge base.

Solving Real Problems for Firmware Teams
Firmware engineers and developers often spend excessive time searching for answers in document libraries and waiting for support, which slows down troubleshooting, defect resolution and platform porting. AMILiA streamlines these processes by providing instant, accurate responses, documentation references and defect solutions, reducing time-to-resolution and boosting productivity.

Delivering Tangible Business Value
Based on internal test data, we project that AMILiA users can reduce customer support costs by up to 30% and achieve a 25% increase in firmware development productivity by adopting it. Additional benefits of AMILiA include:

  • Efficiency Gains: Faster issue resolution, reducing engineering time and support costs.
  • Productivity Boost: Developers complete more tasks and code commits, accelerating project delivery.
  • Customer Satisfaction: Quicker answers and self-service support improve CSAT and customer loyalty.
  • Competitive Advantage: AMILiA leverages over 30 years of proprietary firmware knowledge, offering depth unmatched by public LLMs.
  • Scalability: Scale smartly by integrating teams and customers to create your own knowledge base.
  • Data Privacy: Keep data safe with enterprise-grade privacy controls.

“AMILiA is more than just an AI chatbot. It’s a transformational tool for firmware teams,” said Raj Vaidyanathan, General Manager, AI Infrastructure Group, AMI. “By harnessing the power of generative AI and our decades of firmware development expertise, we’re enabling our customers to solve problems faster, innovate more efficiently and stay ahead in a rapidly evolving technology landscape.”

Start a 60-Day Free Trial Today!
Discover all that AMILiA has to offer with a 60-day free trial, in three easy steps:

  1. Contact AMI at amilia_support@ami.com to enable your account on the AMI Meridian web portal.
  2. Visit https://meridian.ami.com/amilia to sign in with your account credentials.
  3. Select the AMILiA Service (under “AIOps”) and begin exploring AMILiA by asking questions!

About AMI
AMI is Firmware Reimagined for modern computing. As a global leader in Dynamic Firmware for security, orchestration, and manageability solutions, AMI enables the world’s compute platforms from on-premises to the cloud to the edge. AMI’s industry-leading foundational technology and unwavering customer support have generated lasting partnerships and spurred innovation for some of the most prominent brands in the high-tech industry. For more information, visit www.ami.com.

AMI is a registered trademark of AMI US Holdings, Inc. AMILiA is a trademark of AMI in the US and/or elsewhere. All other trademarks and registered trademarks are the property of their respective owners. 

Laos Central Bank Faces LAK 66.86 Billion Embezzlement Loss

Bank of Laos. This image is used only for representational purpose. (photo: Fintech News Singapore)

The Bank of the Lao PDR (BOL) is intensifying efforts to tackle corruption and internal mismanagement after inspection teams uncovered 181 cases of embezzlement and misappropriation between 2021 and 2025, resulting in losses of LAK 66.86 billion (USD 3 million).

Payment Asia Becomes Octopus’s Omnichannel Payment Facilitator

Using AI-Driven System to Speed Up Merchant Onboarding

HONG KONG, Nov. 18, 2025 /PRNewswire/ — Payment Asia, a leading payment service provider, gladly announced that the company has become the official Payment Facilitator of Octopus Cards Limited for both online and offline transactions in Hong Kong. The partnership integrates Octopus—used by more than 98% of the city’s population—into Payment Asia’s AI-enabled platform, extending access to small, medium-sized, and large enterprises that seeking unified payment solutions.

Payment Asia provides limited offer for merchants that apply for Octopus service.
Payment Asia provides limited offer for merchants that apply for Octopus service.

Merchants using Payment Asia’s platform can now accept Octopus payments across physical and digital channels. Leveraging the company’s AI-powered onboarding system, streamlined KYC procedures that enabling simultaneous activation of online and offline transaction capabilities. The system supports a wide range of acquiring channels, offering consolidated management through a single interface.

The collaboration arrives as Octopus accelerates its cross-border payment strategy. Following the introduction of the outbound version of “Easy Ride” service across Thailand, Singapore, Malaysia, and Vietnam in May, Octopus has also entered the Japanese market recently in October 2025. Additional features under development include Chinese mainland ride-hailing payments and peer-to-peer transfers.

“Octopus is embedded deeply in the daily commerce of Hong Kong and beyond,” said Paul Tang, Chief Operating Officer at Payment Asia. “Integrating Octopus into cloud platforms—such as unified ordering and settlement systems for restaurants—advances fintech innovation and smart city development.”

Edwin Lai, General Manager of Retail Business and Partnerships at Octopus added: “Payment Asia’s AI-powered onboarding platform in Hong Kong will serve as a core solution for enhancing customer experience. This partnership is more than a payment channel expansion, it represents a significant milestone in Hong Kong’s fintech export story.”

Effective immediately, merchants in Hong Kong can apply for integrated Octopus payment services through Payment Asia’s website or mobile app. The service offers tiered solutions suitable for businesses ranging from food stalls and e-commerce operators to cross-border traders.

Hong Kong International Communications Electronic Chamber Launches with Historic Inaugural Banquet

Over 200 Enterprises Unite to Shape the Future of Global Trade


HONG KONG SAR – Media OutReach Newswire – 18 November 2025 – The Hong Kong International Communications Electronic Chamber (HKICEC), jointly initiated by industry leaders, was officially established on 13 November, 2025. The inaugural ceremony and banquet were held at the Hong Kong Convention and Exhibition Centre (New Wing), marking a new milestone for Hong Kong’s communications and electronics trade industry. The event brought together more than 200 member enterprises, along with representatives from the world’s Top 100 companies, policymakers, and business leaders from Hong Kong, Mainland China, and overseas. The grand occasion was filled to capacity, creating a vibrant and celebratory atmosphere.

The Inaugural Ceremony of the Hong Kong International Communications Electronic Chamber (HKICEC) was grandly unveiled, with the officiating guests including Dr. Lawrence Cheung, Deputy Secretary for Justice of the HKSAR, Mr. Li Wenbin, Deputy Director of the Kowloon Work Department of the Liaison Office of the Central People's Government, and Mr. Ho Lap-kee, District Officer of Kwun Tong, together with Chamber leaders.
The Inaugural Ceremony of the Hong Kong International Communications Electronic Chamber (HKICEC) was grandly unveiled, with the officiating guests including Dr. Lawrence Cheung, Deputy Secretary for Justice of the HKSAR, Mr. Li Wenbin, Deputy Director of the Kowloon Work Department of the Liaison Office of the Central People’s Government, and Mr. Ho Lap-kee, District Officer of Kwun Tong, together with Chamber leaders.

As a major trade organization for the communications and electronics sector, HKICEC is committed to promoting the efficient global circulation and rational allocation of communications equipment, advancing industry standardization and transparency, and strengthening Hong Kong’s position as an international hub for communications and electronics trade. The Chamber will serve as a vital bridge connecting suppliers, platforms, wholesalers, and policymakers, offering a platform for resource integration, technical exchange, and policy advocacy.

Mr. Algernon Yau, Secretary for Commerce and Economic Development of the HKSAR, remarked in his speech earlier that afternoon, “We are committed to strengthening Hong Kong’s position as a premier international trade and business center, as well as a leading telecommunications hub. In particular, we remain dedicated to fostering favourable business environment that unlocks the potential of high-value-added industries by leveraging Hong Kong’s unique advantages under the “one country, two systems” principle. I am confident that the HKICEC will play a pivotal role in driving the growth of the communications electronic industry by fostering innovation and strengthening collaboration, enabling the industry to meet the challenges of an evolving and dynamic landscape.”

At the banquet, Dr. Lawrence Cheung, Deputy Secretary for Justice of the HKSAR, highlighted Hong Kong’s strengths, “Hong Kong is an international hub for logistics and professional services, with a well-developed logistics system, rule of law, and financial services that provide an excellent business environment. We are well-positioned to play a leading role in communications equipment and electronics recycling, with vast development potential. The HKSAR Government attaches great importance to innovation and technology as well as the communications and electronics industry. Through policy support and international cooperation, we actively promote regional economic collaboration and low-carbon transformation, striving to build Hong Kong into an international innovation and technology center. The establishment of HKICEC not only demonstrates its strength but also reflects the cohesion of Hong Kong’s industry.”

The inauguration ceremony was officiated by Dr. Lawrence Cheung, Deputy Secretary for Justice of the HKSAR; Mr. Li Wenbin, Deputy Director of the Kowloon Work Department of the Liaison Office of the Central People’s Government; Mr. Ho Lap-kee, District Officer of Kwun Tong; and leaders of HKICEC, who together witnessed this historic moment. The first council members of HKICEC were formally introduced (*see list below). Nearly 180 banquet tables were fully booked, underscoring the industry’s strong recognition and support for the Chamber.

Mr. Jacky Tse, Chairman of HKICEC, also addressed the dinner, “Our vision in founding HKICEC is to ‘gather wisdom and strength, connect globally, empower the industry, and give back to society.’ We are committed to building an innovative, internationally minded platform for industry exchange. By pooling collective expertise, seizing opportunities in the Greater Bay Area, and driving the industry and new technologies onto the global stage, we aim to open a brighter future for Hong Kong’s communications and electronics sector and write an exciting new chapter together.”

Prior to the banquet, HKICEC hosted the Hong Kong International Communications Electronic Trade Forum 2025, featuring heavyweight speakers from international and Mainland enterprises. Leaders from Asurion, Sunstrike, PCS Wireless, AiFengPai, ATRenew (AiHuiShou), Zhuanzhuan, and HKICEC Chief Secretary Mr. Jacky Chan joined the discussions. The forum was moderated by Ms. Elizabeth Chen, ICEC International President, under the theme “Global Smart Mobile Device – New Engine · New Wave · New Opportunities.” Discussions focused on global market trends, platform development, technological innovation, and policy environments for refurbished mobile devices. Participants agreed that as the smart device market enters a stage of stock competition, circulation of refurbished devices not only extends product lifecycles but also enhances resource recycling and environmental benefits, becoming a new growth engine for the industry. The forum also explored Hong Kong’s unique role in global refurbished device trade, as a center for price discovery, logistics, and policy coordination.

Looking ahead, HKICEC will continue to foster industry collaboration, technological innovation, and international expansion, helping Hong Kong exert greater influence in the global communications and electronics trade arena. The Chamber will promote the global circulation and rational allocation of communications equipment, advance industry standardization and transaction transparency, encourage enterprises to adopt smart technologies to enhance efficiency, expand overseas markets, and deepen international cooperation – at the same time, HKICEC will advocate green recycling and ESG practices, driving the industry toward high-quality, sustainable, and digital development. Connecting the world, going global.

Major Board Members:

Chairman: Mr. Jacky Tse, Permanent Honorary Chairman: Mr. Huang Shaowu, Honorary Chairman: Mr. Wave Hu, Chief President: Mr. Huang Shunyong, Executive Chairman: Ms. Guo Shaohui, Chief Supervisor: Mr. Hung Kam Wong, Vice Chairman: Mr. Wu Xiaomin, Vice Chairman: Mr. Mark Ma, Executive President: Mr. Jeffy Wang, Chief Secretary: Mr. Jacky Chan, Treasurer: Mr. Sam Pang

Event photos available for download: http://bit.ly/3WYMgbO

Hashtag: #HKICEC

The issuer is solely responsible for the content of this announcement.

About HKICEC

Established in December 2024, The Hong Kong International Communications Electronic Chamber (HKICEC) serves as a key industrial body for the communications electronics sector. Founded by industry leaders, we enhance global trade flows, leverage Hong Kong’s entrepôt advantages, and uphold quality standards to strengthen Hong Kong’s pivotal role in telecom trade.

More details, please visit HKICEC website:

On-us and Valuedesign Partner to Deliver Seamless Cross-Border Rewards, Expanding 800+ Japanese Merchant Access Across Asia

HONG KONG, TOKYO and BANGKOK, Nov. 18, 2025 /PRNewswire/ — On-us, a global FinTech and AI-powered B2B2C incentive platform, and Valuedesign, Japan’s leading prepaid and digital gift card infrastructure provider, are proud to announce a strategic partnership to expand cross-border reward experiences across Asia. The collaboration integrates Valuedesign’s extensive network of over 800 premium Japanese merchant brands into On-us’ Smart E-Voucher ecosystem, enabling outbound travelers from Mainland China, Hong Kong SAR, Taiwan region, Thailand and Malaysia to access curated rewards at more than 100,000 points of sale.

Through this partnership, On-us empowers collaborating banks, insurers, and loyalty programs with a broader variety of cross-border rewards, enabling the launch of real-time travel reward campaigns for card schemes. Personalized Smart E-Vouchers with curated, localized merchant choices are delivered instantly to travelers abroad for in-store redemption without app downloads and registration. This creates a seamless reward experience that incentivizes card spending and deepens campaign engagement.

By connecting Valuedesign’s merchant network with On-us’ platform, the collaboration delivers value across the entire ecosystem of customers, merchants and marketers. Travelers enjoy elevated travel journeys with seamless access to authentic Japanese brands, transforming rewards into instant and memorable local experiences. Japanese merchants and brands are opened to a direct channel to attract high-value overseas customers, gaining footfall and incremental spend through On-us’ global marketer network. For financial institutions, card schemes and loyalty marketers, the partnership offers a differentiated incentive strategy to drive engagement and spending, leveraging seamless, cross-border reward experiences powered by On-us’ Smart E-Voucher technology and Valuedesign’s extensive merchant network.

Meanwhile, Valuedesign gains access to On-us’ regional merchant network and a customer base of more than 50 million across Hong Kong and Southeast Asia, strengthening its reward presence across Asia. This partnership creates a more efficient and scalable cross-border digital incentive infrastructure, benefiting merchants by reducing operations friction through reduced manual processes and training needs. Together, On-us and Valuedesign accelerate cross-border engagement through a unified, data-driven approach that unlocks new strategic growth for brands across the region.

Shuji Hayashi, CEO of Valuedesign, highlighted “We are excited to partner with On-us to bring greater convenience and accessibility to travelers worldwide. This collaboration allows Japan’s top brands to connect directly with overseas customers, delivering seamless, instant, and culturally enriching reward experiences.”

Dennis Shi, Founder and CEO of On-us, remarked, “This partnership marks a milestone in building a truly borderless reward ecosystem. By integrating On-us’ FinTech innovation with Valuedesign’s merchant network, we empower financial institutions and loyalty programs to offer instant, personalized rewards while providing real-time behavioral insights to deepen engagement and predict customer needs.”

Together, On-us and Valuedesign are setting a new benchmark for cross-border reward innovation in Asia. The partnership underscores the shared vision of building a connected, frictionless reward ecosystem that strengthens regional commerce and redefines how brands engage global travelers, driving the next wave of digital loyalty transformation.

About Valuedesign
Valuedesign is Asia’s leading provider of tailored gift card solutions, offering end-to-end services in card design, distribution, and technology integration. With headquarters in Japan and operations across India and Thailand, Valuedesign partners with more than 800 brands through over 100,000 touchpoints.

About On-us
On-us is a Global B2B2C Incentive platform that leverages FinTech, data and behavioral AI, designed to elevate consumer loyalty engagement and unlock maximum value for marketers, merchants and customers. Through omni-channel APIs and data-driven campaigns, we empower businesses to strengthen customer engagement while maximizing ROI. Trusted by financial services providers, people management teams, blue-chip property developers, non-profit organizations, and SMEs, our platform delivers sustainable sales growth and seamless integration, driving success across industries.

For more information, please visit: https://www.on-us.com/about or follow our Linkedin for latest updates.

AIC to Showcase AI Optimized Server and Storage Solutions at SC25

TAIPEI, Nov. 18, 2025 /PRNewswire/ — AIC will showcase its latest server and AI storage platforms this week at Supercomputing 2025 (SC25) in St. Louis, highlighting solutions for fast growing AI, HPC, and enterprise workloads. Stop by AIC’s booth (#305) to see new Gen5 systems, partner integrated solutions, and a sneak preview of AIC’s upcoming Ethernet JBOD (eBOD) platform for scalable, Ethernet attached capacity. Additionally, AIC will be featured at several partners’ booths across the show floor.


At Micron’s booth (#3516), AIC and Micron will demonstrate an ultra-dense configuration pairing the AIC F2032-01-G5 with Micron 6600 ION 245TB E3.L SSDs—supporting 140+ PB per rack to meet the data demands of modern AI and HPC.

H3 Platform will be co-exhibiting with AIC at our booth, presenting a joint GPU-accelerated AI platform built on the Falcon 6048 system. The platform combines PCIe 6.0, high-density NVMe storage, and up to 6 GPUs, DPUs, or NICs to push NVMe performance to more than 200 million IOPs and remove storage bottlenecks for AI and HPC workloads. H3 is also showcasing its Falcon C5022 CXL memory pooling solution on AIC servers, enabling up to 5.5 TB of shared memory with simple monitoring and control so data centers can scale memory capacity more efficiently. 

AIC has also teamed up with Seagate to give SC25 attendees a first look at AIC’s new Ethernet JBOD (eBOD) technology—a fresh approach to building high capacity, Ethernet attached storage for AI workloads. In this collaboration, AIC provides the Ethernet-based JBOD, Seagate supplies the high-capacity HDD. Leveraging a DPU and an HBA card, the eBOD functions as a disaggregated storage enclosure that enables NVMe-oF on SAS/SATA-based drives, especially high-capacity HDDs. Together, the design ingests data at network speed, accelerates resilient checkpoint tiers for training, and scales out over standard Ethernet—reducing data movement overhead and total cost of ownership for large AI pipelines.

“SC25 pushes AI infrastructure forward,” said Michael Liang, President & CEO of AIC. “We’re here to show real progress in storage and compute, reconnect with partners and customers, and see what’s next. I’m especially excited to see our new Ethernet-based JBOD (eBOD) running on the floor—a practical step toward simpler, faster data pipelines at scale.”

AIC will also highlight a compact integration with ATTO Technology, featuring ExpressSAS® 24Gb/s SAS HBAs linking an AIC server and an AIC JBOD for high bandwidth, low latency expansion. The setup delivers predictable latency and sustained bandwidth for scale out AI training and HPC simulation workloads on AIC platforms.

“AIC’s showcase of our ExpressSAS at SC25 highlights its unmatched role in driving performance and reliability for HPC and AI,” said Tim Klein, president and CEO of ATTO Technology. “With advanced features and technology like ADS and ATTO360 support, ExpressSAS sets the standard for storage connectivity in high-performance computing environments.”

Key AIC systems on display at SC25 include:

  • F2026-01-G5 — high density storage server for AI data lakes, backup/restore, and analytics.
  • SB102-CA — GPU ready platform for AI inference and media acceleration.
  • SB201-SU (Hybrid) — balanced compute + capacity for virtualization and analytics.
  • HA2026-HC — resilient storage for mission critical and video workloads.

Additionally, AIC will appear with our partners Solidigm, Ma Labs, and VAST Data. To experience these systems firsthand, visit AIC at booth #305 or explore AIC technology at partner booths across the show floor

About AIC
AIC is a global leader in enterprise server and next generation AI storage systems, with 30 years of expertise in hardware engineering and system integration. AIC’s portfolio of rackmount servers, JBODs, and customized platforms powers workloads across AI, HPC, cloud, and edge environments. To learn more, visit www.aicipc.com.  

Arctech Shines at Renewable Energy India Expo 2025, Showcasing Leadership in Solar Solutions with Over 19GW of Orders in India

KUNSHAN, China, Nov. 18, 2025 /PRNewswire/ — Arctech, a world-leading provider of solar tracking and mounting systems, made a significant impact at the Renewable Energy India Expo 2025, presenting its advanced “Tracker+” and “Green Power+” solutions. The exhibition highlighted Arctech’s formidable expertise and service capabilities as a global leader in the tracker industry, reinforcing its strong commitment to the Indian market.

As one of the world’s fastest-growing renewable energy markets, India is actively pursuing its “2070 Carbon Neutrality” goal and aims to achieve over 500 GW of non-fossil fuel capacity by 2030, accounting for 50% of its total installed capacity. Facing the great chances, Arctech showcased its solutions tailored to address the specific needs of this dynamic market.

A key highlight was the “Tracker + Intelligent Cleaning Robot” solution. This innovative offering seamlessly integrates Arctech’s flagship 1P SkyLine II solar tracker with StarShine I, the intelligent cleaning robot, overcoming system compatibility challenges through smart, synchronized control. The solution combines the advantages of the multi-point parallel drive tracker—featuring high terrain adaptability with its “follow-the-terrain” design and precise positioning via smart AI algorithms—with the robot’s autonomous navigation, AI-powered path correction, and robust obstacle-crossing and cleaning capabilities. Together, they significantly enhance energy output, reduce operational costs, and boost the power plant’s lifetime value.

SkyLine II Solar Tracker and StarShine I Cleaning Robot
SkyLine II Solar Tracker and StarShine I Cleaning Robot

Under the “Green Power+” solution, Arctech demonstrated its Arcbank utility-scale energy storage system, which enhances system cycle efficiency and lifespan, ensuring round-the-clock revenue for PV-storage hybrid projects. Aligning with the global trend of integrated PV-storage-charging systems, the “Green Power+” solution not only ensures stable power output for solar plants but also helps address challenges such as grid instability and power supply-demand imbalances in certain regions of India, providing robust support for the country’s energy transition.

Beyond the technology, the exhibition allowed the team to deepen connections with local partners. Through one-on-one meetings and roundtable discussions, Arctech explored future collaborations, ongoing tenders and shared insights into local energy needs.

Since entering the Indian market in 2014, Arctech has successfully delivered several GW-scale benchmark projects. The company has now surpassed a remarkable 19 GW in cumulative orders in India and achieved the top spot in market shipments in 2024. Leveraging its success in India, Arctech continues to strengthen its business and service capabilities across the globe, with increasing international market share and a rising brand reputation, solidifying its position as a leading representative of high-quality “Intelligent Manufacturing from China.”

Moving forward, Arctech will remain steadfast in its customer-centric approach, combining its differentiated product solutions, reliable delivery, and profound understanding of the local market to fully support India in achieving its renewable energy targets and collectively advancing towards the vision of a “Zero-Carbon Earth.”

 

Arcbank Utility-Scale Energy Storage System
Arcbank Utility-Scale Energy Storage System