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TRUMPF makes glass substrates ready for the next generation of AI chips

The future of AI chips is increasingly being shaped by packaging // With its HiPIMS product line, TRUMPF is addressing a key challenge facing the semiconductor industry: the reliable coating of highly complex glass substrates for the next generation of high-performance AI processors.DITZINGEN, GERMANY / TAIPEI, TAIWAN - ...

Semicon Taiwan: TRUMPF Enables Integrated Chip Cooling for the Next Generation of AI Chips

Advanced packaging requires integrated cooling at the semiconductor level // TRUMPF uses ultrashort-pulse lasers...

Media OutReach Newswire

Sino Land reports 13.3% revenue growth and a 14.2% increase in net profit attributable to shareholders for FY2025/26

Awarded first pilot area in the Northern Metropolis, demonstrating the Group’s confidence in Hong...

Media OutReach Newswire

TempraMed Signs Letter of Intent with CPO Greece for Exclusive Distribution of VIVI Products in Greece

Distribution framework pairs TempraMed's injectable medication-protection products with one of the largest, most established...

Media OutReach Newswire

InnoHK R&D Centres Establish Base at Science Park to Drive Emerging Industries and Pioneer Future Innovation

HONG KONG SAR – Media OutReach Newswire – 1 September 2026 – Hong...

Media OutReach Newswire

Global Ticketing Platform Veritickets Goes Live on Web and Mobile, Promising 100% Verified, Authentic Tickets with Delivery in 12 Hours

Veritickets offers a ticket issuance promise as fast as 12 hours and guarantees that every ticket...

Southco Introduces New Folding T-Handle Compression Latch

HONG KONG SAR - Media OutReach Newswire - 26 February 2026 - Southco has launched the new N5 Lift-and-Turn Compression Latch, featuring strong...

Doubleview Gold Corp. Reports Updated Mineral Resource Estimate as of February 25, 2026 Including a Copper Equivalent Mineral Resource: 609 (Mt) of Measured and...

Resource estimate highlights: Measured Mineral Resources of 272 million tonnes (Mt), Indicated Mineral Resources...

Media OutReach Newswire

TRUMPF makes glass substrates ready for the next generation of AI chips

Semicon Taiwan: TRUMPF Enables Integrated Chip Cooling for the Next Generation of AI Chips

Sino Land reports 13.3% revenue growth and a 14.2% increase in net profit attributable to shareholders for FY2025/26

TempraMed Signs Letter of Intent with CPO Greece for Exclusive Distribution of VIVI Products in Greece

InnoHK R&D Centres Establish Base at Science Park to Drive Emerging Industries and Pioneer Future Innovation

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