Tickets Now on Sale with Partner Lineup Revealed

SHANGHAI, May 8, 2025 /PRNewswire/ — The HERO ESPORTS Asian Champions League (ACL) Grand Finals 2025 (ACL Grand Finals 2025) will take center stage in Shanghai from May 16–18, 2025, transforming the city into Asia’s esports epicenter. The action will unfold across three premier venues: the SPD Bank Oriental Sports Center, Jing’an Sports Center, and National Exhibition and Convention Center (NECC). Tickets officially launched last week with the full slate of official partners now unveiled, marking the countdown to Asia’s premier esports spectacle.

Nine Elite Titles, $2M+ Prize Pool, and Pathways to Global Glory

The ACL Grand Finals 2025 will showcase nine esports titles, including Counter-Strike 2 (CS2), DOTA 2, Honor of Kings, Street Fighter 6, League of Legends Legend Cup, Teamfight Tactics, VALORANT Champions Tour, Delta Force, and CrossFire. With a staggering $2 million (RMB 15 million) prize pool, the event also offers direct qualification slots for the 2025 Esports World Cup (EWC), empowering Asian teams to compete on the world stage.

Powering the Future of Esports: ACL & DreamHack Partners

The events boast unparalleled support from industry leaders:

• Hero Esports ACL:
• Chief Partners: HERO ESPORTS × 5EPlay
• Strategic Partners: Esports World Cup, Jin Jiang International, Shanghai JUSS Sports Management Co., Ltd.
• Special Partners: Savage Impact, Eastroc Vitamin Energy Drink, HONOR, TGIF, OBSBOT
• Special Partners for ACL Grand Finals 2025: POPEYES, Tongcheng Travel
• Special Partners for ACL × Honor of Kings: CLEAR
• Broadcasting Partners (China): Kuaishou, Douyin, Huya, Douyu, bilibili, Weibo, and Hupu
• Broadcasting Partners (Global): Twitch, TikTok, YouTube, CHZZK, and SOOP
• DreamHack cooperates with many well-known brands at home and abroad, including strategic partners: Jin Jiang International Holdings, 8BitDo, and ZOWIE; Industry Partners: HONOR, Savage Impact, and Morphling; Special Partners: Alipay.

Fans can now purchase tickets via official platforms Damai, Maoyan , Alipay, and Hopegoo, catering to diverse viewing preferences.

Event Schedule Highlights

SPD Bank Oriental Sports Center

• May 16, 14:10: ACL Grand Finals × CS2 – Third-Place Match, Exhibition Match, Opening Ceremony, Grand Finals
• May 17, 14:00: ACL Grand Finals × Huya LoL Legend Cup – Opening Performance, Finals (G1-G3), Intermission Show, Finals (G4-G9)
• May 18, 16:30: ACL Grand Finals× Honor of Kings – Opening Ceremony & Grand Finals

Jing’an Sports Center

• May 16, 12:00: ACL Grand Finals × CrossFire – Quarterfinals
• May 17, 12:00: ACL Grand Finals × CrossFire – Semifinals & Grand Finals
• May 18, 13:00: ACL Grand Finals × VALORANT Champions Tour – Surprise Guest Exhibition & Grand Finals

National Exhibition and Convention Center (Halls 1.2-2.2)

• May 16–18: ACL Grand Finals × DOTA 2, Street Fighter 6, Delta Force, and TFT tournaments, plus DreamHack Festival (see notes).

Note: DreamHack Esports Stage access requires a dedicated ticket (includes full-day pass + early entry). General tickets grant venue entry excluding DreamHack areas.

ACL Grand Finals Night @ INS Park

From May 16–18, Shanghai’s trendsetting INS Park will also host the ACL Grand Finals Night, blending esports, entertainment, and nightlife.

A New Era for Asian Esports

The ACL aspires to set Asia’s competitive benchmark, fueling the global esports ecosystem through elite tournaments, cross-industry innovation, and fan immersion. This landmark event will not only accelerate China’s esports growth but also cement Shanghai’s status as the “Global Esports Capital”, amplifying its cultural influence worldwide.

Global Broadcast: Live on ACL’s official Twitch, YouTube, and TikTok channels.
Official Website: esportsacl.com/home
Media Inquiries: aclpr@heroesports.com

ENNOVI-SealTech: Patent-pending busbar sealing prevents coolant leaks, offering manufacturing efficiency and design flexibility over traditional methods.

SINGAPORE, May 8, 2025 /PRNewswire/ — ENNOVI, a mobility electrification solutions partner, introduces a new technology for sealing busbars, which prevents coolant leakage in hybrid and electric vehicle (xEV) drivetrain applications. ENNOVI-SealTech can be used with either busbars or other interconnects to accommodate applications such as motors, inverters or oil pump interfaces.

ENNOVI-SealTech: Patent-pending busbar sealing prevents coolant leaks, offering manufacturing efficiency and design flexibility over traditional methods.

“Managing busbar interfaces in EVs where coolant is present on one side and a dry, electrically robust connection is required on the other side, presents several challenges,” explains Dominik Pawlik, Product Portfolio Director for Power Interconnects at ENNOVI. “Conventional sealing methods, such as potting or using rubber O-rings or gaskets, incur the high cost and time for secondary processes and/or issues with leakage over the lifetime of the assembly – ENNOVI-SealTech overcomes all these limitations.”

ENNOVI-SealTech offers two sealing methods: double-walled shrink tubes or adhesive tape for challenging applications. Both eliminate post-processing, enhancing manufacturing efficiency and design flexibility without sacrificing sealing performance.

ENNOVI-SealTech technology is subjected to rigorous testing to ensure it meets the specific requirements of each design. Every configuration is validated through a comprehensive testing process, including thermal aging at 150°C for 1,000 hours, and thermal shock cycling from -40°C to +150°C for 600 cycles (15 minutes per cycle), in accordance with the EN 60068-2 standard. A leak test is also performed to verify sealing integrity.

The use of shrink tubing or tape allows ENNOVI-SealTech to adapt to virtually any busbar shape and design specification. Moreover, the technology is compatible with a wide range of metals and plastics, including copper (Cu), aluminum (Al), PA66, PBT, PC, and others.

For more information about ENNOVI-SealTech, please visit here.

About ENNOVI:

At ENNOVI, we design and manufacture products and solutions for electrical battery platform developments, power components, and signal interconnect design solutions. Using our decades of experience in electro-mechanical engineering and high-precision manufacturing, we work with EV OEMs and suppliers to bring their ideas to life. As a Mobility Electrification Solutions Partner, we accelerate the process for our EV customers by offering complete end-to-end manufacturing capabilities from R&D, design, and tooling to production. Learn more at www.ennovi.com.

Agency Contact:

Selvan Wilhelm
Selvan.Wilhelm@ennovi.com  

Erin McMahon
erin.mcmahon@publitek.com 

ZHUBEI, May 8, 2025 /PRNewswire/ — ERS electronic, the industry leader of thermal management solutions for semiconductor manufacturing, is excited to announce the opening of its latest demonstration center in Zhubei, Taiwan. This new facility will offer chipmakers and OSATs in Taiwan direct access to ERS’s PhotoThermal debonding machine for wafers and panels, LUM600S1, a strategic move to meet the growing demand for panel-level packaging (PLP) technologies in the region.

Source: Panel Level Packaging 2025 report, Yole Group

Panel-level packaging is rapidly gaining traction in the semiconductor industry due to its cost advantages and process scalability. Dr. Yik Yee Tan, Technology & Market Principal Analyst at Yole Group, predicts that the market will grow from $160 million in 2024 to over $600 million by 2030, driven by cost-efficient solutions in advanced packaging. By 2030, high-density fan-out technology, propelled by Generative AI, is expected to dominate the market, capturing more than 50% of the market share⁽¹⁾. In Chiplet and Heterogeneous Integration demand for larger form factor is driving the growth of PLP in the coming years to meet higher density requirement. For large package size of ~5.5x reticle size limit, PLP can boost carrier area efficiency by more than 80%, compared to just 45% with Wafer Level Packaging (WLP).

In addition to wafer solutions, ERS was among the first to bring PLP equipment to the market, introducing a panel-level debonder in 2018. Today, ERS offers a wide portfolio of semi- and fully-automatic systems, including PhotoThermal debonding machines enabling temporary bonding and debonding (TBDB) processes essential for handling ultra-thin substrates, which is critical for HPC and AI applications, like CoWoS and HBM.

 “With LUM600S1, we are providing a high-yield solution tailored for high-volume manufacturing of complex AI chips. Our Taiwanese customers can now experience firsthand how PhotoThermal Debonding enhances efficiency, scalability, and cost-effectiveness,” says Sébastien Perino, Managing Director of ERS Taiwan.

For more information about the Zhubei demonstration center and LUM600S1’s availability for testing and demonstration, please visit ERS’s website to get in contact with regional sales representatives.

About ERS:

ERS electronic GmbH, based in the Munich suburb of Germering, has been providing innovative thermal management solutions to the semiconductor industry for more than 50 years. The company has gained an outstanding reputation, notably with its fast and accurate air cooling-based thermal chuck systems for wafer probing. In 2008, ERS extended its expertise to the Advanced Packaging market. Today, their fully automatic and manual debonding and warpage adjust systems can be found on the production floors of most semiconductor manufacturers and OSATs worldwide.

⁽¹⁾ Sources: Panel Level Packaging 2025 report – Advanced Packaging Market Monitor, Yole Group

ZHUBEI, Taiwan, May 8, 2025 /PRNewswire/ — ERS electronic, the industry leader of thermal management solutions for semiconductor manufacturing, is excited to announce the opening of its latest demonstration center in Zhubei, Taiwan. This new facility will offer chipmakers and OSATs in Taiwan direct access to ERS’s PhotoThermal debonding machine for wafers and panels, LUM600S1, a strategic move to meet the growing demand for panel-level packaging (PLP) technologies in the region.

Source: Panel Level Packaging 2025 report, Yole Group

Panel-level packaging is rapidly gaining traction in the semiconductor industry due to its cost advantages and process scalability. Dr. Yik Yee Tan, Technology & Market Principal Analyst at Yole Group, predicts that the market will grow from $160 million in 2024 to over $600 million by 2030, driven by cost-efficient solutions in advanced packaging. By 2030, high-density fan-out technology, propelled by Generative AI, is expected to dominate the market, capturing more than 50% of the market share⁽¹⁾. In Chiplet and Heterogeneous Integration demand for larger form factor is driving the growth of PLP in the coming years to meet higher density requirement. For large package size of ~5.5x reticle size limit, PLP can boost carrier area efficiency by more than 80%, compared to just 45% with Wafer Level Packaging (WLP).

In addition to wafer solutions, ERS was among the first to bring PLP equipment to the market, introducing a panel-level debonder in 2018. Today, ERS offers a wide portfolio of semi- and fully-automatic systems, including PhotoThermal debonding machines enabling temporary bonding and debonding (TBDB) processes essential for handling ultra-thin substrates, which is critical for HPC and AI applications, like CoWoS and HBM.

 “With LUM600S1, we are providing a high-yield solution tailored for high-volume manufacturing of complex AI chips. Our Taiwanese customers can now experience firsthand how PhotoThermal Debonding enhances efficiency, scalability, and cost-effectiveness,” says Sébastien Perino, Managing Director of ERS Taiwan.

For more information about the Zhubei demonstration center and LUM600S1’s availability for testing and demonstration, please visit ERS’s website to get in contact with regional sales representatives.

About ERS:

ERS electronic GmbH, based in the Munich suburb of Germering, has been providing innovative thermal management solutions to the semiconductor industry for more than 50 years. The company has gained an outstanding reputation, notably with its fast and accurate air cooling-based thermal chuck systems for wafer probing. In 2008, ERS extended its expertise to the Advanced Packaging market. Today, their fully automatic and manual debonding and warpage adjust systems can be found on the production floors of most semiconductor manufacturers and OSATs worldwide.

⁽¹⁾ Sources: Panel Level Packaging 2025 report – Advanced Packaging Market Monitor, Yole Group

Photo – https://laotiantimes.com/wp-content/uploads/2025/05/panel_level_packaging-1.jpg
Logo – https://laotiantimes.com/wp-content/uploads/2025/05/ers_logo-1.jpg

ZHUBEI, Taiwan, May 8, 2025 /PRNewswire/ — ERS electronic, the industry leader of thermal management solutions for semiconductor manufacturing, is excited to announce the opening of its latest demonstration center in Zhubei, Taiwan. This new facility will offer chipmakers and OSATs in Taiwan direct access to ERS’s PhotoThermal debonding machine for wafers and panels, LUM600S1, a strategic move to meet the growing demand for panel-level packaging (PLP) technologies in the region.

Source: Panel Level Packaging 2025 report, Yole Group

Panel-level packaging is rapidly gaining traction in the semiconductor industry due to its cost advantages and process scalability. Dr. Yik Yee Tan, Technology & Market Principal Analyst at Yole Group, predicts that the market will grow from $160 million in 2024 to over $600 million by 2030, driven by cost-efficient solutions in advanced packaging. By 2030, high-density fan-out technology, propelled by Generative AI, is expected to dominate the market, capturing more than 50% of the market share⁽¹⁾. In Chiplet and Heterogeneous Integration demand for larger form factor is driving the growth of PLP in the coming years to meet higher density requirement. For large package size of ~5.5x reticle size limit, PLP can boost carrier area efficiency by more than 80%, compared to just 45% with Wafer Level Packaging (WLP).

In addition to wafer solutions, ERS was among the first to bring PLP equipment to the market, introducing a panel-level debonder in 2018. Today, ERS offers a wide portfolio of semi- and fully-automatic systems, including PhotoThermal debonding machines enabling temporary bonding and debonding (TBDB) processes essential for handling ultra-thin substrates, which is critical for HPC and AI applications, like CoWoS and HBM.

 “With LUM600S1, we are providing a high-yield solution tailored for high-volume manufacturing of complex AI chips. Our Taiwanese customers can now experience firsthand how PhotoThermal Debonding enhances efficiency, scalability, and cost-effectiveness,” says Sébastien Perino, Managing Director of ERS Taiwan.

For more information about the Zhubei demonstration center and LUM600S1’s availability for testing and demonstration, please visit ERS’s website to get in contact with regional sales representatives.

About ERS:

ERS electronic GmbH, based in the Munich suburb of Germering, has been providing innovative thermal management solutions to the semiconductor industry for more than 50 years. The company has gained an outstanding reputation, notably with its fast and accurate air cooling-based thermal chuck systems for wafer probing. In 2008, ERS extended its expertise to the Advanced Packaging market. Today, their fully automatic and manual debonding and warpage adjust systems can be found on the production floors of most semiconductor manufacturers and OSATs worldwide.

⁽¹⁾ Sources: Panel Level Packaging 2025 report – Advanced Packaging Market Monitor, Yole Group

Photo – https://laotiantimes.com/wp-content/uploads/2025/05/panel_level_packaging-2.jpg
Logo – https://laotiantimes.com/wp-content/uploads/2025/05/ers_logo-2.jpg

Strong execution driving market share gains with solid margins

ZURICH, May 8, 2025 /PRNewswire/ — HIGHLIGHTS

• Revenues -2% yoy, +3% qoq; Outperforming markets, Adecco’s relative revenue growth strong, +130 bps
• By GBU, Adecco, -1% yoy, led by APAC +11% and Americas +4%; Akkodis -8%, with Consulting -5%; LHH -5%
• Healthy 19.4% gross margin, -40 bps yoy, reflecting current business mix, firm pricing
• 2.4% EBITA margin excl. one-offs, -40 bps yoy, reflecting agile capacity management, good cost discipline and favourable timing of FESCO JV income
• Operating income €111 million, -11% yoy, constant currency; Net income €60 million, -19% yoy
• Basic EPS €0.36; Adjusted EPS €0.48
• Strong LTM cash conversion 105%. Operating cash flow -€144 million, mainly reflecting working capital absorption for growth, and in line with normal seasonality

Denis Machuel, Adecco Group CEO, commented:

“The consistent, rigorous execution of our strategy continues to pay off. In the first quarter, we gained market share with solid margin performance. We will meet our commitments, navigating increased macroeconomic uncertainty from shifting trade policy with strong cost discipline, securing G&A savings and through the agile management of sales and delivery capacity. We are firmly addressing areas of underperformance and have good traction in the turnaround of Adecco US. We are well positioned to gain further market share through AI-driven innovation and customer proximity in the quarters to come.”

Full Press Release

Webcast Details | Investors & Analysts

Media contact: media@adeccogroup.com 

QINGDAO, China, May 8, 2025 /PRNewswire/ — Haier, a world’s leading household appliances brand, is thrilled to introduce its latest television series: the M80 series of 4K Mini-LED TVs. Co-engineered with KEF, the world-renowned audio technology brand, the M80 series is designed to deliver next-level home entertainment experience to consumers worldwide.

The Haier M80 series TV is poised to elevate home entertainment with its state-of-the-art 4K Mini-LED display. This innovative technology offers brighter images and deeper contrast compared to traditional LCD TVs, while offering a more affordable option for large screens when compared to OLED TVs. Additionally, the M80 series supports HDR10 and Dolby Vision for superior visual quality and holds TÜV certification for Low Blue Light emissions, protecting viewers’ eye health during extended viewing hours.

In collaboration with KEF, a globally renowned HiFi audio brand with over 60 years of expertise in acoustic technology, the Haier M80 series delivers unparalleled audio experience. Thanks to KEF’s meticulous tuning, the TV ensures clear highs, rich mids, and deep, elastic bass, delivered through its 2.1 channel speaker system comprising two main speakers and a dedicated subwoofer. Enhanced with audio technologies such as Dolby Atmos and dbx-tv, the M80 series serves as a home music hub, offering users a harmonious and magical audio experience.

Designed with gaming enthusiasts in mind, the Haier M80 series offers a host of features to enhance gameplay. With a dedicated Game Mode, gamers can select from five picture modes tailored to different game genres: Standard, FPS, RTS, RPG, and RAC. Features such as Shadow Enhancement, which increases brightness in darker areas, and a Cross Hair function for first-person shooters, elevate the gaming experience. The TV also offers various game settings, including Game Mode (LLM), ALLM, refresh rate adjustments, and speaker delay, together ensuring ultra-smooth gameplay. The M80 series supports HDMI 2.1, enabling Dynamic HDR, VRR, ALLM, eARC, and 4K@60Hz, providing a truly immersive gaming journey for users.

Empowered by Google TV and HAICAST, the M80 series offers a seamless smart TV experience at home. HAICAST allows high-quality streaming from mobile devices, supporting HD and 4K Ultra HD movies, versatile media sharing like photos, and enhanced gaming experience. Available in four sizes—55, 65, 75, and 85 inches—the M80 series caters to diverse consumer preferences and room sizes, from dynamic living spaces to cozy bedrooms.

The Haier M80 series 4K Mini-LED TV is a powerful and versatile smart TV designed to meet the diverse needs of modern users. Boasting its leading-edge Mini-LED display technology, KEF audio enhancements, and dedicated gaming optimizations, the Haier M80 TV stands out as an ideal choice for consumers seeking a reliable, feature-rich, and top-quality smart TV that elevates their home entertainment and brings a touch of magic to their everyday life.