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The 28th China Beijing International High-Tech Expo Grand Opening Soon

Technology Leads the Way, Innovation Shares the Future

BEIJING, May 2, 2026 /PRNewswire/ — A report from CCTV.com:

From May 8 to 10, 2026, the 28th China Beijing International High-Tech Expo (hereinafter referred to as CHITEC) will be held at the China National Convention Center in Beijing. Centering on cutting-edge technological strengths, this CHITEC will build an immersive AI ecological experience zone, develop innovative “AI+” application scenarios, and showcase a host of highlights.

Gathering Cutting-edge Sci-tech Strengths for Global Exchanges and Cooperation

The General Administration of Customs of the People’s Republic of China, the Chinese Academy of Sciences and other institutions will present cutting-edge achievements including smart customs and intelligent railway systems. More than 20 provinces and municipalities will conduct cross-regional collaboration to advance technological and industrial cooperation and matchmaking. Multinational corporations such as AstraZeneca and Sanofi will showcase state-of-the-art technologies covering tumor immunotherapy and mRNA vaccines. Innovative enterprises including Seaway and iFLYTEK Spark will also attend the event to jointly facilitate global exchanges and cooperation in the science and technology industry.

Integrating Frontier Innovation with Practical Applications to Build Immersive Experience Spaces

With the “AI+” initiative as the core theme, this CHITEC will launch an immersive AI ecological experience zone. It brings together the latest achievements of nearly 30 enterprises, including Kunlunxin, Baidu ERNIE Large Model, Aiforcetech’s driverless new energy tractors, and 51WORLD digital twin technologies. Award-winning works from the Shangdi UPSIDE AI Competition will also be on display, demonstrating in-depth integrated scenarios of AI technologies across industries and daily life.

Empowering Consumption with Technology to Boost the Construction of an International Consumption Center City

This year’s CHITEC will boost urban consumption upgrading via sci-tech exhibitions and advance the in-depth integration of culture, tourism, commerce, sports and exhibition sectors. A debut platform for new tech consumer products will be established within the exhibition grounds to showcase cutting-edge new offerings, including intelligent terminals, smart home systems and premium consumer electronics. Jointly with key commercial districts, the event will roll out an “Exhibition–Trade Integration Consumption Season”, creating a closed-loop model of “Visit – Experience – Consume” to fully tap into the potential of tech-driven consumption.

We invite global sci-tech professionals to gather in Beijing from May 8 to 10, 2026, to witness innovative breakthroughs and jointly explore opportunities for win-win cooperation.

The 28th China Beijing International High-Tech Expo Grand Opening Soon

Technology Leads the Way, Innovation Shares the Future

BEIJING, May 2, 2026 /PRNewswire/ — A report from CCTV.com:

From May 8 to 10, 2026, the 28th China Beijing International High-Tech Expo (hereinafter referred to as CHITEC) will be held at the China National Convention Center in Beijing. Centering on cutting-edge technological strengths, this CHITEC will build an immersive AI ecological experience zone, develop innovative “AI+” application scenarios, and showcase a host of highlights.

Gathering Cutting-edge Sci-tech Strengths for Global Exchanges and Cooperation

The General Administration of Customs of the People’s Republic of China, the Chinese Academy of Sciences and other institutions will present cutting-edge achievements including smart customs and intelligent railway systems. More than 20 provinces and municipalities will conduct cross-regional collaboration to advance technological and industrial cooperation and matchmaking. Multinational corporations such as AstraZeneca and Sanofi will showcase state-of-the-art technologies covering tumor immunotherapy and mRNA vaccines. Innovative enterprises including Seaway and iFLYTEK Spark will also attend the event to jointly facilitate global exchanges and cooperation in the science and technology industry.

Integrating Frontier Innovation with Practical Applications to Build Immersive Experience Spaces

With the “AI+” initiative as the core theme, this CHITEC will launch an immersive AI ecological experience zone. It brings together the latest achievements of nearly 30 enterprises, including Kunlunxin, Baidu ERNIE Large Model, Aiforcetech’s driverless new energy tractors, and 51WORLD digital twin technologies. Award-winning works from the Shangdi UPSIDE AI Competition will also be on display, demonstrating in-depth integrated scenarios of AI technologies across industries and daily life.

Empowering Consumption with Technology to Boost the Construction of an International Consumption Center City

This year’s CHITEC will boost urban consumption upgrading via sci-tech exhibitions and advance the in-depth integration of culture, tourism, commerce, sports and exhibition sectors. A debut platform for new tech consumer products will be established within the exhibition grounds to showcase cutting-edge new offerings, including intelligent terminals, smart home systems and premium consumer electronics. Jointly with key commercial districts, the event will roll out an “Exhibition–Trade Integration Consumption Season”, creating a closed-loop model of “Visit – Experience – Consume” to fully tap into the potential of tech-driven consumption.

We invite global sci-tech professionals to gather in Beijing from May 8 to 10, 2026, to witness innovative breakthroughs and jointly explore opportunities for win-win cooperation.

The 28th China Beijing International High-Tech Expo Grand Opening Soon

Technology Leads the Way, Innovation Shares the Future

BEIJING, May 2, 2026 /PRNewswire/ — A report from CCTV.com:

From May 8 to 10, 2026, the 28th China Beijing International High-Tech Expo (hereinafter referred to as CHITEC) will be held at the China National Convention Center in Beijing. Centering on cutting-edge technological strengths, this CHITEC will build an immersive AI ecological experience zone, develop innovative “AI+” application scenarios, and showcase a host of highlights.

Gathering Cutting-edge Sci-tech Strengths for Global Exchanges and Cooperation

The General Administration of Customs of the People’s Republic of China, the Chinese Academy of Sciences and other institutions will present cutting-edge achievements including smart customs and intelligent railway systems. More than 20 provinces and municipalities will conduct cross-regional collaboration to advance technological and industrial cooperation and matchmaking. Multinational corporations such as AstraZeneca and Sanofi will showcase state-of-the-art technologies covering tumor immunotherapy and mRNA vaccines. Innovative enterprises including Seaway and iFLYTEK Spark will also attend the event to jointly facilitate global exchanges and cooperation in the science and technology industry.

Integrating Frontier Innovation with Practical Applications to Build Immersive Experience Spaces

With the “AI+” initiative as the core theme, this CHITEC will launch an immersive AI ecological experience zone. It brings together the latest achievements of nearly 30 enterprises, including Kunlunxin, Baidu ERNIE Large Model, Aiforcetech’s driverless new energy tractors, and 51WORLD digital twin technologies. Award-winning works from the Shangdi UPSIDE AI Competition will also be on display, demonstrating in-depth integrated scenarios of AI technologies across industries and daily life.

Empowering Consumption with Technology to Boost the Construction of an International Consumption Center City

This year’s CHITEC will boost urban consumption upgrading via sci-tech exhibitions and advance the in-depth integration of culture, tourism, commerce, sports and exhibition sectors. A debut platform for new tech consumer products will be established within the exhibition grounds to showcase cutting-edge new offerings, including intelligent terminals, smart home systems and premium consumer electronics. Jointly with key commercial districts, the event will roll out an “Exhibition–Trade Integration Consumption Season”, creating a closed-loop model of “Visit – Experience – Consume” to fully tap into the potential of tech-driven consumption.

We invite global sci-tech professionals to gather in Beijing from May 8 to 10, 2026, to witness innovative breakthroughs and jointly explore opportunities for win-win cooperation.

MOREH Demonstrates Production-Ready LLM Inference on Tenstorrent Galaxy, Achieving DGX A100-Class Performance with Improved Cost Efficiency

Reduces HBM Costs with GPU–Tenstorrent Heterogeneous Distributed Serving
First unveiled at Tenstorrent’s launch event, TT-Deploy, in San Francisco on May 1

SANTA CLARA, Calif., May 2, 2026 /PRNewswire/ — Moreh, an AI infrastructure software company, led by CEO Gangwon Jo, announced that it has successfully validated LLM inference performance on the Tenstorrent Galaxy Wormhole system using its proprietary ‘MoAI Inference Framework.’

Based on tests across leading Mixture-of-Experts (MoE) models—including GPT-OSS, Qwen, GLM, and DeepSeek—Moreh achieved LLM inference performance on Tenstorrent Galaxy Wormhole matching or surpassing NVIDIA DGX A100-class systems, demonstrating a compelling alternative to conventional GPU-centric AI infrastructure.

Moreh also improved cost efficiency by implementing a disaggregated serving architecture that combines GPUs with Tenstorrent Wormhole chips. By utilizing Tenstorrent processors as dedicated prefill accelerators, the company reduced reliance on high-cost HBM and lowered overall infrastructure costs.

The results were first unveiled at Tenstorrent’s launch event, TT-Deploy, held on May 1 in San Francisco.

As a strategic partner of Tenstorrent and a major external contributor to Metalium, Moreh showcased a live LLM inference demo at the event. Building on its experience operating AMD GPU-based production environments in real-world data centers, the company presented its latest technical achievements in ‘Production-Ready LLM Inference on Tenstorrent Galaxy.’

MoAI Inference Framework is a disaggregated inference solution that enables unified operation of heterogeneous GPUs and NPUs—including NVIDIA, AMD, and Tenstorrent—within a single cluster. This allows enterprises to build flexible AI infrastructure strategies without vendor lock-in.

Moreh CEO Gangwon Jo stated, “Achieving production-grade LLM inference performance and stability on Tenstorrent-based systems marks a significant milestone,” and added, “We will continue to enhance performance through deeper optimization across heterogeneous architectures and closer integration with Tenstorrent NPUs.”

Moreh is developing its own core AI infrastructure engine and, through its foundation LLM subsidiary Motif Technologies, is building end-to-end capabilities spanning both infrastructure and model domains. Simultaneously, the company is making its mark in the global market through collaborations with key partners such as AMD, Tenstorrent, and SGLang.

MOREH Demonstrates Production-Ready LLM Inference on Tenstorrent Galaxy, Achieving DGX A100-Class Performance with Improved Cost Efficiency

Reduces HBM Costs with GPU–Tenstorrent Heterogeneous Distributed Serving
First unveiled at Tenstorrent’s launch event, TT-Deploy, in San Francisco on May 1

SANTA CLARA, Calif., May 2, 2026 /PRNewswire/ — Moreh, an AI infrastructure software company, led by CEO Gangwon Jo, announced that it has successfully validated LLM inference performance on the Tenstorrent Galaxy Wormhole system using its proprietary ‘MoAI Inference Framework.’

Based on tests across leading Mixture-of-Experts (MoE) models—including GPT-OSS, Qwen, GLM, and DeepSeek—Moreh achieved LLM inference performance on Tenstorrent Galaxy Wormhole matching or surpassing NVIDIA DGX A100-class systems, demonstrating a compelling alternative to conventional GPU-centric AI infrastructure.

Moreh also improved cost efficiency by implementing a disaggregated serving architecture that combines GPUs with Tenstorrent Wormhole chips. By utilizing Tenstorrent processors as dedicated prefill accelerators, the company reduced reliance on high-cost HBM and lowered overall infrastructure costs.

The results were first unveiled at Tenstorrent’s launch event, TT-Deploy, held on May 1 in San Francisco.

As a strategic partner of Tenstorrent and a major external contributor to Metalium, Moreh showcased a live LLM inference demo at the event. Building on its experience operating AMD GPU-based production environments in real-world data centers, the company presented its latest technical achievements in ‘Production-Ready LLM Inference on Tenstorrent Galaxy.’

MoAI Inference Framework is a disaggregated inference solution that enables unified operation of heterogeneous GPUs and NPUs—including NVIDIA, AMD, and Tenstorrent—within a single cluster. This allows enterprises to build flexible AI infrastructure strategies without vendor lock-in.

Moreh CEO Gangwon Jo stated, “Achieving production-grade LLM inference performance and stability on Tenstorrent-based systems marks a significant milestone,” and added, “We will continue to enhance performance through deeper optimization across heterogeneous architectures and closer integration with Tenstorrent NPUs.”

Moreh is developing its own core AI infrastructure engine and, through its foundation LLM subsidiary Motif Technologies, is building end-to-end capabilities spanning both infrastructure and model domains. Simultaneously, the company is making its mark in the global market through collaborations with key partners such as AMD, Tenstorrent, and SGLang.

MOREH Demonstrates Production-Ready LLM Inference on Tenstorrent Galaxy, Achieving DGX A100-Class Performance with Improved Cost Efficiency

Reduces HBM Costs with GPU–Tenstorrent Heterogeneous Distributed Serving
First unveiled at Tenstorrent’s launch event, TT-Deploy, in San Francisco on May 1

SANTA CLARA, Calif., May 2, 2026 /PRNewswire/ — Moreh, an AI infrastructure software company, led by CEO Gangwon Jo, announced that it has successfully validated LLM inference performance on the Tenstorrent Galaxy Wormhole system using its proprietary ‘MoAI Inference Framework.’

Based on tests across leading Mixture-of-Experts (MoE) models—including GPT-OSS, Qwen, GLM, and DeepSeek—Moreh achieved LLM inference performance on Tenstorrent Galaxy Wormhole matching or surpassing NVIDIA DGX A100-class systems, demonstrating a compelling alternative to conventional GPU-centric AI infrastructure.

Moreh also improved cost efficiency by implementing a disaggregated serving architecture that combines GPUs with Tenstorrent Wormhole chips. By utilizing Tenstorrent processors as dedicated prefill accelerators, the company reduced reliance on high-cost HBM and lowered overall infrastructure costs.

The results were first unveiled at Tenstorrent’s launch event, TT-Deploy, held on May 1 in San Francisco.

As a strategic partner of Tenstorrent and a major external contributor to Metalium, Moreh showcased a live LLM inference demo at the event. Building on its experience operating AMD GPU-based production environments in real-world data centers, the company presented its latest technical achievements in ‘Production-Ready LLM Inference on Tenstorrent Galaxy.’

MoAI Inference Framework is a disaggregated inference solution that enables unified operation of heterogeneous GPUs and NPUs—including NVIDIA, AMD, and Tenstorrent—within a single cluster. This allows enterprises to build flexible AI infrastructure strategies without vendor lock-in.

Moreh CEO Gangwon Jo stated, “Achieving production-grade LLM inference performance and stability on Tenstorrent-based systems marks a significant milestone,” and added, “We will continue to enhance performance through deeper optimization across heterogeneous architectures and closer integration with Tenstorrent NPUs.”

Moreh is developing its own core AI infrastructure engine and, through its foundation LLM subsidiary Motif Technologies, is building end-to-end capabilities spanning both infrastructure and model domains. Simultaneously, the company is making its mark in the global market through collaborations with key partners such as AMD, Tenstorrent, and SGLang.

CityUHK (Dongguan) 2026 Campus Open Day draws over 50,000 participants

DONGGUAN, China, May 2, 2026 /PRNewswire/ — City University of Hong Kong (Dongguan) held its 2026 Campus Open Day on 1 May, attracting more than 50,000 online and offline visitors, and showcasing its academic strengths, facilities and student-centred learning environment.

Library at City University of Hong Kong (Dongguan)
Library at City University of Hong Kong (Dongguan)

Held at main and parallel venues, the Open Day featured university introduction, programme briefings, consultations, student sharing, public lectures and immersive activities.

In his opening address, Professor Lu Chun, Executive President of CityUHK (Dongguan), highlighted the University’s first master’s graduates’ achievements. He noted that the outstanding 2026 graduates demonstrated strong academics, cutting-edge tech mastery and practical experience from top enterprises, with the University aiming to nurture versatile talents for the AI era.

Professor Julie Juan LI, Vice President (Academic) of CityUHK (Dongguan), stated that CityUHK (Dongguan) inherits the world-class academic strengths of CityUHK, which is ranked 63rd globally and 7th in Asia in the 2026 QS World University Rankings, and has been named the “World’s Most International University” by THE for three consecutive years. She underlined the University’s full alignment with CityUHK’s academic standards and resources, sustaining consistent educational excellence through cross-campus collaboration.

In her speech, Ms Yin Rongrong, Director of the Admissions Office, noted that the University recruits students from Chinese mainland, Hong Kong, Macao, Taiwan regions and overseas. Undergraduates obtain a graduation certificate and degree certificate from CityUHK (Dongguan), together with a degree certificate from City University of Hong Kong.

CityUHK (Dongguan) offers five undergraduate programmes including Computer Science, Materials Science and Engineering, Energy Science and Engineering, Intelligent Manufacturing Engineering and Data Science, and a suite of taught postgraduate programmes, all at world-leading standards.

Zhang Ziqian, a first-year undergraduate, shared his campus experience. He highlighted the University’s “no-major upon entry” system, English-medium instruction and global exchange opportunities, which enable students to explore academic interests and strengthen international competitiveness.

Professor CHIU Chi Yue, Vice President (Administration), Dr Li Yuan, Associate Vice-President (Teaching and Development), and Professor Li Yi, Head of the Department of Materials Science and Engineering, delivered public lectures on university choice in the AI era, future-ready learning and further education pathways.

Strategically located in Songshan Lake Science City, the University is embedded in an innovation ecosystem alongside major national scientific facilities and leading enterprises. Its Phase II campus, due for completion in 2028, will further enhance research and talent development.

For more information, please visit the University’s website: https://www.cityu-dg.edu.cn/en/home.html

CityUHK (Dongguan) 2026 Campus Open Day draws over 50,000 participants

DONGGUAN, China, May 2, 2026 /PRNewswire/ — City University of Hong Kong (Dongguan) held its 2026 Campus Open Day on 1 May, attracting more than 50,000 online and offline visitors, and showcasing its academic strengths, facilities and student-centred learning environment.

Library at City University of Hong Kong (Dongguan)
Library at City University of Hong Kong (Dongguan)

Held at main and parallel venues, the Open Day featured university introduction, programme briefings, consultations, student sharing, public lectures and immersive activities.

In his opening address, Professor Lu Chun, Executive President of CityUHK (Dongguan), highlighted the University’s first master’s graduates’ achievements. He noted that the outstanding 2026 graduates demonstrated strong academics, cutting-edge tech mastery and practical experience from top enterprises, with the University aiming to nurture versatile talents for the AI era.

Professor Julie Juan LI, Vice President (Academic) of CityUHK (Dongguan), stated that CityUHK (Dongguan) inherits the world-class academic strengths of CityUHK, which is ranked 63rd globally and 7th in Asia in the 2026 QS World University Rankings, and has been named the “World’s Most International University” by THE for three consecutive years. She underlined the University’s full alignment with CityUHK’s academic standards and resources, sustaining consistent educational excellence through cross-campus collaboration.

In her speech, Ms Yin Rongrong, Director of the Admissions Office, noted that the University recruits students from Chinese mainland, Hong Kong, Macao, Taiwan regions and overseas. Undergraduates obtain a graduation certificate and degree certificate from CityUHK (Dongguan), together with a degree certificate from City University of Hong Kong.

CityUHK (Dongguan) offers five undergraduate programmes including Computer Science, Materials Science and Engineering, Energy Science and Engineering, Intelligent Manufacturing Engineering and Data Science, and a suite of taught postgraduate programmes, all at world-leading standards.

Zhang Ziqian, a first-year undergraduate, shared his campus experience. He highlighted the University’s “no-major upon entry” system, English-medium instruction and global exchange opportunities, which enable students to explore academic interests and strengthen international competitiveness.

Professor CHIU Chi Yue, Vice President (Administration), Dr Li Yuan, Associate Vice-President (Teaching and Development), and Professor Li Yi, Head of the Department of Materials Science and Engineering, delivered public lectures on university choice in the AI era, future-ready learning and further education pathways.

Strategically located in Songshan Lake Science City, the University is embedded in an innovation ecosystem alongside major national scientific facilities and leading enterprises. Its Phase II campus, due for completion in 2028, will further enhance research and talent development.

For more information, please visit the University’s website: https://www.cityu-dg.edu.cn/en/home.html