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TRUMPF makes glass substrates ready for the next generation of AI chips

The future of AI chips is increasingly being shaped by packaging // With its HiPIMS product line, TRUMPF is addressing a key challenge facing the semiconductor industry: the reliable coating of highly complex glass substrates for the next generation of high-performance AI processors.DITZINGEN, GERMANY / TAIPEI, TAIWAN - ...

Semicon Taiwan: TRUMPF Enables Integrated Chip Cooling for the Next Generation of AI Chips

Advanced packaging requires integrated cooling at the semiconductor level // TRUMPF uses ultrashort-pulse lasers...
Media OutReach Newswire

Sino Land reports 13.3% revenue growth and a 14.2% increase in net profit attributable to shareholders for FY2025/26

Awarded first pilot area in the Northern Metropolis, demonstrating the Group’s confidence in Hong...
Media OutReach Newswire

TempraMed Signs Letter of Intent with CPO Greece for Exclusive Distribution of VIVI Products in Greece

Distribution framework pairs TempraMed's injectable medication-protection products with one of the largest, most established...
Media OutReach Newswire

InnoHK R&D Centres Establish Base at Science Park to Drive Emerging Industries and Pioneer Future Innovation

HONG KONG SAR – Media OutReach Newswire – 1 September 2026 – Hong...
Media OutReach Newswire

The Global Debate Around Social Media Surveillance

Social media platforms have become an indispensable part of the current digital era. The online behavior of the people is somewhat a manifestation of...
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