ENNOVI-SealTech: Patent-pending busbar sealing prevents coolant leaks, offering manufacturing efficiency and design flexibility over traditional methods.

SINGAPORE, May 8, 2025 /PRNewswire/ — ENNOVI, a mobility electrification solutions partner, introduces a new technology for sealing busbars, which prevents coolant leakage in hybrid and electric vehicle (xEV) drivetrain applications. ENNOVI-SealTech can be used with either busbars or other interconnects to accommodate applications such as motors, inverters or oil pump interfaces.

ENNOVI-SealTech: Patent-pending busbar sealing prevents coolant leaks, offering manufacturing efficiency and design flexibility over traditional methods.

“Managing busbar interfaces in EVs where coolant is present on one side and a dry, electrically robust connection is required on the other side, presents several challenges,” explains Dominik Pawlik, Product Portfolio Director for Power Interconnects at ENNOVI. “Conventional sealing methods, such as potting or using rubber O-rings or gaskets, incur the high cost and time for secondary processes and/or issues with leakage over the lifetime of the assembly – ENNOVI-SealTech overcomes all these limitations.”

ENNOVI-SealTech offers two sealing methods: double-walled shrink tubes or adhesive tape for challenging applications. Both eliminate post-processing, enhancing manufacturing efficiency and design flexibility without sacrificing sealing performance.

ENNOVI-SealTech technology is subjected to rigorous testing to ensure it meets the specific requirements of each design. Every configuration is validated through a comprehensive testing process, including thermal aging at 150°C for 1,000 hours, and thermal shock cycling from -40°C to +150°C for 600 cycles (15 minutes per cycle), in accordance with the EN 60068-2 standard. A leak test is also performed to verify sealing integrity.

The use of shrink tubing or tape allows ENNOVI-SealTech to adapt to virtually any busbar shape and design specification. Moreover, the technology is compatible with a wide range of metals and plastics, including copper (Cu), aluminum (Al), PA66, PBT, PC, and others.

For more information about ENNOVI-SealTech, please visit here.

About ENNOVI:

At ENNOVI, we design and manufacture products and solutions for electrical battery platform developments, power components, and signal interconnect design solutions. Using our decades of experience in electro-mechanical engineering and high-precision manufacturing, we work with EV OEMs and suppliers to bring their ideas to life. As a Mobility Electrification Solutions Partner, we accelerate the process for our EV customers by offering complete end-to-end manufacturing capabilities from R&D, design, and tooling to production. Learn more at www.ennovi.com.

Agency Contact:

Selvan Wilhelm
Selvan.Wilhelm@ennovi.com  

Erin McMahon
erin.mcmahon@publitek.com 

ZHUBEI, May 8, 2025 /PRNewswire/ — ERS electronic, the industry leader of thermal management solutions for semiconductor manufacturing, is excited to announce the opening of its latest demonstration center in Zhubei, Taiwan. This new facility will offer chipmakers and OSATs in Taiwan direct access to ERS’s PhotoThermal debonding machine for wafers and panels, LUM600S1, a strategic move to meet the growing demand for panel-level packaging (PLP) technologies in the region.

Source: Panel Level Packaging 2025 report, Yole Group

Panel-level packaging is rapidly gaining traction in the semiconductor industry due to its cost advantages and process scalability. Dr. Yik Yee Tan, Technology & Market Principal Analyst at Yole Group, predicts that the market will grow from $160 million in 2024 to over $600 million by 2030, driven by cost-efficient solutions in advanced packaging. By 2030, high-density fan-out technology, propelled by Generative AI, is expected to dominate the market, capturing more than 50% of the market share⁽¹⁾. In Chiplet and Heterogeneous Integration demand for larger form factor is driving the growth of PLP in the coming years to meet higher density requirement. For large package size of ~5.5x reticle size limit, PLP can boost carrier area efficiency by more than 80%, compared to just 45% with Wafer Level Packaging (WLP).

In addition to wafer solutions, ERS was among the first to bring PLP equipment to the market, introducing a panel-level debonder in 2018. Today, ERS offers a wide portfolio of semi- and fully-automatic systems, including PhotoThermal debonding machines enabling temporary bonding and debonding (TBDB) processes essential for handling ultra-thin substrates, which is critical for HPC and AI applications, like CoWoS and HBM.

 “With LUM600S1, we are providing a high-yield solution tailored for high-volume manufacturing of complex AI chips. Our Taiwanese customers can now experience firsthand how PhotoThermal Debonding enhances efficiency, scalability, and cost-effectiveness,” says Sébastien Perino, Managing Director of ERS Taiwan.

For more information about the Zhubei demonstration center and LUM600S1’s availability for testing and demonstration, please visit ERS’s website to get in contact with regional sales representatives.

About ERS:

ERS electronic GmbH, based in the Munich suburb of Germering, has been providing innovative thermal management solutions to the semiconductor industry for more than 50 years. The company has gained an outstanding reputation, notably with its fast and accurate air cooling-based thermal chuck systems for wafer probing. In 2008, ERS extended its expertise to the Advanced Packaging market. Today, their fully automatic and manual debonding and warpage adjust systems can be found on the production floors of most semiconductor manufacturers and OSATs worldwide.

⁽¹⁾ Sources: Panel Level Packaging 2025 report – Advanced Packaging Market Monitor, Yole Group

ZHUBEI, Taiwan, May 8, 2025 /PRNewswire/ — ERS electronic, the industry leader of thermal management solutions for semiconductor manufacturing, is excited to announce the opening of its latest demonstration center in Zhubei, Taiwan. This new facility will offer chipmakers and OSATs in Taiwan direct access to ERS’s PhotoThermal debonding machine for wafers and panels, LUM600S1, a strategic move to meet the growing demand for panel-level packaging (PLP) technologies in the region.

Source: Panel Level Packaging 2025 report, Yole Group

Panel-level packaging is rapidly gaining traction in the semiconductor industry due to its cost advantages and process scalability. Dr. Yik Yee Tan, Technology & Market Principal Analyst at Yole Group, predicts that the market will grow from $160 million in 2024 to over $600 million by 2030, driven by cost-efficient solutions in advanced packaging. By 2030, high-density fan-out technology, propelled by Generative AI, is expected to dominate the market, capturing more than 50% of the market share⁽¹⁾. In Chiplet and Heterogeneous Integration demand for larger form factor is driving the growth of PLP in the coming years to meet higher density requirement. For large package size of ~5.5x reticle size limit, PLP can boost carrier area efficiency by more than 80%, compared to just 45% with Wafer Level Packaging (WLP).

In addition to wafer solutions, ERS was among the first to bring PLP equipment to the market, introducing a panel-level debonder in 2018. Today, ERS offers a wide portfolio of semi- and fully-automatic systems, including PhotoThermal debonding machines enabling temporary bonding and debonding (TBDB) processes essential for handling ultra-thin substrates, which is critical for HPC and AI applications, like CoWoS and HBM.

 “With LUM600S1, we are providing a high-yield solution tailored for high-volume manufacturing of complex AI chips. Our Taiwanese customers can now experience firsthand how PhotoThermal Debonding enhances efficiency, scalability, and cost-effectiveness,” says Sébastien Perino, Managing Director of ERS Taiwan.

For more information about the Zhubei demonstration center and LUM600S1’s availability for testing and demonstration, please visit ERS’s website to get in contact with regional sales representatives.

About ERS:

ERS electronic GmbH, based in the Munich suburb of Germering, has been providing innovative thermal management solutions to the semiconductor industry for more than 50 years. The company has gained an outstanding reputation, notably with its fast and accurate air cooling-based thermal chuck systems for wafer probing. In 2008, ERS extended its expertise to the Advanced Packaging market. Today, their fully automatic and manual debonding and warpage adjust systems can be found on the production floors of most semiconductor manufacturers and OSATs worldwide.

⁽¹⁾ Sources: Panel Level Packaging 2025 report – Advanced Packaging Market Monitor, Yole Group

Photo – https://laotiantimes.com/wp-content/uploads/2025/05/panel_level_packaging-1.jpg
Logo – https://laotiantimes.com/wp-content/uploads/2025/05/ers_logo-1.jpg

ZHUBEI, Taiwan, May 8, 2025 /PRNewswire/ — ERS electronic, the industry leader of thermal management solutions for semiconductor manufacturing, is excited to announce the opening of its latest demonstration center in Zhubei, Taiwan. This new facility will offer chipmakers and OSATs in Taiwan direct access to ERS’s PhotoThermal debonding machine for wafers and panels, LUM600S1, a strategic move to meet the growing demand for panel-level packaging (PLP) technologies in the region.

Source: Panel Level Packaging 2025 report, Yole Group

Panel-level packaging is rapidly gaining traction in the semiconductor industry due to its cost advantages and process scalability. Dr. Yik Yee Tan, Technology & Market Principal Analyst at Yole Group, predicts that the market will grow from $160 million in 2024 to over $600 million by 2030, driven by cost-efficient solutions in advanced packaging. By 2030, high-density fan-out technology, propelled by Generative AI, is expected to dominate the market, capturing more than 50% of the market share⁽¹⁾. In Chiplet and Heterogeneous Integration demand for larger form factor is driving the growth of PLP in the coming years to meet higher density requirement. For large package size of ~5.5x reticle size limit, PLP can boost carrier area efficiency by more than 80%, compared to just 45% with Wafer Level Packaging (WLP).

In addition to wafer solutions, ERS was among the first to bring PLP equipment to the market, introducing a panel-level debonder in 2018. Today, ERS offers a wide portfolio of semi- and fully-automatic systems, including PhotoThermal debonding machines enabling temporary bonding and debonding (TBDB) processes essential for handling ultra-thin substrates, which is critical for HPC and AI applications, like CoWoS and HBM.

 “With LUM600S1, we are providing a high-yield solution tailored for high-volume manufacturing of complex AI chips. Our Taiwanese customers can now experience firsthand how PhotoThermal Debonding enhances efficiency, scalability, and cost-effectiveness,” says Sébastien Perino, Managing Director of ERS Taiwan.

For more information about the Zhubei demonstration center and LUM600S1’s availability for testing and demonstration, please visit ERS’s website to get in contact with regional sales representatives.

About ERS:

ERS electronic GmbH, based in the Munich suburb of Germering, has been providing innovative thermal management solutions to the semiconductor industry for more than 50 years. The company has gained an outstanding reputation, notably with its fast and accurate air cooling-based thermal chuck systems for wafer probing. In 2008, ERS extended its expertise to the Advanced Packaging market. Today, their fully automatic and manual debonding and warpage adjust systems can be found on the production floors of most semiconductor manufacturers and OSATs worldwide.

⁽¹⁾ Sources: Panel Level Packaging 2025 report – Advanced Packaging Market Monitor, Yole Group

Photo – https://laotiantimes.com/wp-content/uploads/2025/05/panel_level_packaging-2.jpg
Logo – https://laotiantimes.com/wp-content/uploads/2025/05/ers_logo-2.jpg

Strong execution driving market share gains with solid margins

ZURICH, May 8, 2025 /PRNewswire/ — HIGHLIGHTS

• Revenues -2% yoy, +3% qoq; Outperforming markets, Adecco’s relative revenue growth strong, +130 bps
• By GBU, Adecco, -1% yoy, led by APAC +11% and Americas +4%; Akkodis -8%, with Consulting -5%; LHH -5%
• Healthy 19.4% gross margin, -40 bps yoy, reflecting current business mix, firm pricing
• 2.4% EBITA margin excl. one-offs, -40 bps yoy, reflecting agile capacity management, good cost discipline and favourable timing of FESCO JV income
• Operating income €111 million, -11% yoy, constant currency; Net income €60 million, -19% yoy
• Basic EPS €0.36; Adjusted EPS €0.48
• Strong LTM cash conversion 105%. Operating cash flow -€144 million, mainly reflecting working capital absorption for growth, and in line with normal seasonality

Denis Machuel, Adecco Group CEO, commented:

“The consistent, rigorous execution of our strategy continues to pay off. In the first quarter, we gained market share with solid margin performance. We will meet our commitments, navigating increased macroeconomic uncertainty from shifting trade policy with strong cost discipline, securing G&A savings and through the agile management of sales and delivery capacity. We are firmly addressing areas of underperformance and have good traction in the turnaround of Adecco US. We are well positioned to gain further market share through AI-driven innovation and customer proximity in the quarters to come.”

Full Press Release

Webcast Details | Investors & Analysts

Media contact: media@adeccogroup.com 

QINGDAO, China, May 8, 2025 /PRNewswire/ — Haier, a world’s leading household appliances brand, is thrilled to introduce its latest television series: the M80 series of 4K Mini-LED TVs. Co-engineered with KEF, the world-renowned audio technology brand, the M80 series is designed to deliver next-level home entertainment experience to consumers worldwide.

The Haier M80 series TV is poised to elevate home entertainment with its state-of-the-art 4K Mini-LED display. This innovative technology offers brighter images and deeper contrast compared to traditional LCD TVs, while offering a more affordable option for large screens when compared to OLED TVs. Additionally, the M80 series supports HDR10 and Dolby Vision for superior visual quality and holds TÜV certification for Low Blue Light emissions, protecting viewers’ eye health during extended viewing hours.

In collaboration with KEF, a globally renowned HiFi audio brand with over 60 years of expertise in acoustic technology, the Haier M80 series delivers unparalleled audio experience. Thanks to KEF’s meticulous tuning, the TV ensures clear highs, rich mids, and deep, elastic bass, delivered through its 2.1 channel speaker system comprising two main speakers and a dedicated subwoofer. Enhanced with audio technologies such as Dolby Atmos and dbx-tv, the M80 series serves as a home music hub, offering users a harmonious and magical audio experience.

Designed with gaming enthusiasts in mind, the Haier M80 series offers a host of features to enhance gameplay. With a dedicated Game Mode, gamers can select from five picture modes tailored to different game genres: Standard, FPS, RTS, RPG, and RAC. Features such as Shadow Enhancement, which increases brightness in darker areas, and a Cross Hair function for first-person shooters, elevate the gaming experience. The TV also offers various game settings, including Game Mode (LLM), ALLM, refresh rate adjustments, and speaker delay, together ensuring ultra-smooth gameplay. The M80 series supports HDMI 2.1, enabling Dynamic HDR, VRR, ALLM, eARC, and 4K@60Hz, providing a truly immersive gaming journey for users.

Empowered by Google TV and HAICAST, the M80 series offers a seamless smart TV experience at home. HAICAST allows high-quality streaming from mobile devices, supporting HD and 4K Ultra HD movies, versatile media sharing like photos, and enhanced gaming experience. Available in four sizes—55, 65, 75, and 85 inches—the M80 series caters to diverse consumer preferences and room sizes, from dynamic living spaces to cozy bedrooms.

The Haier M80 series 4K Mini-LED TV is a powerful and versatile smart TV designed to meet the diverse needs of modern users. Boasting its leading-edge Mini-LED display technology, KEF audio enhancements, and dedicated gaming optimizations, the Haier M80 TV stands out as an ideal choice for consumers seeking a reliable, feature-rich, and top-quality smart TV that elevates their home entertainment and brings a touch of magic to their everyday life.

BANGKOK, May 8, 2025 /PRNewswire/ — Kubix Digital Asset, Thailand’s leading ICO portal under the Orbix Holdings, has entered into a strategic collaboration with D3 Labs, a leading Web3 infrastructure provider in Asia. The collaboration was officially announced at Money 20/20 Asia in Bangkok. This partnership aims to create a bridge between Thai digital token projects and global investors, focusing on cross-border accessibility, regulatory readiness, and technological scalability.

As Thailand’s digital token ecosystem continues to evolve with growing regulatory clarity and market maturity, Kubix and D3 Labs share a common vision: to unlock the full potential of tokenized fundraising, expand access to a wider variety of real-world asset investments for Web3 investors, and elevate Thai digital token products to the global stage.

Kubix: Bridging Thai Digital Tokens to the World

Kubix has played a pioneering role in Thailand’s digital asset ecosystem. With strong regulatory foundations now in place, Kubix is entering a new chapter: enabling Thai issuers to expand globally.

• Cross-Border Pathways: The partnership with D3 Labs enables Thai issuers to access a broader investor base through compliant, borderless infrastructure.
• Diverse Deal Expansion: Future-ready projects—such as alternative investments, innovation-based ventures, and commodity-linked tokens—are central to Kubix’s roadmap.
• Regulatory Tailwinds: The recent revision by the SEC to Thailand’s digital asset criteria—allowing USDC and USDT to be used in ICO transactions and trading—highlights the country’s regulatory openness and strengthens the global viability of Thai-issued digital assets.

“We’re seeing growing demand from Thai issuers to scale beyond the local market,” said Partomchai Tangnoi, Managing Director of Kubix. “This partnership with D3 Labs is a key step toward building global bridges for our ecosystem and creating real impact for issuers and investors.”

D3 Labs: Unlocking Scalable Infrastructure for Cross-Border Tokenization

D3 Labs is building the foundational Web3 infrastructure that enables asset tokenization at scale, with compliance and interoperability at its core. As the Southeast Asian region advances its regulatory frameworks, D3 Labs is committed to empowering forward-thinking platforms like Kubix through enterprise-grade, cross-border, blockchain-agnostic, and regulator-aligned solutions.

The collaboration with Kubix reflects D3 Labs’ vision of unlocking the full potential of tokenized capital markets across Asia, starting with Thailand’s rapidly maturing ecosystem and expanding to new global investor bases.

Lai Chung Ying, Co-Founder and Co-CEO of D3 Labs, added, “This partnership with Kubix is not just a technical integration—it’s a strategic alignment of values. Together, we’re laying the infrastructure for compliant, borderless fundraising and helping to redefine how investment products can be accessed and distributed in the Web3 economy.”

Driving the Future of Global Tokenization

The collaboration marks a significant step toward making Thai digital tokens accessible beyond domestic borders. Combining Kubix’s leadership in approved and regulated ICO portals with D3 Labs’ global Web3 infrastructure, both parties share a common goal: to open new doors for cross-border fundraising, unlock fresh opportunities for investors, and drive the growth of the asset tokenization market in Southeast Asia and beyond.

About Kubix:

Kubix Digital Asset Co., Ltd., a subsidiary of Orbix Holdings under KASIKORNBANK Financial Conglomerate KASIKORNBANK operates as a licensed ICO portal in Thailand, facilitating capital raising through digital tokens and providing access to innovative investment opportunities. Learn more at: https://www.kubix.co

About D3 Labs:

D3 Labs, founded in September 2022, is a leading Asia-based Web3 infrastructure provider that delivers enterprise-grade Distributed Ledger Technology (DLT) solutions. Focused on empowering financial institutions and digital asset ecosystems, D3 Labs enhances operational efficiency, strengthens security, and increases the transparency and liquidity of tokenized assets. Learn more at: https://www.d3labs.io