3CLogic Unveils Groundbreaking Integration with ServiceNow to Transform Voice-Driven Self-Service, Enhancing Employee and Customer Experience, Boosting Efficiency, and Reducing Operational Costs

ROCKVILLE, Md., April 14, 2025 /PRNewswire/ — 3CLogic, the AI-powered contact center solution provider built for ServiceNow®, and ServiceNow (NYSE: NOW), the AI platform for business transformation, have expanded their successful partnership to deliver a groundbreaking, end-to-end AI-powered solution for both employee and customer experiences. This solution combines ServiceNow Customer Relationship Management (CRM) products with 3CLogic’s next-generation Customer Experience (CX) platform. The result is a unified solution that enables users to streamline self-service and assisted service operations, reduce operational costs, and enhance both agent efficiency and customer satisfaction.

“These AI-powered solutions help businesses struggling with disconnected CRM and CCaaS systems. By embedding native voice controls, intelligent routing, and real-time insights directly into ServiceNow, we’re delivering a seamless, scalable customer contact center experience,” said Terence Chesire, VP of Product Management for CRM and Industry Workflows at ServiceNow. “This unified approach enhances both self-service and agent-assisted interactions—helping to drive efficiency, reduce costs, and improve service quality at every touchpoint. Always with a focus on delivering customers’ requests.”

Transforming Contact Center Operations with AI
In today’s fast-paced business environment, organizations demand more efficient and effective ways to engage with customers and employees. The new solution from ServiceNow and 3CLogic delivers an innovative approach to contact center management with key features designed to increase productivity and enhance service quality.

Single Agent Experience Across All Channels
The latest 3CLogic integration will include the use of ServiceNow’s newest Native Voice Controls directly embedded in the Customer Service Management (CSM) Configurable Workspace, whereby agents will be able to manage voice interactions alongside digital cases from a single platform. The approach will replace the previous floating Computer Telephony Integration (CTI) frame to extend a more streamlined agent experience while delivering immediate context on the caller, relevant data, and actionable guidance—all in one view.

Real-Time Transcription and AI-Powered Insights
3CLogic’s Real-Time Transcription (RTT) will seamlessly integrate into ServiceNow’s configurable agent workspace, allowing agents to focus entirely on customer issues without the need to take notes. With ServiceNow’s AI capabilities, transcriptions can automatically be transformed into summaries and resolution notes, reducing lengthy call wrap-up processes and average handling times. The integration will also provide managers with critical insights into service trends, enabling better decision-making around training and operational improvements.

Unified Routing for Seamless Interactions
3CLogic’s intelligent, channel-agnostic interaction manager will enhance ServiceNow’s routing capabilities by helping ensure that all customer inquiries—whether digital or voice—are routed to the right agent based on ServiceNow context and date. The universal routing solution will help reduce the effort of maintaining duplicate routing rules and agent skills, resulting in fewer misdirected cases, enabling faster response times, and allowing users to lower costs while improving both agent productivity and customer satisfaction.

“Thanks to the integration of 3CLogic and ServiceNow, our caller identification and authorization process is now significantly faster, saving valuable time on every call compared to our previous system. This streamlined approach not only accelerates the call initiation process but also significantly enhances the overall customer experience and operational efficiency,” said Kurt Mosley, VP of Service Support at Flexential. “We are excited about the continued growth of the 3CLogic and ServiceNow partnership and look forward to further integrations that will drive business success, boost productivity for our teams, and strengthen long-term customer loyalty.”

Streamlining Operations and Driving Business Impact
The new AI-powered solution allows for improved agent performance and substantial cost savings by automating processes and optimizing workflows. Businesses can improve first contact resolution rates, reduce customer effort, and resolve cases faster—all key drivers of customer satisfaction. The various enhancements are expected to roll out throughout the year starting this spring.

3CLogic is a ServiceNow certified Technology and Advanced Platform Build partner with offerings available for ServiceNow’s IT Service Management, CRM and Industry Workflows, and HR Service Delivery solutions. The organization will be unveiling its latest set of capabilities at ServiceNow’s annual Knowledge 2025 event this May in Las Vegas. 

For more information, visit 3CLogic.com.

About 3CLogic
3CLogic transforms customer and employee experiences with its patented and award-winning AI-powered cloud contact center solutions purpose-built to enhance today’s leading CRM and Customer Service Management platforms. Globally available and leveraged by the world’s leading brands, its offerings empower enterprise organizations with innovative capabilities, such as intelligent self-service, Generative AI, Conversational AI, agent automation & coaching, and AI-powered sentiment analytics — all designed to lower operational costs, maximize ROI, and deliver better, faster, and more personalized interactions for IT, employee, and customer service. For more information, please visit www.3clogic.com.

About ServiceNow
ServiceNow, the ServiceNow logo, Now, Now Platform, and other ServiceNow marks are trademarks and/or registered trademarks of ServiceNow, Inc. in the United States and/or other countries.

This release contains “forward‑looking statements” regarding our future plans and performance. Forward‑looking statements are subject to known and unknown risks and uncertainties and are based on potentially inaccurate assumptions that could cause actual results to differ materially from those expected or implied by the forward‑looking statements. If any such risks or uncertainties materialize or if any of the assumptions prove incorrect, our results could differ materially from the results expressed or implied by the forward‑looking statements we make.

Factors that may cause actual results to differ materially from those in any forward‑looking statements include: (i) delays and unexpected difficulties and expenses in executing the partnership or delivering the product capabilities and offerings, (ii) changes in the regulatory landscape related to AI and (iii) uncertainty as to whether sales will justify the investments in the product capabilities and offerings. Further information on factors that could affect ServiceNow’s financial and other results is included in the filings ServiceNow makes with the Securities and Exchange Commission from time to time.

We undertake no obligation, and do not intend, to update these forward‑looking statements.

This new AI-native feature transforms test orchestration, making test setup effortless, intelligent, and exceptionally faster.

NOIDA, India and SAN FRANCISCO, April 14, 2025 /PRNewswire/ — LambdaTest, a unified agentic AI and cloud engineering platform, today announced the launch of the HyperExecute MCP Server, a cutting-edge enhancement to its AI-native test orchestration platform, HyperExecute. This new update introduces the Model Context Protocol (MCP), significantly streamlining automated testing workflows and reducing setup time from hours or weeks to mere minutes.

By integrating MCP, HyperExecute enables AI models to interact autonomously with digital tools, enhancing the speed, efficiency, and simplicity of automated test configurations. Developers and QA teams can automatically analyze project structures, generate precise test commands, and create customized YAML configurations without manual effort.

HyperExecute MCP Server further enhances productivity through real-time insights into test executions and effective management of testing workflows, facilitating seamless continuous integration and delivery. To ease onboarding, LambdaTest also integrated Agentic RAG inside the HyperExecute MCP server. If the user needs help at any point, they could just ask the agent which would fetch answers from the HyperExecute docs directly.

“HyperExecute MCP Server represents a significant leap forward for the quality engineering industry,” said Asad Khan, CEO and Co-Founder of LambdaTest. “We’re not only enhancing the speed and accuracy of testing but also fundamentally simplifying workflows so developers can focus more on innovation and less on setup complexities. Our MCP Server isn’t just another testing tool; it’s a paradigm shift. By automating complex configurations through intelligent AI interactions, we’re redefining what’s possible in test automation—making it faster, smarter, and universally accessible,” he added.

With this launch, LambdaTest continues its commitment to simplifying software testing, improving collaboration, and ensuring superior product quality from development through release. HyperExecute is already redefining test automation by executing tests up to 70% faster than traditional grids, and now, with HyperExecute MCP servers, LambdaTest aims to amplify the Developer Experience and Testing efficiency to the next scale.

To experience the benefits of HyperExecute MCP Server, visit: http://lambdatest.com/hyperexecute-mcp-server

About LambdaTest

LambdaTest is an AI-native, omnichannel software quality platform that empowers businesses to accelerate time to market through intelligent, cloud-based test authoring, orchestration, and execution. With over 15,000 customers and 2.3 million+ users across 130+ countries, LambdaTest is the trusted choice for modern software testing.

• Browser & App Testing Cloud: Enables manual and automated testing of web and mobile apps across 10,000+ browsers, real devices, and OS environments, ensuring cross-platform consistency.
• HyperExecute: An AI-native test execution and orchestration cloud that runs tests up to 70% faster than traditional grids, offering smart test distribution, automatic retries, real-time logs, and seamless CI/CD integration.
• KaneAI: The world’s first GenAI-native testing agent, leveraging LLMs for effortless test creation, intelligent automation, and self-evolving test execution. It integrates directly with Jira, Slack, GitHub, and other DevOps tools.

For more information, please visit  https://lambdatest.com

MILPITAS, Calif., April 14, 2025 /PRNewswire/ — Electronic System Design (ESD) industry revenue increased 11% to $4,927.3 million in the fourth quarter of 2024 from the $4440.9 million reported in the fourth quarter of 2023, the ESD Alliance, a SEMI Technology Community, announced today in its latest Electronic Design Market Data (EDMD) report. The four-quarter moving average, which compares the most recent four quarters to the prior four, rose 12.8%.  

“The electronic design automation (EDA) industry reported substantial revenue growth in Q4 2024,” said Walden C. Rhines, Executive Sponsor of the SEMI Electronic Design Market Data report. “All product categories increased significantly, with all categories except Semiconductor Intellectual Property posting double-digit growth. Regionally, the Americas, along with Japan and Asia Pacific, reported double digit growth. The four-quarter moving average increased for all product categories and regions.”

The companies tracked in the EDMD report employed 61,827 people globally in Q4 2024, a 2.9% increase over the Q4 2023 headcount of 60,106, but down 0.9% compared to Q3 2024.

The quarterly EDMD report contains detailed revenue information within the following category and geographic breakdowns.

Revenue by Product and Application Category – Q4 2024 Year-Over-Year Change

• Computer-Aided Engineering (CAE) revenue rose 10.9% to $1,696.9 million in Q4 2024. The four-quarter CAE moving average increased 12.3%.
• Integrated Circuit (IC) Physical Design and Verification revenue increased 15.4% to $797.9 million. The four-quarter moving average for the category increased 8.1%.
• Printed Circuit Board (PCB) and Multi-Chip Module (MCM) revenue jumped 15.9% to $476.2 million. The four-quarter moving average for PCB and MCM rose 8.3%.
• Semiconductor Intellectual Property (SIP) revenue increased 7.9% to $1,760.7 million. The four-quarter SIP moving average rose 15.7%.
• Services revenue rose 11% to $195.6 million. The four-quarter Services moving average rose 26.2%.

Revenue by Region – Q4 2024 Year-Over-Year Change

• The Americas, the largest reporting region by revenue, procured $2,171.8 million of electronic system design products and services in Q4 2024, a 12.9% increase. The four-quarter moving average for the Americas rose 17.1%.
• Europe, Middle East, and Africa (EMEA) procured $622.3 million of electronic system design products and services, a 2.3% increase. The four-quarter moving average for EMEA grew 10.6%.
• Japan’s procurement of electronic system design products and services increased 21.7% to $318.4 million. The four-quarter moving average for Japan increased 10.8%.
• Asia Pacific (APAC) procured $1,814.8 million of electronic system design products and services, a 10.2% increase. The four-quarter moving average for APAC grew 9.3%.

About the EDMD Report
The ESD Alliance Electronic Design Market Data report presents Electronic Design Automation (EDA), SIP and Services industry revenue data quarterly. Both public and private companies contribute data to the report available from SEMI. Each quarterly report is published approximately three months after quarter close. EDMD report data is segmented as follows:

• Revenue by product category (CAE, IC Physical Design and Verification, SIP, PCB/MCM Layout, and Services) including numerous detailed sub-categories
• Revenue by geographic region (Americas, EMEA, Japan and APAC)
• Total employment at participating companies

For information about SEMI market research reports, visit the SEMI Market Research Reports and Databases Catalog.

About the Electronic System Design Alliance
The ESD Alliance, a SEMI Technology Community, offers initiatives and activities that bring value to our entire industry including:

• Coordinating and amplifying the collective and regional voices of the industry.
• Continually promoting the value the industry delivers to the global semiconductor and electronics industry.
• Addressing and defending threats and reducing risks to the industry.
• Achieving efficiencies for the industry.
• Marketing the attractiveness of the design ecosystem as an ideal industry for pursuing a career.
• Enabling networking, sharing and collaboration across the industry.

Contact Paul Cohen at pcohen@semi.org or Bob Smith at bsmith@semi.org for more details.

Engage with the ESD Alliance
www.esd-alliance.org
X: @ESDAlliance
LinkedIn
Facebook

About SEMI
SEMI^® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON^® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.

The information supplied by the ESD Alliance is believed to be accurate and reliable, but the ESD Alliance assumes no responsibility for any errors that may appear in this document. All trademarks and registered trademarks are the property of their respective owners.

Association Contacts

Paul Cohen
Phone: 508-769-2106
Email: pcohen@semi.org

Jack Taylor
Phone: 512-560-7143
Email: jack.taylor@siemens.com

CHICAGO, April 14, 2025 /PRNewswire/ — International audio brand Fosi Audio made a high-profile appearance at AXPONA 2025 in Chicago from April 11 to 13, unveiling its upgraded brand strategy and a series of next-generation HiFi products under the theme “Building an Inclusive HiFi Ecosystem for Audiophiles Worldwide.” This marks the brand’s official debut of its all-new HiFi audio ecosystem, featuring multiple upcoming releases including the highly anticipated SP601 passive bookshelf speakers and i5 planar magnetic headphones.

Brand Revamp: Making HiFi Accessible Through Innovation

At AXPONA 2025, Fosi Audio announced its new brand vision — “A New Audio Tech Brand Bringing HiFi Joy to Audiophiles Worldwide” — and reaffirmed its mission of “Redefining HiFi with Unmatched Value.” With a strong focus on user-centric innovation, the company is committed to lowering the barrier to high-fidelity audio and making superior sound accessible to more people.

Fosi Audio’s core philosophy is encapsulated in its name — FOSI, representing four core values:

• Foresight – Visionary thinking and proactive solutions for the future
• Openness – Co-creating with audiophiles by listening to users
• Sincerity – Always putting users first with a commitment to quality
• Innovation – Breaking technological boundaries to exceed expectations

The company also introduced its new brand slogan — “HEAR THE UNHEARD” — a bold statement that reflects Fosi Audio’s relentless pursuit of audio performance and fidelity, while underscoring its core belief: user needs drive innovation.

A Complete HiFi Chain: Showcasing the Future of Home Audio

Driven by deep user insights, Fosi Audio recognizes that today’s audio enthusiasts seek more than just standalone products — they want fully integrated, high-quality HiFi solutions. At AXPONA, the brand showcased a full-system lineup including upcoming source devices like the Luna 3 turntable and Merak CD player, the ZP3 preamp, E30 cinema-grade DAC amplifier, passive speakers, subwoofers, and over-ear headphones. This all-in-one HiFi ecosystem delivers a seamless audio experience from source to sound output. Visitors were impressed by the products’ premium design, intuitive usability, and stunning sonic performance — echoing the sentiment that “the future of HiFi has arrived.”

Flagship Product Highlights: SP601 & i5 Planar Headphones

SP601 Passive Bookshelf Speakers

Equipped with a 6.5-inch paper-aluminum composite woofer, a 1.5-inch silk dome tweeter, and a rear-firing bass reflex port, the SP601 delivers warm and natural highs, clean mids, and tight, punchy lows. Its lightweight diaphragm ensures rapid transient response and expansive soundstage, making it an ideal choice for both music listening and home theater setups.

i5 Planar Magnetic Headphones

Featuring a 97mm ultra-thin nano diaphragm driver, the i5 adopts industry-first sputtering technology and an acoustically optimized damping back cavity design. These innovations reduce resonance and enhance transients, resulting in a clear and natural sound signature. The headphone also features breathable ear cushions, a memory metal headband, and seamless silicone adjustment for long-term comfort — ideal for both casual listening and professional monitoring.

The i5 will officially launch on Kickstarter on April 22, with the prelaunch page now available for early preview: https://www.kickstarter.com/projects/fosiaudio/fosi-audio-i5-planar-magnetic-headphones?ref=1xmv3u. 

About Fosi Audio

Fosi Audio is committed to delivering high-value, high-performance audio solutions by focusing on user needs and continuous innovation. Through years of product development and global co-creation with the audiophile community, Fosi Audio has earned acclaim from music lovers, reviewers, and media outlets such as Wirecutter, Digital Trends, Trusted Reviews, Headfonia, as well as platforms like Audio Science Review and Head-Fi.

Founder Ryan Huang states:

“Our vision is to become a global leader in audio innovation. Fosi Audio will continue to push the boundaries of audio technology based on user feedback, making HiFi not a luxury for the few, but an art of sound that can be enjoyed by audiophiles and music lovers around the world.”

For More Information, Please Visit:

• Official Website: https://www.fosiaudio.com/
• Official Facebook Community: https://www.facebook.com/fosiaudioglobal
• Official YouTube Channel: https://www.youtube.com/@fosiaudio

PR Contact:
Email: marketing@fosiaudio.com 

TAIPEI, April 14, 2025 /PRNewswire/ — As industrial systems become more interconnected and data-driven, the need for connectivity solutions that offer superior performance, scalability, and flexibility is growing rapidly. Cervoz, a leading provider of industrial embedded modules, is meeting this demand with an expanding portfolio of innovative, real-world expansion solutions.

Seamless Expansion for Future-Ready Performance

Picture a smart logistics hub handling tens of thousands of packages a day, where Autonomous Mobile Robots (AMRs) operates across vast spaces. In such environments, traditional RJ45 connections may initially suffice—but as operation expand and AMRs navigate distances beyond 100 meters, connectivity becomes prone to signal degradation and industrial interference.

Cervoz addresses this challenge with its new series of Ethernet modules featuring Small Form-factor Pluggable (SFP) technology. The modular SFP design acts as a versatile, plug-and-play transceiver, enabling seamless conversion between electrical and optical signals and providing the flexibility to switch effortlessly between copper and fiber optic connections. Unlike conventional RJ45 connectors, which are limited to short-range communication, SFP-based solutions can transmit data over several kilometers, ensuring reliable connection through long-distance.

Cervoz’s M.2 SFP Ethernet expansion modules offer a practical upgrade path for such demanding applications. These new solutions feature a compact M.2 form factor and a PCIe interface supporting up to 5.0 GT/s (Gen 2). Available with one (2001-SFP) or two (2002-SFP) SFP ports, they support 1Gbps Ethernet over single-or-multi-mode fiber optics. Powered by the Intel I210 Gigabit Ethernet Controller and comply with IEEE 802.3x and 802.3z standards. Additional features such as Wake-on-LAN, hot-swap capability, and the optional MECFIX mounting system provide enhanced flexibility and ease of integration in diverse environments. This makes them ideal for large-scale automated environments such as logistics centers, smart factories, transportation hubs, and energy management facilities, where long-range and interference-free communication is critical for efficient operations.

Versatile Networking Expansions for Diverse Industrial Needs

For demanding, bandwidth-intensive applications like Automated Optical Inspection (AOI) in precision manufacturing, Cervoz delivers Ethernet expansion modules supporting up to 10GbE throughput. Engineered for real-time, high-resolution data transmission, these solutions ensure optimal performance in environments where accuracy, speed, and reliability are paramount.

To accommodate space-limited environments, the company provides compact connectivity solutions. These include 2.5GbE M.2 2230 (A+E key) LAN card that make use of idle Wi-Fi/Bluetooth slots, and compact low-profile LAN cards with multiple isolated 1GbE ports—occupying less than half the footprint of standard cards. A 2.5GbE variant of the compact low-profile model is also coming soon.

In addition to wired options, robust wireless connectivity is available through Wi-Fi expansion modules ranging from legacy Wi-Fi 1 to Wi-Fi 6E, in both mini PCIe and M.2 form factors. These solutions ensure strong, flexible wireless performance for embedded systems and industrial PCs alike.

Future-Ready Networking for Industrial Innovation

By addressing current and future networking needs, Cervoz stands as a trusted partner in next-gen industrial connectivity. Its flexible, compact, high-performance solutions help businesses stay competitive and future-ready. To learn more, visit the Cervoz website or contact us.